Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al: Difference between revisions

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== '''Thermal evaporation of Aluminium''' ==
== '''Thermal evaporation of Aluminum''' ==


 
Aluminum can be thermally evaporated in [[Specific Process Knowledge/Thin_film_deposition/Wordentec|Wordentec]]. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure.
Aluminium can be thermally evaporated in [[Specific Process Knowledge/Thin_film_deposition/Wordentec|Wordentec]] . At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure.
For deposition onto the unexposed e-beam resist, you need to use the thermal source.
For deposition onto the unexposed e-beam resist, you need to use the thermal source.


===Recipe===
Use '''process 9''' in Wordentec to deposit thermal Aluminum.


Set-up
''Observe: you need to be specially trained to use the thermal deposition source.''
''Observe: you need to be specially trained to use the thermal deposition source.''




=====Set up=====


Program settings


=====Program settings=====


The settings saved in the material file for thermal aluminum are these:
Soak power 1: 5%
Soak power 2: 7%
These are already saved in the process.


There is a general page concerning different methods of depositing [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]] at Danchip.
There is a general page concerning different methods of depositing [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]] at Danchip.

Revision as of 11:09, 16 October 2014


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Thermal evaporation of Aluminum

Aluminum can be thermally evaporated in Wordentec. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.

Recipe

Use process 9 in Wordentec to deposit thermal Aluminum.

Observe: you need to be specially trained to use the thermal deposition source.


Set up
Program settings

The settings saved in the material file for thermal aluminum are these: Soak power 1: 5% Soak power 2: 7% These are already saved in the process.

There is a general page concerning different methods of depositing Aluminium at Danchip.

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