Latest revision as of 10:50, 2 January 2024

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Feedback to this page: click here

There are four different types of lithography available at DTU Nanolab:

Comparing lithography methods at DTU Nanolab

	UV Lithography	DUV Stepper Lithography	E-beam Lithography	Nano Imprint Lithography
Generel description	Pattern transfer via ultraviolet (UV) light	Pattern transfer via deep ultraviolet (DUV) light	Patterning by electron beam	Pattern transfer via hot embossing (HE)
Pattern size range	~0.6 µm and up (resist type, thickness, and pattern dependent)	~200 nm and up (pattern type, shape and pitch dependent)	~12 nm - 1 µm (and larger at high currents)	~20 nm and up
Resist type	UV sensitive: AZ 5214E, AZ 4562, AZ MiR 701 (positive) AZ 5214E, AZ nLOF 2020, SU-8 (negative)	DUV sensitive JSR KRF M230Y, JSR KRF M35G (positive) UVN2300-0.8 (negative)	E-beam sensitive AR-P6200 CSAR, ZEP502A , PMMA (positive) HSQ, mr-EBL, AR-N 7520 (negative)	Imprint polymers: Topas PMMA mr-I 7030R
Resist thickness range	~0.5 µm to 200 µm	~50 nm to 2 µm	~30 nm to 1 µm	~ 100 nm to 2 µm
Typical exposure time	10 s - 3 min pr. wafer using mask aligners 10 min - 5 hours pr. wafer using maskless aligners	Process dependent: Pattern Pattern area Dose Throughput is up to 60 wafers/hour	Process dependent: Dose, Q [µC/cm²] Beam current, I [A] Pattern area, a [cm²] time [s] = Q*a/I	Process dependent, including heating/cooling rates
Substrate size	chips down to 3 mm x 3 mm 50 mm wafers 100 mm wafers 150 mm wafers 200 mm wafers	100 mm wafers 150 mm wafers 200 mm wafers	We have cassettes fitting: 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm) 6 wafers of 50 mm in size 3 wafers of 100 mm in size 1 wafer of 150 mm in size 1 wafer of 200 mm in size Only one cassette can be loaded at a time	small samples 50 mm wafers 100 mm wafers 150 mm wafers
Allowed materials	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material, except: Materials that will degas Graphene requires special treatment	Any standard cleanroom material

Equipment Pages

Resist

Pretreatment

Coating

Baking

UV Exposure Tools

Deep-UV Exposure

DUV Stepper (Canon FPA-3000EX4)

Electron Beam Exposure

Nano Imprint Lithography

Development

Descum

Lift-off

Lift-off

Strip

Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.

You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).

For details, dates, and course material, please check the course description under Courses.

Lithography Tool Package Training

Signing up for the course

The course is in DTU Learn. You sign up for the course by enroling yourself in the course "DTU Nanolab TPT: Lithography".

Log into DTU Learn here: DTU Learn - requires login
Select the menu "Discover"
Search for "Nanolab"
Select the course "DTU Nanolab TPT: Lithography"
Press "Enroll in Course"
You have now signed up for the course.
Go to the course page in DTU Learn and choose "Course Content" and "Content"
Watch the lecture videos, read the learning material, and complete all the quizzes.

Learning Objectives

Learn about the fundamentals of lithographic processing in a cleanroom:

Coating
Exposure
Development
Post-processing

Knowledge and Information about Lithography

Literature

Lecture videos

Lithography TPT lecture videos (7 videos, 2:41 hours in total) on YouTube
A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Lithography TPT lecture slides
NB: Access to slides require login

Training videos

Playlists on YouTube:

Manuals
NB: Access to manuals require login

Automatic Spin Coater: Spin Coater: Gamma UV
Manual Spin Coater: Spin Coater: Labspin 02 or Spin Coater: Labspin 03
UV Mask Aligner: Aligner: MA6 - 2 or KS Aligner
Automatic Puddle Developer: Developer: TMAH UV-lithography
Manual Puddle Developer: Developer: TMAH Manual
Manual E-beam Developer: Developer: E-beam Manual

Process Flows

Specific Process Knowledge/Lithography: Difference between revisions

Latest revision as of 10:50, 2 January 2024

Contents

Comparing lithography methods at DTU Nanolab

Equipment Pages

Lithography Tool Package Training

Knowledge and Information about Lithography

Navigation menu

@@ Line 1: / Line 1: @@
-<!-- =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=-->
+{{cc-nanolab}}
-[[Image:DUV_wafers.jpg|250x250px|right|frame|]]
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
-'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
+[[Category: Equipment|Lithography]]
-<!-- Replace "http://labadviser.danchip.dtu.dk/..." with the link to the Labadviser page-->
+[[Category: Lithography]]
+[[Image:DUV_wafers.jpg|500px|frameless|right|]]
 __TOC__
+There are four different types of lithography available at DTU Nanolab:
+*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
+*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
+*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
+*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
 <br clear="all" />
+=Comparing lithography methods at DTU Nanolab=
-=Comparing lithography methods at DTU Danchip=
+{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
-{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
 |-
@@ Line 23: / Line 27: @@
 !width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
 !width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
-!width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
+!width="16%"| [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
 |-
@@ Line 30: / Line 34: @@
 |-style="background:WhiteSmoke; color:black"
 !Generel description
-|Pattern transfer via UltraViolet (UV) light
+|Pattern transfer via ultraviolet (UV) light
-|Pattern transfer via DeepUltraViolet (DUV) light
+|Pattern transfer via deep ultraviolet (DUV) light
 |Patterning by electron beam
 |Pattern transfer via hot embossing (HE)
@@ Line 41: / Line 45: @@
 !Pattern size range
 |
-*Resist type, thickness, and pattern dependent
+~0.6 µm and up<br>
-*~1.25 µm and up
+(resist type, thickness, and pattern dependent)
 |
-*pattern type, shape and pitch dependent
+~200 nm and up<br>
-*~200 nm and up
+(pattern type, shape and pitch dependent)
 |
-*~12 nm - 1 µm
+~12 nm - 1 µm<br>
+(and larger at high currents)
 |
-*~20 nm and up
+~20 nm and up
 |-
@@ Line 56: / Line 61: @@
 !Resist type
 |
-*UV sensitive:
+UV sensitive:
-**AZ 5214E, AZ 4562, AZ MiR 701 (positive)
+*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
-**AZ 5214E, AZ nLOF 2020, SU-8 (negative)
+*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
 |
-*DUV sensitive
+DUV sensitive
-**JSR KRF M230Y, JSR KRF M35G (positive)
+*JSR KRF M230Y, JSR KRF M35G (positive)
-**UVN2300-0.8 (negative)
+*UVN2300-0.8 (negative)
 |
-*E-beam sensitive
+E-beam sensitive
-**AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
+*AR-P6200 CSAR, ZEP502A , PMMA (positive)
+*HSQ, mr-EBL, AR-N 7520 (negative)
 |
-*Imprint polymers:
+Imprint polymers:
-**Topas
+*Topas
-**PMMA
+*PMMA
+*mr-I 7030R
 |-
@@ Line 76: / Line 83: @@
 !Resist thickness range
 |
-~0.5µm to 20µm
+~0.5 µm to 200 µm
 |
-~50nm to 2µm
+~50 nm to 2 µm
 |
-~30nm to 0.5 µm
+~30 nm to 1 µm
 |
-~ 100nm to 2µm
+~ 100 nm to 2 µm
 |-
@@ Line 89: / Line 96: @@
 !Typical exposure time
 |
-s-30s pr. wafer
+s - 3 min pr. wafer using mask aligners<br>
+min - 5 hours pr. wafer using maskless aligners
 |
-Process depended, depends on pattern, pattern area and dose
+Process dependent:
+*Pattern
+*Pattern area
+*Dose
+Throughput is up to 60 wafers/hour
 |
-Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]:     t = Q*A/I
+Process dependent:
+*Dose, Q [µC/cm<sup>2</sup>]
+*Beam current, I [A]
+*Pattern area, a [cm<sup>2</sup>]
+time [s] = Q*a/I
 |
-Process depended, depends also on heating and cooling temperature rates
+Process dependent, including heating/cooling rates
 |-
@@ Line 103: / Line 121: @@
 !Substrate size
 |
-*small samples
+*chips down to 3 mm x 3 mm
 *50 mm wafers
 *100 mm wafers
 *150 mm wafers
+*200 mm wafers
 |
 *100 mm wafers
@@ Line 112: / Line 131: @@
 *200 mm wafers
 |
-We have cassettes that fit to
+We have cassettes fitting:
-*4 small samples (20mm, 12mm, 8mm, 4mm)
+*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
 *6 wafers of 50 mm in size
 *3 wafers of 100 mm in size
@@ Line 129: / Line 148: @@
 !'''Allowed materials'''
 |
-*Any standard cleanroom material
+Any standard cleanroom material
 |
-*Any standard cleanroom material
+Any standard cleanroom material
 |
-*Any standard cleanroom material, except materials that will degass and special treatment for graphene
+Any standard cleanroom material, except:
+*Materials that will degas
+*Graphene requires special treatment
 |
-*Any standard cleanroom material
+Any standard cleanroom material
 |-
 |}
 <br clear="all" />
 =Equipment Pages=
 {| style="color: black;" width="90%"
@@ Line 149: / Line 167: @@
 |-
 | style="width: 20%"|
+'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
+*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
+*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
+*[[Specific_Process_Knowledge/Lithography/Resist#DUV_Resist|DUV Resist]]
+*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]]
+*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]
 '''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
 *[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
-*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
+*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
 *[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
 '''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
 *[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
-*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
 *[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
-*[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual/Labspin ...]]
+*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
 *[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
 *[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]]
+*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
 '''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
@@ Line 166: / Line 191: @@
 *[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
-| style="width: 20%"|
+| style="width: 20%"; valign="top"|
-'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]</big>'''
+'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
 *[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
 *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
-*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]
+<!--*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]-->
 *[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
 *[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
+*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
-'''<big>[[Specific Process Knowledge/Lithography/UVExposure|Deep-UV Exposure]]</big>'''
+'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
 *[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]
 '''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
-*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ|E-Beam Writer 9500 (JEOL JBX-9500FSZ)]]
+*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
-*[[Specific_Process_Knowledge/Lithography/EBeamLithography/RaithElphy|Raith Elphy on SEM - LEO]]
+*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]
+'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
+*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
+*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
+| style="width: 20%"; valign="top"|
 '''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
-*[[Specific Process Knowledge/Lithography/Development#Developer-6inch|Developer: 6inch]]
+*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
-*[[Specific Process Knowledge/Lithography/Development#SU8-Developer|Developer: SU8]]
 *[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
-*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
+*[[Specific Process Knowledge/Lithography/Development#Developer:_SU8_(wetbench)|Developer: SU8 (wetbench)]]
-*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper|Developer: TMAH Stepper]]
+*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
+*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]]
-| style="width: 20%"|
 '''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
-*[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]]
+*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_1|Plasma Asher 1]]
-*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
+*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_2|Plasma Asher 2]]
+*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3:Descum]]
 *[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
@@ Line 198: / Line 230: @@
 '''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
-*[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]]
+*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_1|Plasma Asher 1]]
 *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
+*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
 *[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
-'''<big>[[Specific_Process_Knowledge/Imprinting|NanoImprint Lithography]]</big>'''
-*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
-*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
 |}
 <br clear="all" />
 =Lithography Tool Package Training=
+DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.
-DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.
+You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).
-The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.
-'''For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].'''
+For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].
@@ Line 230: / Line 256: @@
 |-
-!Schedule
+!Signing up for the course
 |
-<!--'''<span style="color: red;">OBS: The December Litho TPT has been cancelled due to sickness. Contact the Lithography Group for rescheduling if this poses a problem.</span>''' <span style="text-decoration: line-through;">'''NEXT LECTURE: Tuesday 29th of November 9:15 - 13:00 (B347, Seminar room)'''</span>-->
+The course is in DTU Learn. You sign up for the course by enroling yourself in the course "DTU Nanolab TPT: Lithography".
-'''Theoretical part'''
+#Log into DTU Learn here: [https://learn.inside.dtu.dk DTU Learn] - '''requires login'''
-* Lecture videos that can be viewed at one's leisure.
+#Select the menu "Discover"
-* A 1 hour "questions and exercises" session 2 times a month (typically Fridays 09:30-10:30).
+#Search for "Nanolab"
-<!--* NEXT "questions and exercises" sessions: '''24th of March, 31st of March, 21st of April, 28th of April, 19th of May'''-->
+#Select the course "DTU Nanolab TPT: Lithography"
-'''Practical part'''
+#Press "Enroll in Course"
-* A 3-4 hour training session 2 times a month, max. 4 persons per session (typically Wednesdays 09:00 - 12:30 or 10:00 - 13:30).
+#You have now signed up for the course.
-<!--* NEXT training sessions: '''29th of March, 5th of April, 26th of April, 3rd of May, 24th of May'''-->
+#Go to the course page in DTU Learn and choose "Course Content" and "Content"
-|-
+#Watch the lecture videos, read the learning material, and complete all the quizzes.
-|-
-!Location
-|
-'''Theoretical part'''
-* The location of the "questions and exercises" session will be specified after signing up for the course.
-'''Practical part'''
-* The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
-|-
-|-
-!Qualified Prerequisites
-|
-* Cleanroom safety course at DTU Danchip
-* Admission to the cleanroom must be obtained before the training session
-* Theoretical part must be completed before the training session
-|-
-|-
-!Preparations
-|
-'''Before the "questions and exercises" session'''
-* Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus)
-* Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos.
-'''Before training session'''
-* Complete the theoretical part (Q&E)
-* Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
-* Study the equipment manuals. The manuals are available in LabManager.
-* Study the TPT process flows (first print, and alignment).
-<!--'''Links to literature, lecture videos, training videos, equipment manuals, and process flows can be found in the "Knowledge and Information" section below.'''-->
-|-
-|-
-!Course Responsible
-|
-The Lithography Group at DTU Nanolab [mailto:lithography@danchip.dtu.dk lithography@danchip.dtu.dk].
 |-
@@ Line 282: / Line 272: @@
 !Learning Objectives
 |
-* Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
+Learn about the fundamentals of lithographic processing in a cleanroom:
-* Authorization to use spin coater, mask aligner, and developer at DTU Danchip
+* Coating
-* Calculate relevant process parameters
+* Exposure
-* Analyze and apply your results of lithographic processing
+* Development
+* Post-processing
 |-
 |}
 <br clear="all" />
@@ Line 297: / Line 286: @@
 | colspan="3" |
 |-
-| style="width: 20%"|
+| style="width: 20%"; valign="top"|
 '''<big>Literature</big>'''
 *[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
@@ Line 305: / Line 294: @@
 *[http://www.cnf.cornell.edu/cnf_spietoc.html Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
 *[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
+*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]
 '''<big>Lecture videos</big>'''
-*Lithography TPT lecture videos (7 videos, 2:41 hours in total) on [http://podcast.llab.dtu.dk/index.php?id=302 DTU Podcasts] or [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
+*Lithography TPT lecture videos (7 videos, 2:41 hours in total) on [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
 *A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)
+| style="width: 20%"; valign="top"|
+'''<big>Lithography TPT lecture slides</big>'''<br>
+''' NB: Access to slides require login'''
+*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
+*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
+*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
+*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
+*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
+*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-'''<big>Lithography TPT lecture slides</big>'''
-*[[:Media:Litho_Tool_Package_-_Introduction.pdf|TPT slides: Introduction]]
-*[[:Media:Litho_Tool_Package_-_Spin_coating.pdf‎|TPT slides: Spin Coating]]
-*[[:Media:Litho_Tool_Package_-_Exposure.pdf|TPT slides: UV Exposure]]
-*[[:Media:Litho_Tool_Package_-_Development.pdf‎|TPT slides: Development]]
-*[[:Media:Litho_Tool_Package_-_Post_processing.pdf‎|TPT slides: Post-processing]]
-*[[:Media:Litho_Tool_Package_-_Process_effects_and_examples.pdf|TPT slides: Process Effects and Examples]]
-| style="width: 20%"|
 '''<big>Training videos</big>'''
-*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training Video: Automatic Spin Coater]
+*[https://www.youtube.com/watch?v=3JhM3rmLVpA Training Video: Automatic Spin Coater]
 *[https://www.youtube.com/watch?v=_neUkDsQhsM: Training Video: Manual Spin Coater Labspin]
-*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part1_operation-720p.mp4 Training Video: UV Mask Aligner Part I (Operation)]
+*[https://www.youtube.com/watch?v=o8IBtfQHNzU Training Video: UV Mask Aligner Part I (Operation)]
-*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part2_aligning-720p.mp4 Training Video: UV Mask Aligner Part II (Alignment)]
+*[https://www.youtube.com/watch?v=rvUuXYgw-xU Training Video: UV Mask Aligner Part II (Alignment)]
-*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.050_Developer_TMAH_UV-Lithography-720p.mp4 Training Video: Automatic Puddle Developer]
+*[https://www.youtube.com/watch?v=GyTQNmbev2c Training Video: Maskless aligner Training Video]
-*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.049_Developer_Manual-720p.mp4 Training Video: Manual Puddle Developer]
+*[https://www.youtube.com/watch?v=Vpa9QoCHA4I Training Video: Maskless aligner Conversion]
-Playlist on YouTube:
+*[https://www.youtube.com/watch?v=wIF-oqVR1Dc Training Video: Maskless aligner Series and Navigation]
+*[https://youtu.be/yclriey6xpM Training Video: Maskless aligner Alignment]
+*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
+*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
+'''Playlists on YouTube:'''
 *[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography TPT training videos]
+*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner training videos]
+| style="width: 20%"; valign="top"|
-'''<big>Manuals</big>'''
+'''<big>Manuals</big>'''<br>
+'''NB: Access to manuals require login'''
 *Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
 *Manual Spin Coater: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 Spin Coater: Labspin 02] or [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 Spin Coater: Labspin 03]
@@ Line 340: / Line 336: @@
 *Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]
 *Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]
 '''<big>Process Flows</big>'''
 *[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
 *[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
+*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
-| style="width: 20%"|
+*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resist process flows]]
-'''<big>Resists</big>'''
-*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV Resist Overview]]
-*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists|E-beam Resist Overview]]
-'''<big>UV Exposure</big>'''
-*[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|Information on UV Exposure Dose]]
-'''<big>Electron Beam Exposure</big>'''
-*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ#Getting_started|Training on JEOL JBX-9500FSZ]]
-*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_Flows|E-beam resists and process flows]]
-*[[:File:Lecture E-beam Lithography -LGPE.pdf|Lecture on E-beam Lithography]]
-'''<big>Deep-UV Exposure</big>'''
-*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Stepper Lithography]]
 |}
 <br clear="all" />