Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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NMP (Remover 1165) | Lift-off bath with NMP (Remover 1165) | ||
Rinse bath with diluted IPA | |||
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User defined | User defined | ||
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*NMP (Remover 1165) | *NMP (Remover 1165) | ||
*Rinse in IPA | *Rinse in diluted IPA | ||
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!style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | ||
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'''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image. | '''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image. | ||
'''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min) right before metal depositions. | '''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min (Plasma Asher 1)) right before metal depositions. | ||
[[File:Delamination of TiAu.jpg|thumb]] | [[File:Delamination of TiAu.jpg|thumb]] | ||
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3.) Development of nLOF | 3.) Development of nLOF | ||
'''4.) 5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min in Plasma Asher 1) was done right before TiAu deposition''' | |||
5.) 10 nm Ti depositing with 2 A/s by Temescal | 5.) 10 nm Ti depositing with 2 A/s by Temescal | ||