Specific Process Knowledge/Thin film deposition/Wordentec: Revision history

18 December 2013

• curprev 11:1511:15, 18 December 2013‎ Knil talk contribs‎ 5,727 bytes +10‎ →‎Quality control (QC) for Wordentec
• curprev 11:1411:14, 18 December 2013‎ Knil talk contribs‎ 5,717 bytes −19‎ →‎UNDER CONSTRUCTION: Quality control (QC) for Wordentec
• curprev 11:1411:14, 18 December 2013‎ Knil talk contribs‎ 5,736 bytes 0‎ →‎UNDER CONSTRUCTION: Quality control (QC) for Wordentec
• curprev 11:1311:13, 18 December 2013‎ Knil talk contribs‎ 5,736 bytes +2‎ →‎UNDER CONSTRUCTION: Quality control (QC) for Wordentec
• curprev 11:1311:13, 18 December 2013‎ Knil talk contribs‎ 5,734 bytes +7‎ →‎UNDER CONSTRUCTION: Quality control (QC) for Wordentec
• curprev 11:1211:12, 18 December 2013‎ Knil talk contribs‎ 5,727 bytes −7‎ →‎UNDER CONSTRUCTION: Quality control (QC) for Wordentec
• curprev 11:1111:11, 18 December 2013‎ Knil talk contribs‎ 5,734 bytes +53‎ →‎UNDER CONSTRUCTION: Quality control (QC) for Wordentec

17 December 2013

• curprev 15:4515:45, 17 December 2013‎ Knil talk contribs‎ 5,681 bytes +931‎ No edit summary

4 April 2013

• curprev 09:1609:16, 4 April 2013‎ Kn talk contribs‎ 4,750 bytes +233‎ No edit summary

5 March 2013

• curprev 16:2916:29, 5 March 2013‎ Kn talk contribs‎ 4,517 bytes +12‎ →‎Thermal evaporation materials

1 March 2013

• curprev 09:5209:52, 1 March 2013‎ Kn talk contribs‎ 4,505 bytes −4‎ →‎Overview of the performance of Wordentec and some process related parameters

15 August 2012

• curprev 13:0613:06, 15 August 2012‎ Kn talk contribs‎ 4,509 bytes +88‎ →‎Sputter materials

19 September 2011

• curprev 08:4608:46, 19 September 2011‎ Kn talk contribs‎ 4,421 bytes +88‎ No edit summary

29 January 2009

• curprev 09:5409:54, 29 January 2009‎ Kn talk contribs‎ 4,333 bytes +85‎ No edit summary

6 October 2008

• curprev 14:0014:00, 6 October 2008‎ Kn talk contribs‎ 4,248 bytes +115‎ →‎Sputter materials

17 June 2008

• curprev 10:3210:32, 17 June 2008‎ Kn talk contribs‎ 4,133 bytes −1‎ No edit summary

7 May 2008

• curprev 14:5314:53, 7 May 2008‎ Jml talk contribs‎ 4,134 bytes +42‎ →‎Overview of the performance of Wordentec and some process related parameters
• curprev 14:3414:34, 7 May 2008‎ Jml talk contribs‎ 4,092 bytes −129‎ →‎Overview of the performance of Wordentec and some process related parameters
• curprev 14:3214:32, 7 May 2008‎ Jml talk contribs‎ 4,221 bytes −9‎ →‎A rough overview of the performance of Wordentec and some process related parameters

20 December 2007

• curprev 11:4811:48, 20 December 2007‎ BGE talk contribs‎ 4,230 bytes +70‎ →‎Sputter materials

19 December 2007

• curprev 11:5511:55, 19 December 2007‎ BGE talk contribs‎ 4,160 bytes −3‎ →‎A rough overview of the performance of Wordentec and some process related parameters
• curprev 11:5411:54, 19 December 2007‎ BGE talk contribs‎ 4,163 bytes +3‎ →‎A rough overview of the performance of Wordentec and some process related parameters
• curprev 11:4511:45, 19 December 2007‎ BGE talk contribs‎ 4,160 bytes +1,683‎ →‎Sample materials that are approved for entering the chamber
• curprev 11:3311:33, 19 December 2007‎ BGE talk contribs‎ 2,477 bytes +224‎ →‎Sputter materials
• curprev 11:3211:32, 19 December 2007‎ BGE talk contribs‎ 2,253 bytes +82‎ →‎Thermal evaporation materials
• curprev 11:3011:30, 19 December 2007‎ BGE talk contribs‎ 2,171 bytes +444‎ →‎The metals available for E-beam evaporation and their standard deposition rates are:

18 December 2007

• curprev 12:3612:36, 18 December 2007‎ BGE talk contribs‎ 1,727 bytes +3‎ No edit summary
• curprev 12:3512:35, 18 December 2007‎ BGE talk contribs‎ 1,724 bytes +81‎ →‎Wordentec QCL 800

7 November 2007

• curprev 14:3214:32, 7 November 2007‎ BGE talk contribs‎ 1,643 bytes +1,643‎ New page: ==Wordentec QCL 800== ===Overview of equipment=== The Wordentec is a machine for: *Deposition of metal through E-beam deposition *Deposition of metal through thermal evaporation *Depo...