Specific Process Knowledge/Back-end processing/FlipScribe

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The Cleaver: FlipScribe is designed for cleaving wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flip Scribe should always be placed inside Fume hood 5.

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Approved Materials:

  • Si
  • Quartz
  • Pyrex (Borofloat 33)
  • GaAs
  • InP
  • Sapphire

The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information

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