Specific Process Knowledge/Characterization/Probe station: Difference between revisions

Revision as of 12:07, 21 September 2017

Probe station

Feedback to this page: click here

The Probe station is a - EPS150Triax - Cascade. The purpose is to measure I/V measurement, ohmic measurements etc, it has 4 individually adjustable triax connected probes, but can be fitted with additional coax connected.

It has several source meters, multi meters and a computer attached.

Equipment performance and process related parameters

Purpose	Thickness measurer	Wafer thickness Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	< 5 µm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restrictions

The user manual, technical information and contact information can be found in LabManager:

Probe station

@@ Line 4: / Line 4: @@
 '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Probe_Station click here]'''
-The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
+The Probe station is a - EPS150Triax - Cascade. The purpose is to measure I/V measurement, ohmic measurements etc, it has 4 individually adjustable triax connected probes, but can be fitted with additional coax connected.
-During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
+It has several source meters, multi meters and a computer attached.
 ==Equipment performance and process related parameters==