Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride: Difference between revisions
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PECVD nitride can be deposited in one of the [[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]] systems. You can run 1-3 wafers at a time depending on which one of the PECVD's you use. The deposition takes place at 300 degrees Celcius. This can be off importance for some applications but it gives a less dense film and the stoichiometry is on the following form: Si<sub>x</sub>N<sub>y</sub>H<sub>z</sub>. The step coverage and thickness uniformity of the film is not as good as for the LPCVD nitride. In one of our PECVD systems (PECVD3) we allow small amounts of metal on the wafers entering the system, this is not allowed in the LPCVD and in the other PECVD (PECVD1). | PECVD nitride can be deposited in one of the [[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]] systems. You can run 1-3 wafers at a time depending on which one of the PECVD's you use. The deposition takes place at 300 degrees Celcius. This can be off importance for some applications but it gives a less dense film and the stoichiometry is on the following form: Si<sub>x</sub>N<sub>y</sub>H<sub>z</sub>. The step coverage and thickness uniformity of the film is not as good as for the LPCVD nitride. In one of our PECVD systems (PECVD3) we allow small amounts of metal on the wafers entering the system, this is not allowed in the LPCVD and in the other PECVD (PECVD1). | ||
==Choose deposition technique== | ==Choose deposition technique== | ||
*[[/Deposition of Silicon Nitride using LPCVD|Deposition of Silicon Nitride using LPCVD]] | *[[/Deposition of Silicon Nitride using LPCVD|Deposition of Silicon Nitride using LPCVD]] | ||
*[[/Deposition of Silicon Nitride using PECVD|Deposition of Silicon Nitride using PECVD]] | *[[/Deposition of Silicon Nitride using PECVD|Deposition of Silicon Nitride using PECVD]] | ||
Revision as of 10:50, 24 October 2007
Deposition of Silicon Nitride can be done with either LPCVD, PECVD or sputter deposition.
Deposition of Silicon Nitride using LPCVD
LPCVD nitride can be made in the LPCVD nitride furnace. It is a batch process meaning you can run a batch of 25 wafers at a time. The deposition takes place at temperatures of 800-850 degrees Celcius. The LPCVD nitride has a good step coverage and the film thickness is very uniform over the wafer. We have two standard LPCVD nitride processes: One for depositing stoichiometric nitride (Si3N4) and one for deposition low stress nitride (SNR).
Deposition of Silicon Nitride using PECVD
PECVD nitride can be deposited in one of the PECVD systems. You can run 1-3 wafers at a time depending on which one of the PECVD's you use. The deposition takes place at 300 degrees Celcius. This can be off importance for some applications but it gives a less dense film and the stoichiometry is on the following form: SixNyHz. The step coverage and thickness uniformity of the film is not as good as for the LPCVD nitride. In one of our PECVD systems (PECVD3) we allow small amounts of metal on the wafers entering the system, this is not allowed in the LPCVD and in the other PECVD (PECVD1).