Specific Process Knowledge/Thermal Process: Difference between revisions

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'''Other furnaces:'''
'''Other furnaces:'''
*[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis''
*[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis''
*[[/Jipelec RTP|Jipelec RTP]] - ''For rapid thermal annealing of III-V materials and Si based materials''
*[[/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si based materials''
*[[/RTP Jipelec 2|RTP Jipelec 2]] - ''For rapid thermal annealing of III-V materials and Si based materials''
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers''
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers''


== Rules for storage and RCA cleaning of wafers to the A and C stack furnaces ==
== Rules for storage and RCA cleaning of wafers to the A and C stack furnaces ==

Revision as of 18:02, 15 January 2021

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Choose a process type

Choose an equipment to use

A stack furnaces:

C stack furnaces:

Other furnaces:

Rules for storage and RCA cleaning of wafers to the A and C stack furnaces


Manual for the furnace computer to the A, B, C and E stack furnaces

The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here:

Manual for furnace computers for the A, B, C and E stack furnaces

Decommissioned equipment