Specific Process Knowledge/Lithography/Coaters

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Coaters: Comparison Table

Equipment SSE Spinner KS Spinner Spin Track 1 + 2
Purpose
  • Spinning and baking of AZ5214E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of e-beam resist
  • Spinning and baking of AZ5214E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of SU8 resist
  • In-line substrate HMDS priming
  • Coating and baking of AZ MiR 701 (29cps) resist
  • Coating and baking of AZ nLOF 2020 resist
  • Post-exposure baking at 110°C
Performance Substrate handling
  • Cassette-to-cassette
  • Edge handling chuck
  • Single substrate
  • Non-vacuum chuck for fragile substrates
  • Cassette-to-cassette
Permanent media
  • AZ5214E resist
  • AZ4562 resist
  • Acetone for chuck cleaning
  • Acetone for drip pan
  • AZ5214E resist
  • PGMEA for edge bead removal
  • Acetone for chuck cleaning
  • AZ MiR 701 (29cps) resist
  • AZ nLOF 2020 resist
  • PGMEA for backside rinse and edge-bead removal
  • PGMEA for spinner bowl cleaning and vapor tip bath
Manual dispense option
  • 2 automatic syringes
  • yes
  • pneumatic dispense for SU8 resist
  • no
Process parameter range Spindle speed
  • Range
  • Range
  • 10 - 9990 rpm
Parameter 2
  • Range
  • Range
  • Range
Substrates Batch size
  • 24 50 mm wafers
  • 24 100 mm wafers
  • 24 150 mm wafers
  • 1 100 mm wafer
  • 1 150 mm wafer
  • 25 100 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Silicon
  • Glass


SSE Spinner

The SSE spinner MAXIMUS: positioned in Cleanroom 13.

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The SSE spinner MAXIMUS: positioned in Cleanroom 13. SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.

The system is equipped with 2 different resists lines:

  • AZ5214E
  • AZ4562

and

  • 2 syringe lines, which can be used for spinning of e-beam resist.

The user manual, user APV, and contact information can be found in LabManager

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Spin Track 1 + 2

Spin Track 1 + 2 in Cleanroom 3

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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.

The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.

The user manual, user APV, and contact information can be found in LabManager

Process information

Equipment performance and process related parameters

Spin Track 1 2
Purpose
  • HMDS priming
  • Spin coating and soft baking
  • Priming, coating, and baking
  • HMDS priming
  • Spin coating and soft baking
  • Priming, coating, and baking
  • Post-exposure baking
Resist

AZ MiR 701 (29cps)

positive tone

AZ nLOF 2020

negative tone

Performance Coating thickness

1 - 3 µm

1.6 - 5 µm

HMDS contact angle

60 - 90° (on SiO2)

Process parameters Spin speed

10 - 9990 rpm

Spin acceleration

1000 - 50000 rpm/s

Hotplate temperature

90°C

110°C

HMDS priming temperature

50°C

Substrates Substrate size

100 mm wafers

Allowed materials

Silicon (with oxide, nitride, or metal films or patterning)

Glass (borosilicate and quartz)

Batch

1 - 25


KS Spinner

The KS spinner is placed in Cleanroom 3.

At Danchip we have RC8-THP system which is one of the SUSS MicroTech spinners.

The main purpose of this equipment is experimental spinning the different resist.The spinner has one resist line, AZ5214E, for automatic dispense. All other resist dispenses manually from syringe or disposable pipettes. All SU8 spinning are done on this machine.

The machine can be also used for spinning on the "difficult" surfaces like the substrates with holes, backside structures and unusual shapes.


The user manual, user APV, and contact information can be found in LabManager

Manual Spinner 1 (Laurell)

The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.

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III-V Spinner

The III-V spinner is a SÜSS RC8 Spin Coater intended for processing of III-V compound semiconductors and CMOS compatible materals. Please note, that there are different chucks for III-V materials and Si-, SiO2-materials. The spinner is mounted in a flow hood located in the III-V laboratory (yellow room). The extra exhaust should always be turned on while spinning.

You can find the user manual for the spinner on the Labmanager page here.

III-V Aligner positioned in III-V cleanroom


Performance Maximum speed
  • Cover closed: 7000 rpm
  • Cover open: 1000 rpm
  • Gyrset: 3000 rpm
  • non-vaccum chuck: 5000 rpm
Maximum acceleration
  • 5000 rpm/s
Substrate size
  • Maximum substrate size: 6"
  • Minimum substrate size: 3*3 mm2
  • maximum substrate thickness: 4 mm
Allowed Substrate material
  • III-V compound semiconductors
  • CMOS compatible materials
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