Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
The section below here is under construction
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|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Oxide growth]] | |[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Oxide growth]] | ||
| | |Furnaces | ||
| | |SiO2 | ||
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|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | |[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | ||
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|Sputter deposition | |Sputter deposition | ||
| | |Si,SiO2,Si3N3,TiO2, metals | ||
|- | |- | ||
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|Thermal | |Thermal evaporation | ||
| | |Al, ? | ||
|- | |- | ||
| | | | ||
|E-beam evaporation | |E-beam evaporation | ||
| | |Metals | ||
|- | |- | ||
| | | | ||
|LPCVD | |LPCVD | ||
| | |Si3N4, SRN, SiO2, Si (poly and amorph) | ||
|- | |- | ||
| | | | ||
|PECVD | |PECVD | ||
| | |Si3N4, SiO2, PBSG | ||
|- | |- | ||
| | | | ||
|Electroplating | |Electroplating | ||
| | |Ni | ||
|- | |- | ||
|[[Specific Process Knowledge/Lithography/Coaters|Coating]] | |[[Specific Process Knowledge/Lithography/Coaters|Coating]] | ||
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|Spin coating | |Spin coating | ||
| | |resists, polymers | ||
|- | |- | ||
| | | | ||
|Spray coating | |Spray coating | ||
| | |resists, polymers | ||
|- | |- | ||
|Epitaxial growth | |Epitaxial growth | ||
| | |MOCVD | ||
| | |? | ||
|- | |- | ||
|} | |} | ||
Revision as of 14:10, 12 June 2014
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Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing
Clean the sample 
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Drying Samples 
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Make a layer on the sample or Film Formation 
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| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
Thermal treatment of the sample 
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Make a mask on the sample 
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| Lithography |
| Imprinting |
| Transfer pattern into the sample |
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| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |
Overview of sample processing 2
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Overview of sample processing 3
| Clean your sample |
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| Drying your Samples |
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| Create a layer/film on your sample | ||
|---|---|---|
| Entry page in LabAdviser | Techniques | Materials |
| Thermal Oxide growth | Furnaces | SiO2 |
| Thin film deposition | ||
| Sputter deposition | Si,SiO2,Si3N3,TiO2, metals | |
| Thermal evaporation | Al, ? | |
| E-beam evaporation | Metals | |
| LPCVD | Si3N4, SRN, SiO2, Si (poly and amorph) | |
| PECVD | Si3N4, SiO2, PBSG | |
| Electroplating | Ni | |
| Coating | ||
| Spin coating | resists, polymers | |
| Spray coating | resists, polymers | |
| Epitaxial growth | MOCVD | ? |
| Thermal treatment of your sample |
|---|
| Make a mask on your sample |
|---|
| Lithography |
| Imprinting |
| Transfer mask pattern to your sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition on your sample |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding your samples together |
|---|
| Characterize your sample |
|---|
| Back end processing of your sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |