LabAdviser

LabAdviser is a process handbook for equipment and processes at the DTU Danchip cleanroom facilities. The function and capacity of each piece of equipment is described in detail and general process steps, eg photolithography procedures, are clarified. LabAdviser is meant to advise you to a good starting point for your cleanroom process for further optimization to meet your needs. To enter LabAdviser you need to log in with your DTU login. LabAdviser is only editable for Danchip employees. If you need further information about certain machinery or processes, please contact the Danchip personnel. Any feedback you might have on LabAdviser is welcome and can be given by mail to the LabAdviser mailbox: labadviser@danchip.dtu.dk

News in LabAdviser:
The latest monthly LabAdviser update: LabAdviser update send out 2015-07-31
Slides from the customer meeting December 2014: Customer meeting 2014

Contents

• Danchip contact information
• Introduction to LabAdviser and Processing
• Introduction to LabManager
• Process flow approval
• Specific Process Knowledge
• Equipment List
• New equipment in the pipeline and old equipment for decommissioning
• Surveys, statistics, monthly LabAdviser updates and other info.
• How to add information to LabAdviser

• Overview of processing steps - a guide to where you can find process information in LabAdviser:

Front Image - - - Clean your sample Dry your sample Create a thin film on your sample Dope your sample Thermal treatment of your sample Make a mask on your sample Transfer pattern to your sample Define your structure directly Bond your samples together Characterize your sample Pack your sample		Clean your sample Entry page in LabAdviser Techniques Materials Wafer cleaning Soap Sonic Removes dust and particles 7-up & Piranha Removes traces of organics and alkali ions RCA Two step process to remove traces of organics and metals 5% HF Removes native oxide IMEC Removing dust, traces of organics and alkali ions and slightly polish the surface. Make the surface hydrophillic Dry your sample Entry page in LabAdviser Techniques Materials Wafer and sample drying Spin dryers Whole wafers Critial point dryer Sensitive wafers Ethanol fume drying Sensitive wafers N2 blow drying N2 pistols Create a layer/film on your sample Entry page in LabAdviser Techniques Materials Thermal Process/Oxidation Thermal oxidation Thermal SiO2 Thin film deposition Sputter deposition Metals: Al, Ti, Cr, Co, Ni, Cu, Mo, Pd, Ag, Sn, Ta, W, Pt, Au, Fe, Mg, Nb, Ru Semiconductors: Si, Ge, ZnO Oxides: SiO2, ITO, TiO2, Al2O3, MgO, Ta2O5 Cr2O3 Transparent Conducting Oxides: ITO, AZO Alloys: TiW, NiCr, AlTi, NiV, AlCu, CoFe, CuTi, FeMn, MnIr, NiCo, NiFe, YSZ Thermal evaporation Al, Ge, Ag E-beam evaporation Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Pd, Ag, Cu, W, Ta Semiconductors: Si, Ge Oxides: SiO2, TiO2 Alloys: NiCr, TiAl LPCVD Si3N4, SRN, SiO2, Si (poly and amorph) PECVD Si3N4, SiO2, PBSG MVD FDTS Electroplating Ni Epitaxial growth /MOCVD Al, As, Ga, In, P. doping: Si, Zn Lithography/Coaters Spin coating resists, polymers Spray coating resists, polymers Dope your sample Entry page in LabAdviser Techniques Materials Doping Ion implant e.g. P, B, As PECVD Deposition of SiO2 or Si3N4 doped with P,B and Ge LPCVD Deposition of PolySi doped with B or P Predeposition and drive-in Doping Silicon wafers with boron Predeposition and drive-in Doping Silicon wafers with phosphorus Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing (>350C) Si, PECVD layers, Al, BCB curing, Polymer Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists: AZ, SU8, PDMS Rapid Thermal Anneal (RTP) SiO2, Si3N4, Ti, III-V Lithography/Baking Baking (<300dg) baking resist and polymers Make a mask on your sample Entry page in LabAdviser Techniques Materials Lithography Pattern design & Mask fabrication Photolithography UV resists Deep UV lithography DUV resists E-beam lithography E-beam resists Imprinting Polymers Transfer mask pattern to your sample Entry page in LabAdviser Techniques Materials Etch Wet etch Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs Dry etch Any material Lithography/Lift-off Lift-off Most materials Define your structure directly Entry page in LabAdviser Techniques Materials Direct Structure Definition Polymer Injection molding Topas, PP, PE, PS LASER micro machining Silicon, Metal, Graphene (on silicon), Glass (Pyrex, fused silica), TOPAS, PMMA Dicing saw Silicon, Glass (Pyrex, fused silica) Imprinting TOPAS, PMMA Lithography definition SU8, AZ resists Bond your samples together Entry page in LabAdviser Techniques Bonding Eutectic bonding Fusion bonding Anodic bonding Etch/DryEtchProcessing/Bonding Temporary bonding of wafers or chips for dry etching Characterize your sample Entry page in LabAdviser What do you need to measure? Technique/Method Characterization Sample Imaging, XY dimensions Microscopy: optical, SEM, AFM Sample Topography AFM, Profiling with stylus or optical Film thickness and optical constants Ellipsometry, Reflectometry, Prism Coupling Film Stress Profiling with stylus or optical Wafer thickness Micrometer gauge Element analysis XPS, EDX, SIMS Contact Angle Drop shape analyzing Resistivity Four point probe, Probe station Doping level/Carrier density ECV (Electrochemical Capacitance-Voltage) -profiler Direct Bandgap Photoluminescence Lattice mismatch X-ray diffractometer Defects/contamination Particle/defect counter Pack your sample (back-end) Entry page in LabAdviser Techniques Back-end processing Chip/die mounting Wire bonding Dicing

