Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using AOE/Slow etch with resist mask: Revision history

3 February 2023

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31 January 2023

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• curprev 17:0017:00, 31 January 2023‎ Bghe talk contribs‎ 4,126 bytes +1‎ →‎Slow etch of SiO2 with resist as masking material - to be used with 150mm Si carrier wafer

6 September 2022

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25 November 2019

• curprev 22:4422:44, 25 November 2019‎ Jmli talk contribs‎ 4,124 bytes 0‎ →‎Slow etch of SiO2 with resist as masking material - to be used with 150mm Si carrier wafer
• curprev 22:4322:43, 25 November 2019‎ Jmli talk contribs‎ 4,124 bytes +1‎ No edit summary

25 January 2019

• curprev 15:5615:56, 25 January 2019‎ Bghe talk contribs‎ 4,123 bytes +1‎ →‎Slow etch of SiO2 with resist as masking material - to be used with 150mm Si carrier wafer

25 November 2015

• curprev 08:5508:55, 25 November 2015‎ Bghe talk contribs‎ 4,122 bytes −2‎ →‎Slow etch of SiO2 with resist as masking material - to be used with 150mm Si carrier wafer
• curprev 08:5508:55, 25 November 2015‎ Bghe talk contribs‎ 4,124 bytes −2‎ →‎Slow etch of SiO2 with resist as masking material - with direct clamping
• curprev 08:5508:55, 25 November 2015‎ Bghe talk contribs‎ 4,126 bytes +268‎ No edit summary

19 November 2015

• curprev 13:0113:01, 19 November 2015‎ Bghe talk contribs‎ 3,858 bytes +3,858‎ Created page with "===Slow etch of SiO2 with resist as masking material - with direct clamping === This recipe can be used for slow etching of SiO2 with resist as masking material when normal cl..."