Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
No edit summary
No edit summary
Line 15: Line 15:


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
| Batch size
! Batch size
|
|
*Up to 1x4" wafers
*Up to 1x4" wafers
Line 33: Line 33:
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
| Pre-clean
! Pre-clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
Line 40: Line 40:
|
|
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
| Layer thickness
! Layer thickness
|10 Å to 5000Å*  
|10 Å to 5000Å*  
|10 Å to 5000Å*
|10 Å to 5000Å*
Line 47: Line 47:
|
|
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
| Deposition rate
! Deposition rate
|2 Å/s to 10 Å/s
|2 Å/s to 10 Å/s
|1 Å/s to 10 Å/s
|1 Å/s to 10 Å/s
Line 55: Line 55:


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
| Comment
! Comment
|For thicknesses above 200 nm
|For thicknesses above 200 nm
permission is required
permission is required

Revision as of 17:02, 6 March 2014

4th Level - Comparison

Feedback to this page: click here

Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter (Lesker) Sputter coater Hummer Sputter coater Balzer
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • up to 1x6" wafer
  • 1x4" wafer
  • Several smaller samples
  • 1 large sample (< 4" wafer)
  • Several smaller samples
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10 Å to 5000Å* 10 Å to 5000Å* 10 Å to
Deposition rate 2 Å/s to 10 Å/s 1 Å/s to 10 Å/s Not measured Not measured
Comment For thicknesses above 200 nm

permission is required

For thicknesses above 200 nm

permission is required

Used to gold sputter coating of

samples mainly before SEM characterization

Used to gold sputter coating of

samples mainly before SEM characterization


* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

Adhesion of Au on Si

Adhesion of Au layers


Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings