Specific Process Knowledge/Lithography: Difference between revisions

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<!-- =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=-->
{{cc-nanolab}}


[[Image:DUV_wafers.jpg|250x250px|right|frame|]]
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''


'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
[[Category: Equipment|Lithography]]
<!-- Replace "http://labadviser.danchip.dtu.dk/..." with the link to the Labadviser page-->
[[Category: Lithography]]


[[Image:DUV_wafers.jpg|500px|frameless|right|]]


__TOC__
__TOC__


 
There are four different types of lithography available at DTU Nanolab:
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
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=Comparing lithography methods at DTU Nanolab=


=Comparing lithography methods at DTU Danchip=
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!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]  
!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]  
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
!width="16%"| [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
!width="16%"| [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]]
|-
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Pattern transfer via UltraViolet (UV) light
|Pattern transfer via ultraviolet (UV) light
|Pattern transfer via DeepUltraViolet (DUV) light
|Pattern transfer via deep ultraviolet (DUV) light
|Patterning by electron beam
|Patterning by electron beam
|Pattern transfer via hot embossing(HE)
|Pattern transfer via hot embossing (HE)
|Direct writing via IR laser
|-
|-


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!Pattern size range
!Pattern size range
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*~1.25 µm and up
~0.6 µm and up<br>
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(resist type, thickness, and pattern dependent)
*~200 nm and up
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*~12 nm - 1 µm
~200 nm and up<br>
(pattern type, shape and pitch dependent)
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*~20 nm and up
~12 nm - 1 µm<br>
(and larger at high currents)
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*3D voxel through transparent substrate: 0.3 µm diameter; 0.6 µm high
~20 nm and up
*2D spot on opaque substrate: 0.6 µm diameter
|-
|-


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!Resist type
!Resist type
|
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*UV sensitive:
UV sensitive:
**AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
**AZ 5214E, AZ nLOF 2020, SU-8 (negative)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
*DUV sensitive
**JSR KRF M230Y, JSR KRF M35G (positive)
**UVN2300-0.8 (negative)
|
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*E-beam sensitive
DUV sensitive
**AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
|
|
*Imprint polymers:
E-beam sensitive
**Topas
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
**PMMA
*HSQ, mr-EBL, AR-N 7520 (negative)
|
|
*UV sensitive:
Imprint polymers:
**IP photoresists, SU-8 (3D)
*Topas
**AZ resists (2D)
*PMMA
*mr-I 7030R
|-
|-
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Resist thickness range
!Resist thickness range
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~0.5µm to 20µm
~0.5 µm to 200 µm
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~50nm to 2µm
~50 nm to 2 µm
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~30nm to 0.5 µm
~30 nm to 1 µm
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~ 100nm to 2µm
~ 100 nm to 2 µm
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droplet or coating
|-
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!Typical exposure time
!Typical exposure time
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2s-30s pr. wafer
10 s - 3 min pr. wafer using mask aligners<br>
10 min - 5 hours pr. wafer using maskless aligners
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Process depended, depends on pattern, pattern area and dose
Process dependent:
*Pattern
*Pattern area
*Dose
 
Throughput is up to 60 wafers/hour
|
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Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]:    t = Q*A/I
Process dependent:
*Dose, Q [µC/cm<sup>2</sup>]
*Beam current, I [A]
*Pattern area, a [cm<sup>2</sup>]
 
time [s] = Q*a/I
|
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Process depended, depends also on heating and cooling temperature rates
Process dependent, including heating/cooling rates
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Process depended, depends on pattern and dose
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!Substrate size
!Substrate size
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*small samples
*chips down to 3 mm x 3 mm
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
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*100 mm wafers
*100 mm wafers
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*200 mm wafers
*200 mm wafers
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We have cassettes that fit to
We have cassettes fitting:
*4 small samples (20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*6 wafers of 50 mm in size
*2 wafers of 100 mm in size
*3 wafers of 100 mm in size
*1 wafer of 150 mm in size  
*1 wafer of 150 mm in size  
Only one cassette can be loaded at time
*1 wafer of 200 mm in size
Only one cassette can be loaded at a time
|
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*small samples
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers
|
*Cover slides
*50 mm wafers
*100 mm wafers
*IBIDI
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!'''Allowed materials'''
!'''Allowed materials'''
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*Any standard cleanroom material
Any standard cleanroom material  
|
*Any standard cleanroom material  
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*Any standard cleanroom material  
Any standard cleanroom material  
|
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*Any standard cleanroom material  
Any standard cleanroom material, except:
*Materials that will degas
*Graphene requires special treatment 
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*Any standard cleanroom material  
Any standard cleanroom material  
|-
|-
|}
|}
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=Equipment Pages=
=Equipment Pages=


