Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2: Revision history

5 March 2012

• curprev 09:2309:23, 5 March 2012‎ BGE talk contribs‎ 4,458 bytes −2‎ →‎RIE2:
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• curprev 09:1409:14, 5 March 2012‎ BGE talk contribs‎ 4,438 bytes +2‎ →‎RIE1:
• curprev 09:1409:14, 5 March 2012‎ BGE talk contribs‎ 4,436 bytes −2‎ →‎RIE1:
• curprev 09:1209:12, 5 March 2012‎ BGE talk contribs‎ 4,438 bytes −3‎ →‎The mask load affects the results
• curprev 09:0709:07, 5 March 2012‎ BGE talk contribs‎ 4,441 bytes +64‎ No edit summary
• curprev 08:5808:58, 5 March 2012‎ BGE talk contribs‎ 4,377 bytes +20‎ No edit summary

27 November 2009

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• curprev 13:5713:57, 27 November 2009‎ BGE talk contribs‎ 4,134 bytes 0‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):
• curprev 13:5513:55, 27 November 2009‎ BGE talk contribs‎ 4,134 bytes +56‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):

23 April 2008

• curprev 09:5709:57, 23 April 2008‎ BGE talk contribs‎ 4,078 bytes +20‎ →‎RIE2:
• curprev 09:5609:56, 23 April 2008‎ BGE talk contribs‎ 4,058 bytes +19‎ →‎RIE1:
• curprev 09:5309:53, 23 April 2008‎ BGE talk contribs‎ 4,039 bytes +2‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):

4 March 2008

• curprev 15:0615:06, 4 March 2008‎ BGE talk contribs‎ 4,037 bytes −327‎ No edit summary
• curprev 15:0515:05, 4 March 2008‎ BGE talk contribs‎ 4,364 bytes +8‎ →‎The silicon substrate:
• curprev 14:4014:40, 4 March 2008‎ BGE talk contribs‎ 4,356 bytes 0‎ →‎The silicon substrate:

4 February 2008

• curprev 16:2316:23, 4 February 2008‎ 192.38.87.76 talk‎ 4,356 bytes +8‎ →‎The mask load affects the results
• curprev 14:3814:38, 4 February 2008‎ 192.38.87.76 talk‎ 4,348 bytes +1‎ No edit summary
• curprev 14:3614:36, 4 February 2008‎ 192.38.87.76 talk‎ 4,347 bytes +1‎ No edit summary
• curprev 14:3514:35, 4 February 2008‎ 192.38.87.76 talk‎ 4,346 bytes +395‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):

13 November 2007

• curprev 09:5609:56, 13 November 2007‎ BGE talk contribs‎ 3,951 bytes +4‎ →‎RIE2:
• curprev 09:5309:53, 13 November 2007‎ BGE talk contribs‎ 3,947 bytes −113‎ →‎RIE2:
• curprev 09:3209:32, 13 November 2007‎ BGE talk contribs‎ 4,060 bytes +1,027‎ →‎RIE1:
• curprev 09:2209:22, 13 November 2007‎ BGE talk contribs‎ 3,033 bytes +12‎ →‎Etch of small structures
• curprev 09:2109:21, 13 November 2007‎ BGE talk contribs‎ 3,021 bytes +46‎ →‎Etch of small structures

12 November 2007

• curprev 16:1216:12, 12 November 2007‎ BGE talk contribs‎ 2,975 bytes +85‎ →‎Etch of small structures
• curprev 16:0016:00, 12 November 2007‎ BGE talk contribs‎ 2,890 bytes +289‎ →‎Etch of small structures
• curprev 15:3415:34, 12 November 2007‎ BGE talk contribs‎ 2,601 bytes +156‎ →‎Etch of small structures
• curprev 15:2315:23, 12 November 2007‎ BGE talk contribs‎ 2,445 bytes −9‎ No edit summary
• curprev 15:2115:21, 12 November 2007‎ BGE talk contribs‎ 2,454 bytes +102‎ →‎Etch of small structures
• curprev 15:1615:16, 12 November 2007‎ BGE talk contribs‎ 2,352 bytes +55‎ →‎Etch of small structures
• curprev 15:0115:01, 12 November 2007‎ 192.38.87.76 talk‎ 2,297 bytes +341‎ No edit summary

9 November 2007

• curprev 15:1315:13, 9 November 2007‎ BGE talk contribs‎ 1,956 bytes +15‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):
• curprev 15:1015:10, 9 November 2007‎ BGE talk contribs‎ 1,941 bytes +12‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):
• curprev 15:1015:10, 9 November 2007‎ BGE talk contribs‎ 1,929 bytes +31‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program):
• curprev 15:0815:08, 9 November 2007‎ BGE talk contribs‎ 1,898 bytes +121‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 14:0914:09, 9 November 2007‎ BGE talk contribs‎ 1,777 bytes +2‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 14:0914:09, 9 November 2007‎ BGE talk contribs‎ 1,775 bytes +47‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 14:0614:06, 9 November 2007‎ BGE talk contribs‎ 1,728 bytes +78‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 12:5612:56, 9 November 2007‎ BGE talk contribs‎ 1,650 bytes +43‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 09:2709:27, 9 November 2007‎ BGE talk contribs‎ 1,607 bytes 0‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 09:2709:27, 9 November 2007‎ BGE talk contribs‎ 1,607 bytes +14‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 09:2109:21, 9 November 2007‎ BGE talk contribs‎ 1,593 bytes +41‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 09:1709:17, 9 November 2007‎ BGE talk contribs‎ 1,552 bytes +332‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)

8 November 2007

• curprev 12:3812:38, 8 November 2007‎ BGE talk contribs‎ 1,220 bytes +13‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 12:2812:28, 8 November 2007‎ BGE talk contribs‎ 1,207 bytes 0‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 12:2112:21, 8 November 2007‎ BGE talk contribs‎ 1,207 bytes +444‎ →‎Most used recipe (this recipe is being watched in the in the quality assurance program)
• curprev 12:0412:04, 8 November 2007‎ 192.38.87.76 talk‎ 763 bytes +358‎ No edit summary

• curprev 11:5011:50, 8 November 2007‎ 192.38.87.76 talk‎ 405 bytes +405‎ New page: RIE (Reactive Ion Etch) can be used for etching silicon - both crystalline and polycrystalline silicon. This can be done with a simple photoresist as masking material. The etch can be is...