Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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4th Level - Comparison
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{| border="1" cellspacing="0" cellpadding=" | {| border="1" cellspacing="0" cellpadding="6" | ||
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter (Lesker) | ! Sputter (Lesker) | ||
! Sputter coater Hummer | |||
! Sputter coater Balzer | |||
|- | |- | ||
| Batch size | | Batch size | ||
Revision as of 16:00, 13 February 2014
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | Sputter coater Hummer | Sputter coater Balzer | |
|---|---|---|---|---|---|
| Batch size |
|
|
| ||
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
| Layer thickness | 10 Å to 5000Å | 10 Å to 5000Å | 10 Å to | ||
| Deposition rate | 2 Å/s to 15 Å/s | 1 Å/s to 15 Å/s |
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings