Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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4th Level - Comparison
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | ||
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! | ! General description | ||
| | | E-beam deposition of Au | ||
| E-beam deposition of Au | |||
| Sputter deposition of Au | |||
| | | Sputter deposition of Au | ||
| Sputter deposition of Au | |||
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! Deposition rate | ! Deposition rate | ||
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|Not measured | |Not measured | ||
|Not measured | |Not measured | ||
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! Batch size | |||
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*Up to 1x4" wafers | |||
*smaller pieces | |||
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*24x2" wafers or | |||
*6x4" wafers or | |||
*6x6" wafers | |||
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*Pieces or | |||
*1x4" wafer or | |||
*1x6" wafer | |||
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*1x4" wafer | |||
*Several smaller samples | |||
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*1 large sample (< 4" wafer) | |||
*Several smaller samples | |||
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!Allowed materials | !Allowed materials | ||
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! Comment | ! Comment | ||
|For thicknesses above 200 nm | |For thicknesses above 200 nm | ||
Revision as of 10:24, 26 March 2014
Feedback to this page: click here
Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | Sputter coater Hummer | Sputter coater Balzer | |
|---|---|---|---|---|---|
| General description | E-beam deposition of Au | E-beam deposition of Au | Sputter deposition of Au | Sputter deposition of Au | Sputter deposition of Au |
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
| Layer thickness | 10 Å to 5000Å* | 10 Å to 5000Å* | 10 Å to | ||
| Deposition rate | 2 Å/s to 10 Å/s | 1 Å/s to 10 Å/s | Not measured | Not measured | |
| Batch size |
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| Allowed materials |
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. | . |
| Comment | For thicknesses above 200 nm
permission is required |
For thicknesses above 200 nm
permission is required |
Used to gold sputter coating of
samples mainly before SEM characterization |
Used to gold sputter coating of
samples mainly before SEM characterization |
* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings