Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using AOE/Standard recipe with resist mask/AOE SiO2 etch load dependency: Revision history

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curprev 17:4717:47, 1 February 2023‎ Bghe talk contribs‎ 2,793 bytes +2‎ No edit summary
curprev 17:4617:46, 1 February 2023‎ Bghe talk contribs‎ 2,791 bytes −81‎ No edit summary

curprev 13:5013:50, 20 January 2020‎ Bghe talk contribs‎ 2,701 bytes 0‎ No edit summary

curprev 08:2208:22, 26 June 2019‎ Bghe talk contribs‎ 2,701 bytes +37‎ →‎Etch load effect of SiO2 etch with etch recipe SiO2_res and with photoresist as masking material
curprev 08:2108:21, 26 June 2019‎ Bghe talk contribs‎ 2,664 bytes 0‎ →‎Etch load effect of SiO2 etch with etch recipe m_res_ny and with photoresist as masking material

curprev 15:5315:53, 25 January 2019‎ Bghe talk contribs‎ 2,664 bytes −7‎ →‎Etch load effect of SiO2 etch with etch recipe m_res_ny and with photoresist as masking material

curprev 08:4408:44, 25 November 2015‎ Bghe talk contribs‎ 2,671 bytes +37‎ No edit summary

curprev 12:4812:48, 19 November 2015‎ Bghe talk contribs‎ 2,634 bytes +2,634‎ Created page with "'''Feedback to this page''': '''[mailto:plasma@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Et..."

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