Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

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-NMP (Remover 1165) / Rinse in IPA
+Lift-off bath with NMP (Remover 1165)
+Rinse bath with diluted IPA
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 *NMP (Remover 1165)
-*Rinse in IPA
+*Rinse in diluted IPA
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 !style="background:silver; color:black" valign="center" rowspan="2"|Process parameters
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 ''This experiment was done by Mathias Zambach (zambach@fysik.dtu.dk) in June 2024''
-Mathias experienced the delamination of TiAu after the lift-off process.
+'''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image.
+'''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min (Plasma Asher 1)) right before metal depositions.
 [[File:Delamination of TiAu.jpg|thumb]]
+The process flow:
+.) 2 um nLOF coating
+.) Exposure
+.) Development of nLOF
+'''4.) 5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min in Plasma Asher 1) was done right before TiAu deposition'''
+.) 10 nm Ti depositing with 2 A/s by Temescal
+.) 200 nm Au depositing with 2 A/s by Temescal
+.) Lift-off (approx. 45 min)
--2 um nLOF coating
+By adding step 4.) 5 min Descum, the problem with  the delamination of metals was solved.
--Exposure
--Development of nLOF
--5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min) was done right before TiAu deposition
-- 10 nm Ti deponering with 2 A/s by Temescal
-- 200 nm Au deponering with 2A/s by Temescal
-- Lift-off (ca 45 min)