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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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*Back Side Alignment
*Back Side Alignment
*UV exposure
*UV exposure
OBS: this tool is in PolyFabLab
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Top Side Alignment
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*Maskless UV exposure
*Maskless UV exposure
*Direct laser writing
*Direct laser writing
OBS: this tool is in PolyFabLab
<!--|style="background:WhiteSmoke; color:black"|
<!--|style="background:WhiteSmoke; color:black"|
*UV exposure
*UV exposure
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*350W Hg lamp
*350W Hg lamp
*i-line filter (365nm notch filter)<br>Intensity in Constant Intensity mode:<br>8mW/cm<sup>2</sup> @ 365nm
*i-line filter (365nm bandpass filter)
*303nm filter optional
*303nm filter optional
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*500W Hg-Xe lamp
*500W Hg-Xe lamp
*i-line filter (365nm notch filter)<br>Intensity in Constant Intensity mode:<br>11mW/cm<sup>2</sup> @ 365nm
*i-line filter (365nm bandpass filter)<br>Intensity in Constant Intensity mode:<br>11mW/cm<sup>2</sup> @ 365nm
*UV350 optics optional
*UV350 optics optional
*UV250 optics optional
*UV250 optics optional
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|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 10x10 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 100 mm wafer
*1 150 mm wafer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 10x10 mm<sup>2</sup>
*1 small sample, down to 10x10 mm<sup>2</sup>
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except copper and steel
*All PolyFabLab materials
*Dedicated 2inch chuck for III-V materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except copper and steel
*All cleanroom materials except copper and steel
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'''Training videos:'''
'''Training videos:'''  
<br/>The training videos were made for MA6-2, but operation of MA6-1 is very similar as they are exactly the same model. Due to a different power supply, however, procedures for ignition and intensity control of the lamp is different for MA6-1. Please refer to the manual for the correct procedures.


[https://www.youtube.com/watch?v=o8IBtfQHNzU Operation]
[https://www.youtube.com/watch?v=o8IBtfQHNzU Operation]
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[https://www.youtube.com/watch?v=rvUuXYgw-xU Alignment]
[https://www.youtube.com/watch?v=rvUuXYgw-xU Alignment]


 
The user manual(s), quality control procedure(s) and results, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager]  - '''requires login'''
The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager]  - '''requires login'''


===Exposure dose===
===Exposure dose===
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Link to information about [[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|alignment mark design and locations]].
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|alignment mark design and locations]].


<!--
===Quality Control (QC)===
===Quality Control (QC)===
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
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Power supply and/or lamp will be adjusted if intensity is outside the limit.
Power supply and/or lamp will be adjusted if intensity is outside the limit.
|}
|}
-->


===Equipment performance and process related parameters===
===Equipment performance and process related parameters===
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| style="background:LightGrey; color:black"|Exposure light/filters
| style="background:LightGrey; color:black"|Exposure light/filters
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*broadband (i-, g-, h-line)
*365 nm (i-line)
*365 nm (i-line)
*303 nm
*broadband (i-, g-, h-line), requires tool change
*(303 nm, requires tool change)
|-
|-
|style="background:LightGrey; color:black"|Minimum structure size
|style="background:LightGrey; color:black"|Minimum structure size
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|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*5x5 inch
*5x5 inch
*7x7 inch
*special holder for 4 x 2" designs on 5x5 inch
|-
|-
|style="background:LightGrey; color:black"|Alignment modes
|style="background:LightGrey; color:black"|Alignment modes
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|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
* small pieces 1x1cm
Mask exposure and alignment:
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
Flood exposure:
* samples up to 150 mm wafers
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
All cleanroom materials
All PolyFabLab materials
 
