Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
No edit summary
No edit summary
Line 12: Line 12:
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Hummer_Sputter_coater|Hummer]]   
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Hummer_Sputter_coater|Hummer]]   
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Balzer_Sputter_coater|Balzer]]
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Balzer_Sputter_coater|Balzer]]


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
Line 20: Line 22:
| E-beam deposition of Au
| E-beam deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| E-beam deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
Line 28: Line 31:
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|
|
|
|
|
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
Line 35: Line 41:
|10 Å to 5000Å*
|10 Å to 5000Å*
|10 Å to
|10 Å to
|10Å to about 3000Å
|
|
|
|
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
Line 43: Line 51:
|1 Å/s to 10 Å/s
|1 Å/s to 10 Å/s
|
|
|From 5 Å/s up to 10Å/s
|Not measured
|Not measured
|Not measured
|Not measured
|-
|-


Line 60: Line 70:
*1x4" wafer or
*1x4" wafer or
*1x6" wafer
*1x6" wafer
|
*1x 2" wafer or
*1x 4" wafers or
*Several smaller pieces
|
|
*1x4" wafer
*1x4" wafer
Line 66: Line 80:
*1 large sample (< 4" wafer)
*1 large sample (< 4" wafer)
*Several smaller samples
*Several smaller samples
|-
|-


Line 98: Line 113:
* Metals  
* Metals  
* Carbon
* Carbon
|
* III-V materials
* Silicon wafers
* Quartz wafers
* Pyrex wafers
|.
|.
|.
|.


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
Line 110: Line 131:
* An adhesion layer (of Cr or Ti) is recommended under Au.
* An adhesion layer (of Cr or Ti) is recommended under Au.
|
|
|
|Used to gold sputter coating of   
|Used to gold sputter coating of   
samples mainly before SEM characterization  
samples mainly before SEM characterization  
|Used to gold sputter coating of  
|Used to gold sputter coating of  
samples mainly before SEM characterization
samples mainly before SEM characterization
|-
|-
|}
|}

Revision as of 10:14, 12 September 2014

4th Level - Comparison

Feedback to this page: click here

Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter (Lesker) E-beam evaporation (Physimeca) Sputter coater Hummer Sputter coater Balzer


General description E-beam deposition of Au E-beam deposition of Au Sputter deposition of Au E-beam deposition of Au Sputter deposition of Au Sputter deposition of Au
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10 Å to 5000Å* 10 Å to 5000Å* 10 Å to 10Å to about 3000Å
Deposition rate 2 Å/s to 10 Å/s 1 Å/s to 10 Å/s From 5 Å/s up to 10Å/s Not measured Not measured
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • Pieces or
  • 1x4" wafer or
  • 1x6" wafer
  • 1x 2" wafer or
  • 1x 4" wafers or
  • Several smaller pieces
  • 1x4" wafer
  • Several smaller samples
  • 1 large sample (< 4" wafer)
  • Several smaller samples
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Carbon
  • III-V materials
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
 . .


Comment
  • For thicknesses above 200 nm permission is required
  • An adhesion layer (of Cr or Ti) is recommended under Au.
  • For thicknesses above 200 nm permission is required
  • An adhesion layer (of Cr or Ti) is recommended under Au.
 Used to gold sputter coating of

samples mainly before SEM characterization

Used to gold sputter coating of

samples mainly before SEM characterization


* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

Adhesion of Au on Si

Adhesion of Au layers


Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold&oldid=16121"