Specific Process Knowledge/Back-end processing: Difference between revisions

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are uasually carried out outside the clean room.


== Choose an equipment ==
== Choose an equipment ==
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**[[/Disco Saw|Disco Saw]]
**[[/Disco Saw|Disco Saw]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]]  
*Molding
*Molding
**[[/Polymer Injection Molder|Polymer Injection Molder]]
**[[/Polymer Injection Molder|Polymer Injection Molder]]

Revision as of 10:55, 5 September 2013

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. These processes are uasually carried out outside the clean room.

Choose an equipment