Specific Process Knowledge/Thin film deposition/Physimeca
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Physimeca - This tool has been decommissioned
Physimeca is a system for deposition of metals through electron-beam evaporation.
Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples up to 4 inch wafer. There are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.
Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (Metal@nanolab.dtu.dk) if you have wishes for other metals.
The user manual and contact information can be found in LabManager:
| Purpose | Deposition of metals |
|
|---|---|---|
| Performance | Film thickness |
|
| Available metals and deposition rates (Å/s) |
| |
| Process parameter range | Process Temperature |
|
| Process pressure |
| |
| Distance between e-beam and substrate |
| |
| Substrates | Sample size |
|
| Substrate material allowed |
| |
| Materials allowed on the substrate |
|
* For thicknesses above 2000 Å special permission is required (contact thinfilm@nanolab.dtu.dk).