Specific Process Knowledge/Lithography/Pretreatment/Oven 250C
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Oven 250C
The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven.
The user manual, and contact information can be found in LabManager:
Oven 250C - requires login