Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/SiO2 etch with resist mask: Revision history

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28 April 2021

27 April 2021

  • curprev 15:4015:40, 27 April 2021Bghe talk contribs 33,232 bytes +33,232 Created page with "==Second run of DOE03 - with pattern== The design factors were: *Coil power: 2500-4000 W *Platen power: 200-300 W *Total flow: 100-500 sccm *He/C4F8 ratio: 5-30 *C4H8/H2 ratio..."
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