Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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<center><span style="background:#87CEEB">4th Level - Comparison</span></center>
<center><span style="background:#87CEEB">4th Level - Comparison</span></center>
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


 
{| border="1" cellspacing="0" cellpadding="4"
{| border="1" cellspacing="0" cellpadding="6"  
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter (Lesker)
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter coater Hummer
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater|Hummer]]
! Sputter coater Balzer
! Sputter coater Balzer
|-  
 
|-style="background:WhiteSmoke; color:black"
| Batch size
| Batch size
|
|
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*Several smaller samples
*Several smaller samples
|-
|-
|-style="background:LightGrey; color:black"
| Pre-clean
| Pre-clean
|RF Ar clean
|RF Ar clean
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|
|
|
|
|-
|-style="background:WhiteSmoke; color:black"
| Layer thickness
| Layer thickness
|10 Å to 5000Å*  
|10 Å to 5000Å*  
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|
|
|
|
|-
|-style="background:LightGrey; color:black"
| Deposition rate
| Deposition rate
|2 Å/s to 15 Å/s
|2 Å/s to 15 Å/s

Revision as of 12:22, 5 March 2014

4th Level - Comparison

Feedback to this page: click here

Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter (Lesker) Sputter coater Hummer Sputter coater Balzer
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • up to 1x6" wafer
  • 1x4" wafer
  • Several smaller samples
  • 1 large sample (< 4" wafer)
  • Several smaller samples
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10 Å to 5000Å* 10 Å to 5000Å* 10 Å to
Deposition rate 2 Å/s to 15 Å/s 1 Å/s to 15 Å/s Not measured Not measured

* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

Adhesion of Au on Si

Adhesion of Au layers


Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings

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