Dedicated chuck for III-V materials
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
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*Minimum distance between TSA microscope objectives: 33 mm (8 mm for special objectives)
*Minimum distance between TSA microscope objectives: 33 mm (8 mm for special objectives)
**Alignment of smaller separations is possible using the "scan microscope" function
*Maximum distance between TSA microscope objectives: 160 mm
*Maximum distance between TSA microscope objectives: 160 mm
*TSA microscope travel range: X +/- 25mm; Y +20mm / -75mm (towards flat)
*TSA microscope travel range: X +/- 25mm; Y +20mm / -75mm (towards flat)
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**2": X +/-  8-22mm; Y +/- 0-6mm
**2": X +/-  8-22mm; Y +/- 0-6mm
**4": X +/- 14-46mm; Y +/- 0-10mm
**4": X +/- 14-46mm; Y +/- 0-10mm
**6": X +/- 14-69mm; Y +/- 0-10mm
**6": X +/- 14-69mm; Y +/- 0-10mm (OBS: Max. separation of BSA microscopes is 100mm)




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*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_01_processing#Alignment|Alignment]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_01_processing#Alignment|Alignment]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_01_processing#Optimal_use_of_the_maskless_aligner|Optimal use of the maskless aligner]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_01_processing#Optimal_use_of_the_maskless_aligner|Optimal use of the maskless aligner]]
===Quality Control (QC)===
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 01 (MLA1) - Dose and Defoc'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=422 The QC procedure for Aligner: Maskless 01 (MLA1)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=422 The newest QC data for Aligner: Maskless 01 (MLA1)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center"
! QC:
! Dose and defocus test on 1.5µm AZ5214E
! QC limits
|-
|Dose test
|
Step size is 5 mJ/cm<sup>2</sup><br>
Test range is last QC value ± 10 mJ/cm<sup>2</sup> (5 steps total)
|none
|-
|Defoc test
|
Step size is 1 defoc<br>
Test range is last QC value ± 4 (5 steps total)
|none
|-
|}
|}
|}
<br/>
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 01 (MLA1) - Alignment'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=422 The QC procedure for Aligner: Maskless 01 (MLA1)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=422 The newest QC data for Aligner: Maskless 01 (MLA1)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center"
! QC Recipe:
! Alignment accuracy test
! QC limits
|-
|Topside alignment
|
Expose an overlay design after automatic alignment to 4 alignment marks using the High Res camera and applying scaling and shearing.<br>
Alignment accuracy in 9 points across a 100mm wafer is measured, the average alignment error is reported.
| Must be better than 1µm
|-
|}
| align="center" valign="top"|
|-
|}
Camera offsets will be adjusted if alignment error is outside the limit.
|}
<br/>


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
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|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
All cleanroom materials
All cleanroom materials
<br>Total height variation across the substrate must be less than ±40 µm - including wafer bow
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
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*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Features|Features]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Features|Features]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Alignment|Alignment]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Alignment|Alignment]]
===Quality Control (QC)===
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 02 (MLA2) - Dose and Defoc'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=440 The QC procedure for Aligner: Maskless 02 (MLA2)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=440 The newest QC data for Aligner: Maskless 02 (MLA2)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"
! QC Recipe:
! Dose and defocus test on 1.5µm AZ5214E
|-
|Dose test
|Last QC value ± 20 mJ/cm<sup>2</sup> (9 steps total)
|-
|Defoc test
|Last QC value ± 8 (9 steps total)
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Aligner: Maskless 02 (MLA2)
|-
|Dose
|none
|-
|Defoc
|none
|-
|}
|-
|}
Dose and defoc values are reported in the QC data sheet.
|}
<br/>
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 02 (MLA2) - Alignment'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=440 The QC procedure for Aligner: Maskless 02 (MLA2)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=440 The newest QC data for Aligner: Maskless 02 (MLA2)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"
! QC Recipe:
! Alignment accuracy test
|-
|Topside alignment
|Expose an overlay design after automatic alignment to 4 alignment marks using the High Res camera and applying scaling and shearing.
Alignment accuracy in 9 points across a 100mm wafer is measured, the average alignment error is reported.
|-
|Backside alignment
|Expose an overlay design after automatic alignment to 4 backside alignment marks and applying scaling and shearing. Rotate the wafer 180° and repeat.
Alignment accuracy in 9 points across a 100mm wafer is measured, half the average alignment error is reported.
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Aligner: Maskless 02 (MLA2)
|-
|Topside alignment error
|>0.5µm
|-
|Backside alignment error
|>1µm
|-
|}
|-
|}
Camera offsets will be adjusted if alignment error is outside the limit.
|}
<br/>


