Specific Process Knowledge/Thin film deposition/Deposition of Silver/Sputter Ag in Wordentec: Revision history

13 June 2023

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11 September 2022

• curprev 17:1217:12, 11 September 2022‎ Eves talk contribs‎ 763 bytes +2‎ →‎Sputtering of Ag in the Wordentec

19 March 2020

• curprev 13:3713:37, 19 March 2020‎ Reet talk contribs‎ 761 bytes +79‎ →‎Sputtering of Ag in the Wordentec
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21 February 2020

• curprev 13:3213:32, 21 February 2020‎ Reet talk contribs‎ m 399 bytes 0‎ →‎Deposition rate

16 January 2017

• curprev 14:2714:27, 16 January 2017‎ Mdyma talk contribs‎ 399 bytes +1‎ →‎Deposition rate

10 April 2014

• curprev 12:5812:58, 10 April 2014‎ Knil talk contribs‎ 398 bytes +36‎ →‎Deposition rate
• curprev 10:2810:28, 10 April 2014‎ Knil talk contribs‎ 362 bytes +362‎ Created page with "== Deposition rate == Depending on the settings (pressure and effect) during the sputtering process, the uniformity and grain size of the deposited layer will be different. ..."