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Danchip Contact Info

In order to get the quickest response to training requests, process approvals, questions etc. please use the following mailboxes to DTU Nanolab - Fabrication (formerly known as Danchip).

Mailbox	link	Concerning
LabAdviser Mailbox	labadviser@nanolab.dtu.dk	Any questions or feedback to LabAdviser.
Process flow review	process-flow@nanolab.dtu.dk (should work again)	More about process flow review here
Training on equipment	training@nanolab.dtu.dk	It is our goal to answer your request regarding process flow reviews and training within 2 workdays.
E-beam training	e-beam@nanolab.dtu.dk	To request training on JEOL JBX-9500FSZ or Raith Eline e-beam systems. Please study the material on the EBL Labadviser pages.
E-beam load	e-beamload@nanolab.dtu.dk	To request cassette loading on JEOL JBX-9500FSZ.
Mask order:		Photomasks has to be ordered at Compugraphics in Procure. You can read more about the procedure for mask ordering here. It requires a specification file like this: (example spec file) and a design file (gds or cif format).
Mask Review	mask@nanolab.dtu.dk (Subject: Mask Review)	Note: You have to order masks at Compugraphics via Procure. Nanolab can offer a check of the mask design and specifications. You can read more about mask design here.
Metal wishes	.	.
Lesker:	metal@nanolab.dtu.dk (Subject: Lesker Metal Wishes).	- See current and future materials here: Lesker status log
Temescal/Wordentec:	metal@nanolab.dtu.dk (Subject:PVD Metal Wishes)	See current and future materials here: Temescal For Wordentec you need to contact the thin film group.
Tool change	toolchange@nanolab.dtu.dk	Laser: change of optics and Polymer Injection Molding machine: change mold-tool
Commercial offers etc.	sales@nanolab.dtu.dk	mostly companies nanolabexternal customers
Gas-related questions	DCH-Gas@nanolab.dtu.dk	issues (information regarding ordering, delivery, changing etc. Mostly for internal Nanolab use
All other inquiries	nanolabsupport@nanolab.dtu.dk	... or if you are in doubt

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Cleanroom naming and phone numbers

Room number Where in the room Phone number A-1 At III-V RIE 55 804 Ax2 At the Lesker 55 815 A-5 In the corner near the furnace/plasma asher 55 803 B-1 In the corridor 55 806 C-1 At the corridor 55 808 D-1 The entrance room 55 703 D-3 At the KOH 55 940 E-1 By the thin client 55 943 E-5 By Inclined UV-lamp 55 946 E-6 Furnace 6" 55 948 F-1 III-V growth 55 949 F-2 Opposite SEM Zeiss 55 941 F-3 DUV Stepper 55 947 SIMS/XPS room in the basement ? 55 813 Injection molder room in the basement ? 55 812