{| style="color: black;" width="90%"
{| style="color: black;" width="90%"
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|-
|-
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'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#DUV_Resist|DUV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]
'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]


'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coaters]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin coater: Manual Labspin|Spin coater: Manual Labspin]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]


'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
 
| style="width: 20%"; valign="top"|
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
<!--*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]-->
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
 
'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]


| style="width: 20%"|
'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ|JEOL JBX-9500FSZ]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]


'''<big>[[Specific Process Knowledge/Lithography/UVExposure|Deep-UV Exposure]]</big>'''
'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]]
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]


'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


| style="width: 20%"; valign="top"|
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
*[[Specific Process Knowledge/Lithography/Development#Developer-1 and Developer-2|Developer-1 and Developer-2]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
*[[Specific Process Knowledge/Lithography/Development#Developer-6inch|Developer-6inch]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
*[[Specific Process Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]
*[[Specific Process Knowledge/Lithography/Development#Developer:_SU8_(wetbench)|Developer: SU8 (wetbench)]]
*[[Specific Process Knowledge/Lithography/Development#Developer-TMAH|Developer-TMAH]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]]


| style="width: 20%"|
'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3:Descum]]
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]


'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]
 
'''<big>[[Specific_Process_Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]</big>'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
 
'''<big>3D Lithography</big>'''
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]


'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
|}
|}
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<br clear="all" />


=Training=
=Lithography Tool Package Training=
<span style="background:#FF2800">THIS SECTION IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]


DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.


{| style="color: black;" width="90%"
You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).
| colspan="3" |
|-
| style="width: 20%"|
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[http://www.microchemicals.com/downloads/application_notes.html Application Notes from MicroChemicals]
*[http://www.microchemicals.com/support/troubleshooter.html Lithography Troubleshooter from MicroChemicals]




'''<big>Spin Coating</big>'''
For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359  Training Video: Automatic Spin Coater]'''
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362  Training Video: Manual Spin Coater]'''




'''<big>UV Exposure</big>'''
{|border="1" cellspacing="0" cellpadding="3" align="left" style="text-align:left;" style="width: 70%;"
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=339  Training Video: UV Exposure]'''
|-
*[[:File:Litho Tool Package - Exposure TARAN.pdf|Link to slides on UV exposure]]


|-
|-style="background:White; color:black; text-align:center"
!colspan="2"|Lithography Tool Package Training
|-


|-
!Signing up for the course
|
The course is in DTU Learn. You sign up for the course by enroling yourself in the course "DTU Nanolab TPT: Lithography".
#Log into DTU Learn here: [https://learn.inside.dtu.dk DTU Learn] - '''requires login'''
#Select the menu "Discover"
#Search for "Nanolab"
#Select the course "DTU Nanolab TPT: Lithography"
#Press "Enroll in Course"
#You have now signed up for the course.
#Go to the course page in DTU Learn and choose "Course Content" and "Content"
#Watch the lecture videos, read the learning material, and complete all the quizzes.
|-


| style="width: 20%"|
|-
!Learning Objectives
|
Learn about the fundamentals of lithographic processing in a cleanroom:
* Coating
* Exposure
* Development
* Post-processing
|-


|}
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'''<big>Electron Beam Exposure</big>'''
=Knowledge and Information about Lithography=
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
{| style="color: black;" width="90%"
 
| colspan="3" |
 
|-
'''<big>Deep-UV Exposure</big>'''
| style="width: 20%"; valign="top"|
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
'''<big>Literature</big>'''
 
