Specific Process Knowledge/Lithography
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Comparing lithography methods at DTU Danchip
UV Lithography | DUV Stepper Lithography | E-beam Lithography | Nano Imprint Lithography | 2-Photon Polymerization Lithography | |
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Generel description | Pattern transfer via UltraViolet (UV) light | Pattern transfer via DeepUltraViolet (DUV) light | Patterning by electron beam | Pattern transfer via hot embossing(HE) | Direct writing via IR laser |
Pattern size range |
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Resist type |
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Resist thickness range |
~0.5µm to 20µm |
~50nm to 2µm |
~30nm to 0.5 µm |
~ 100nm to 2µm |
droplet or coating |
Typical exposure time |
2s-30s pr. wafer |
Process depended, depends on pattern, pattern area and dose |
Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I |
Process depended, depends also on heating and cooling temperature rates |
Process depended, depends on pattern and dose |
Substrate size |
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We have cassettes that fit to
Only one cassette can be loaded at time |
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Allowed materials |
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Equipment Pages
3D Lithography |
Knowledge and Information about Lithography
Litho Tool Package Training
DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.
The course is recommended for all users that intend to perform any lithographic processing in the cleanroom.
Schedule:
The tool package consists of a lecture and a one-day training session in the cleanroom.
- Lecture once a month (~3.5 hours)
- Training session once a week, max. 6 persons per session (9:00 - 16:00)
Location:
Meeting room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
Qualified Prerequisites:
- Cleanroom safety course at DTU Danchip
- Wet Chemistry Course at DTU Danchip
Preparations:
Before the lecture
- Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
- Optional but recommended: See training videos (training videos can be found below).
Before training session
- See training videos of spin coating (automatic and manual), exposure (operation and alignment), and development (automatic and manual). The training videos can be found below.
- Study the equipment manuals. The manuals are available in LabManager.
Course Responsible:
The Lithography Group at DTU Danchip: sign up for the course by emailing to lithography@danchip.dtu.dk.
Learning Objectives:
- Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
- Authorization to use spin coater, mask aligner, and developer at DTU Danchip
- Calculate relevant process parameters
- Analyze and apply your results of lithographic processing
Sign up for the course
- send an email to lithography@danchip.dtu.dk
Knowledge and Information
Literature
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UV Exposure
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Development
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