Specific Process Knowledge/Thermal Process: Difference between revisions

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*[[/C3 Anneal-bond furnace|Anneal-bond furnace (C3)]] - ''For oxidation and annealing of bonded wafers''
*[[/C3 Anneal-bond furnace|Anneal-bond furnace (C3)]] - ''For oxidation and annealing of bonded wafers''
*[[/C4 Aluminium Anneal furnace|Aluminium Anneal furnace (C4)]] - ''For annealing of wafers containing aluminium, Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ''
*[[/C4 Aluminium Anneal furnace|Aluminium Anneal furnace (C4)]] - ''For annealing of wafers containing aluminium, Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ''
'''E stack furnaces:'''
*[[/E1 Furnace Oxidation (8")|Oxidation (8") furnace (E1)]] - ''For oxidation and annealing of 150 mm and 200 mm wafers''


'''Other furnaces:'''
'''Other furnaces:'''

Revision as of 11:31, 9 February 2022

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Choose a process type

Choose an equipment to use

A stack furnaces:

C stack furnaces:

E stack furnaces:

Other furnaces:

Rules for storage and RCA cleaning of wafers to the A and C stack furnaces


Manual for the furnace computer to the A, B, C and E stack furnaces

The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here:

Manual for furnace computers for the A, B, C and E stack furnaces

Decommissioned equipment