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
 
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
'''<big>Development</big>'''
*[http://www.microchemicals.com/support/troubleshooter.html Lithography Troubleshooter from MicroChemicals]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[http://www.microchemicals.com/downloads/application_notes.html Application Notes from MicroChemicals]
 
*[http://www.cnf.cornell.edu/cnf_spietoc.html Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
 
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
'''<big>Post Processing</big>'''
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]




'''<big>Lecture videos</big>'''
*Lithography TPT lecture videos (7 videos, 2:41 hours in total) on [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)


| style="width: 20%"|
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'''<big>Lithography TPT lecture slides</big>'''<br>
''' NB: Access to slides require login'''
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]


'''<big>UV Resists</big>'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]


'''<big>Training videos</big>'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA Training Video: Automatic Spin Coater]
*[https://www.youtube.com/watch?v=_neUkDsQhsM: Training Video: Manual Spin Coater Labspin]
*[https://www.youtube.com/watch?v=o8IBtfQHNzU Training Video: UV Mask Aligner Part I (Operation)]
*[https://www.youtube.com/watch?v=rvUuXYgw-xU Training Video: UV Mask Aligner Part II (Alignment)]
*[https://www.youtube.com/watch?v=GyTQNmbev2c Training Video: Maskless aligner Training Video]
*[https://www.youtube.com/watch?v=Vpa9QoCHA4I Training Video: Maskless aligner Conversion]
*[https://www.youtube.com/watch?v=wIF-oqVR1Dc Training Video: Maskless aligner Series and Navigation]
*[https://youtu.be/yclriey6xpM Training Video: Maskless aligner Alignment]
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
'''Playlists on YouTube:'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography TPT training videos]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner training videos]


'''<big>OM Inspection of Resist</big>'''
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*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
'''<big>Manuals</big>'''<br>
'''NB: Access to manuals require login'''
*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
*Manual Spin Coater: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 Spin Coater: Labspin 02] or [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 Spin Coater: Labspin 03]
*UV Mask Aligner: [http://labmanager.dtu.dk/d4Show.php?id=3822&mach=339 Aligner: MA6 - 2] or [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 KS Aligner]
*Automatic Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=329 Developer: TMAH UV-lithography]
*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]




'''<big>Process Flows</big>'''
*[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
*[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resist process flows]]
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Revision as of 09:50, 2 January 2024

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

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There are four different types of lithography available at DTU Nanolab:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range

~0.6 µm and up
(resist type, thickness, and pattern dependent)

~200 nm and up
(pattern type, shape and pitch dependent)

~12 nm - 1 µm
(and larger at high currents)

~20 nm and up

Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range

~0.5 µm to 200 µm

~50 nm to 2 µm

~30 nm to 1 µm

~ 100 nm to 2 µm

Typical exposure time

10 s - 3 min pr. wafer using mask aligners
10 min - 5 hours pr. wafer using maskless aligners

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose, Q [µC/cm2]
  • Beam current, I [A]
  • Pattern area, a [cm2]

time [s] = Q*a/I

Process dependent, including heating/cooling rates

Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

Any standard cleanroom material

Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment

Any standard cleanroom material


Equipment Pages

Resist

Pretreatment

Coating

Baking

UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography


Development

Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.

You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).


For details, dates, and course material, please check the course description under Courses.


Lithography Tool Package Training
Signing up for the course

The course is in DTU Learn. You sign up for the course by enroling yourself in the course "DTU Nanolab TPT: Lithography".

  1. Log into DTU Learn here: DTU Learn - requires login
  2. Select the menu "Discover"
  3. Search for "Nanolab"
  4. Select the course "DTU Nanolab TPT: Lithography"
  5. Press "Enroll in Course"
  6. You have now signed up for the course.
  7. Go to the course page in DTU Learn and choose "Course Content" and "Content"
  8. Watch the lecture videos, read the learning material, and complete all the quizzes.
Learning Objectives

Learn about the fundamentals of lithographic processing in a cleanroom:

  • Coating
  • Exposure
  • Development
  • Post-processing


Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Lithography TPT lecture slides
NB: Access to slides require login


Training videos

Playlists on YouTube:

Manuals
NB: Access to manuals require login


Process Flows


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