Specific Process Knowledge/Characterization/Probe station: Difference between revisions

Revision as of 12:04, 21 September 2017

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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

Purpose	Thickness measurer	Wafer thickness Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	< 5 µm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restrictions

The user manual, technical information and contact information can be found in LabManager:

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-The Probe station is a - EPS150Triax - Cascade for I/V measurement, ohmic measurements etc, it has 4 individually adjustable probes, but can be fitted with more. It has several source meters, multi meters and a computer attached.
-It can be used from pieces up to 6" wafers
-[[Image:probestation.jpg|thumb|300x300px|Probe station: positioned in Service room CX1]]
 '''The user manual, technical information and contact information can be found in LabManager:'''
 '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=343 Probe station]'''