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
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|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
All cleanroom materials
All cleanroom materials
<br>Total height variation across the substrate must be less than ±90 µm - including wafer bow
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
Line 684: Line 824:


==Aligner: Maskless 03==
==Aligner: Maskless 03==
[[File:Aligner MLA 3.jpg|400px|thumb|Aligner: Maskless 03 is located in E-5.]]
MLA150 WMII maskless aligner from Heidelberg Instruments GmbH, installed 2020.
MLA150 WMII maskless aligner from Heidelberg Instruments GmbH, installed 2020.


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*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Features|Features]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Features|Features]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Alignment|Alignment]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Alignment|Alignment]]
===Quality Control (QC)===
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 03 (MLA3) - Dose and Defoc'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=464 The QC procedure for Aligner: Maskless 03 (MLA3)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=464 The newest QC data for Aligner: Maskless 03 (MLA3)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"
! QC Recipe:
! Dose and defocus test on 1.5µm AZ5214E
|-
|Dose test
|Last QC value ± 20 mJ/cm<sup>2</sup> (9 steps total)
|-
|Defoc test
|Last QC value ± 8 (9 steps total)
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Aligner: Maskless 03 (MLA3)
|-
|Dose
|none
|-
|Defoc
|none
|-
|}
|-
|}
Dose and defoc values are reported in the QC data sheet.
|}
<br/>
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 03 (MLA3) - Alignment'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=464 The QC procedure for Aligner: Maskless 03 (MLA3)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=464 The newest QC data for Aligner: Maskless 03 (MLA3)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"
! QC Recipe:
! Alignment accuracy test
|-
|Topside alignment
|Expose an overlay design after automatic alignment to 4 alignment marks using the High Res camera and applying scaling and shearing.
Alignment accuracy in 9 points across a 100mm wafer is measured, the average alignment error is reported.
|-
|Backside alignment
|Expose an overlay design after automatic alignment to 4 backside alignment marks and applying scaling and shearing. Rotate the wafer 180° and repeat.
Alignment accuracy in 9 points across a 100mm wafer is measured, half the average alignment error is reported.
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Aligner: Maskless 03 (MLA3)
|-
|Topside alignment error
|>0.5µm
|-
|Backside alignment error
|>1µm
|-
|}
|-
|}
Camera offsets will be adjusted if alignment error is outside the limit.
|}
<br/>


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
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|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
All cleanroom materials
All cleanroom materials
<br>Total height variation across the substrate must be less than ±90 µm - including wafer bow
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
Line 773: Line 995:


== Aligner: Maskless 04 ==
== Aligner: Maskless 04 ==
<!--
[[Image:Heidelberg_uMLA.JPG|400px|thumb|Aligner: Maskless 04 is located in PolyFabLab in building 347.]]
<span style="background:#FF2800">THIS SECTION IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]
-->
 
[[Image:Heidelberg_uMLA.JPG|400px|thumb|Aligner: Maskless 04 is locted in PolyFabLab in building 347.]]


The logon password for the PC is "mla" (without quotation marks).
The logon password for the PC is "mla" (without quotation marks).
Line 856: Line 1,074:
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
All PolyFabLab materials with sufficient stiffness and flatness.
All PolyFabLab materials with sufficient stiffness and flatness.
<br>Total height variation across the substrate must be less than ±80 µm - including wafer bow
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/UVExposure"