Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
The section below here is under construction
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Make a layer on the sample [[File:Making a layer 1.jpg|40px]] | ! Make a layer on the sample or Film Formation [[File:Making a layer 1.jpg|40px]] ! | ||
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|Thermal Oxide growth | |Thermal Oxide growth |
Revision as of 08:50, 12 June 2014
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Choose the process topic you are interested in
The section below here is under construction ![Section under construction.jpg](/images/thumb/9/9a/Section_under_construction.jpg/70px-Section_under_construction.jpg)
Overview of sample processing
Clean the sample ![]() |
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Drying Samples ![]() |
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Thermal treatment of the sample ![]() |
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Make a mask on the sample ![]() |
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Lithography |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |