Specific Process Knowledge/Wafer cleaning: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
No edit summary
No edit summary
Line 8: Line 8:
*[[/IMEC|IMEC]] - ''Cleaning before fusion bonding''
*[[/IMEC|IMEC]] - ''Cleaning before fusion bonding''
*[[/Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''
*[[/Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''
== [[Image:section under construction.jpg|70px]] Section under construction ==
==Comparison of Wafer Cleaning Methods==
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
|-
|-
|-style="background:silver; color:black"
!
![[Specific Process Knowledge/Wafer cleaning/RCA|RCA]]
![[Specific Process Knowledge/Wafer cleaning/7-up & Piranha|7-up & Piranha]]
![[Specific Process Knowledge/Wafer cleaning/cleaning with HF|5% HF]]
![[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]]
![[Specific Process Knowledge/Wafer cleaning/Cleaning with Soap Sonic|Soap Sonic]]
|-
|-
|-style="background:WhiteSmoke; color:black"
!Generel description
|Two step process to remove organics and metals
|Removes organics and alkali ions
|Removing native oxide
|Cleaning before wafer bonding
|Cleaning of "dirty" wafers when entering the cleanroom
|-
|-
|-style="background:LightGrey; color:black"
!Purpose
|Mandatory prior furnace processes
|When needed
|Together with RCA cleaning
|Prior to wafer bonding
|Cleaning very dirty items
|-
|-
|-style="background:WhiteSmoke; color:black"
!Substrate size
|
*<nowiki>#</nowiki>1-25 2", 4" and 6" wafers
|
*<nowiki>#</nowiki>1-25 2", 4" and 6" wafers
|
*<nowiki>#</nowiki>1-25 2", 4" and 6" wafers
|
*<nowiki>#</nowiki>1-25 2" and 4" wafers
|
*All sizes that can go into the bath
|-
|-
|-style="background:LightGrey; color:black"
!Allowed materials
|
*Silicon
*Poly Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Quartz/fused silica
|
*Silicon
*Poly Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Quartz/fused silica
*Pyrex and wafers with Cr ONLY in Mask cleaning bath or beaker
|
*Silicon
*Poly Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxy-nitride
*Quartz/fused silica
*Resists (depending on bath)
*Pyrex (depending on bath)
|
*Silicon
*Poly Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Quartz/fused silica
*Pyrex
|
*All materials
|-
|}

Revision as of 11:21, 3 March 2014

Feedback to this page: click here

Clean with:

  • RCA - Two step process to remove organics and metals
  • 7-up & Piranha - Removes organics and alkali ions
  • 5% HF - Removing native oxide
  • IMEC - Cleaning before fusion bonding
  • Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom


Section under construction.jpg Section under construction

Comparison of Wafer Cleaning Methods

RCA 7-up & Piranha 5% HF IMEC Soap Sonic
Generel description Two step process to remove organics and metals Removes organics and alkali ions Removing native oxide Cleaning before wafer bonding Cleaning of "dirty" wafers when entering the cleanroom
Purpose Mandatory prior furnace processes When needed Together with RCA cleaning Prior to wafer bonding Cleaning very dirty items
Substrate size
  • #1-25 2", 4" and 6" wafers
  • #1-25 2", 4" and 6" wafers
  • #1-25 2", 4" and 6" wafers
  • #1-25 2" and 4" wafers
  • All sizes that can go into the bath
Allowed materials
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex and wafers with Cr ONLY in Mask cleaning bath or beaker
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxy-nitride
  • Quartz/fused silica
  • Resists (depending on bath)
  • Pyrex (depending on bath)
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex
  • All materials