Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask
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Revision as of 13:07, 6 September 2022 by Bghe (talk | contribs) (→Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned)
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Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned
- This information is save because it might be valuable as inspiration for other dry etch systems.
Etch of SiO2 using the recipe 1SIO2mbr with burned resist as masking material
Berit Geilman Herstrøm (BGE) from Nanolab@DTU