Specific Process Knowledge/Thermal Process/BCB Curing Oven

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BCB Curing Oven

The BCB Curing Oven. Positioned in room Cx1/ Photo: DTU Nanolab internal

The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of some metals in a nitrogen atmosphere.

During processing the oven is rapidly heated by use of eight halogen lamps situated below the sample. The maximum allowed temperature is 450 ^oC.

The oven is purged with a nitrogen flow (high or low flow). Samples are processed at atmospheric pressure or at vacuum.

The user manual, user APV, technical information and contact information can be found in LabManager:

BCB Curing Oven

Process information

Here are some of the standard processes used in the BCB Curing Oven.

BCB curing

An example of a curing recipe (BCB250BL.PDF) for a long curing process at 250°C is shown below.

Content of BCB250BL.PDF:

;
; stored 31.08.2011  at 17:55:33
{P0}
00,00:30,0020,- - - - 3 - - - -,075,250,001,005,028
01,00:10,0020,- - - 2 - - - - -
02,00:30,0020,- - - - 3 - - - -
03,00:10,0020,- - - 2 - - - - -
04,05:00,0050,H - - 2 - - - - -
05,05:00,0050,H C - 2 - - - - -
06,15:00,0100,H - 1 - - - - - -
07,45:00,0100,H C 1 - - - - - -
08,15:00,0150,H - 1 - - - - - -
09,81:00,0150,H C 1 - - - - - -
10,60:00,0250,H - 1 - - - - - -
11,60:00,0250,H C 1 - - - - - -
12,15:00,0020,- C 1 - - - - - -
13,30:00,0020,- C 1 - - - - - -
14,00:00,0010,- C - - - - - - -

General processes

There are a number of general processes on the oven named DxxxCyyy.PDF.

The "Dxxx" in the recipe is the set temperature (in °C) and the "Cyyy" is the time (in minutes) at the set temperature.

The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy), after which it cools to room temperature as fast as possible.

The program sequence looks like this for the file D200C060.PDF:

;
; stored 31.08.2011  at 18:15:47
{P0}
00,05:00,0200,H - - 2 - - - - -,075,250,001,005,028
01,60:00,0200,H C 1 - - - - - -
02,05:00,0002,- C 1 - - - - - -
03,00:00,0000,- C - - - - - - -

Equipment performance and process related parameters

Equipment		BCB Curing Oven
Purpose		BCB curing Metal alloying
Process parameter range	Temperature	Room temperature - 450oC
	Nitrogen flows	Low N2 flow: 5 SLM High N2 flow: Max 16.7 SLM
	Pressure	Atmospheric pressure or vacuum
Substrates (Remember to use the right carrier wafer)	Batch size	Several small samples One 50 mm wafer One 100 mm wafer
	Allowed materials	BCB III-V materials Co-polymer Silicon, silicon oxide, silicon nitride Quartz Resist (prebaked) Metals (only Al, Ni, Ge and Au)