View source for Specific Process Knowledge/Thin film deposition/Deposition of Gold/Roughness of Au

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==Roughness and uniformity of Au layers ==


'''Experimental'''

Au was deposited directly on unprocessed Si wafers (on top of the native oxide), and the deposited layers were thereafter examined with [[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]. 

The deposition parameters were changed, and different equipment was used. Below, AFM pictures of layers deposited with different parameters can be seen.



'''Results'''


''Layers from Wordentec''

The deposition rate was varied between 1.5 Å/s and 10 Å/s. There are no substential differences of the roughness, for different rates. The differences in height of the tallest and lowest structure of the AFM pictures are in all cases between 4 and 6 nm.

The layer deposited in Wordentec is uniform, without any larger structures. Below a 2.5 x 2.5 µm large area of the surface is shown, the difference in hight between the lowest and tallest structure is about 7nm.   

[[Image:Au word rate5 .jpg|550x550px|center|thumb|E-beam deposited Au layer; deposited in the Wordentec, rate 5 Å/s. The Au surface is uniform, without any large variations of the surface structure.]]