Specific Process Knowledge/Lithography
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Comparing lithography methods at DTU Danchip
UV Lithography | DUV Stepper Lithography | E-beam Lithography | Nano Imprint Lithography | 2-Photon Polymerization Lithography | |
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Generel description | Pattern transfer via UltraViolet (UV) light | Pattern transfer via DeepUltraViolet (DUV) light | Patterning by electron beam | Pattern transfer via hot embossing(HE) | Direct writing via IR laser |
Pattern size range |
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Resist type |
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Resist thickness range |
~0.5µm to 20µm |
~50nm to 2µm |
~30nm to 0.5 µm |
~ 100nm to 2µm |
droplet or coating |
Typical exposure time |
2s-30s pr. wafer |
Process depended, depends on pattern, pattern area and dose |
Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I |
Process depended, depends also on heating and cooling temperature rates |
Process depended, depends on pattern and dose |
Substrate size |
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We have cassettes that fit to
Only one cassette can be loaded at time |
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Allowed materials |
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Equipment Pages
3D Lithography |
Knowledge and Information about Lithography
THIS SECTION IS UNDER CONSTRUCTION
Lithography Tool Package Training
DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom. The course is recommended for all users that intend to perform any lithographic processing in the cleanroom.
Schedule: The tool package consists of a ~3.5 hour lecture and a one-day training session in the cleanroom.
Location: Meeting room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
Qualified Prerequisites:
- Cleanroom safety course at DTU Danchip
- Wet Chemistry Course at DTU Danchip,
- Training videos of spin coating (automatic and manual), exposure, and development (automatic and manual). The training videos can be found below.
Course Responsible: The Lithography Group at DTU Danchip: sign up for the course by emailing to lithography@danchip.dtu.dk.
Learning Objectives
- Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
- Authorization to use spin coater, mask aligner, and developer at DTU Danchip
- Calculate relevant process parameters
- Analyze and apply your results of lithographic processing
Literature
See list of literature below. Also, find training videos and slides from the lecture below.
Literature
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UV Exposure
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Development
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