Specific Process Knowledge/Thin film deposition: Difference between revisions
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<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | |||
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{| {{table}} | {| {{table}} | ||
| align="left" valign="top" style="background:LightGray"|''' | | align="left" valign="top" style="background:LightGray"|''' Semiconductors''' | ||
| align="left" valign="top" style="background:#DCDCDC | | align="left" valign="top" style="background:#DCDCDC"|''' Oxides''' | ||
| align="left" valign="top" style="background:LightGray"|''' Nitrides''' | |||
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides''' | |||
| align="left" valign="top" style="background:LightGray"|''' Metals''' | | align="left" valign="top" style="background:LightGray"|''' Metals''' | ||
| align="left" valign="top" style="background:#DCDCDC | | align="left" valign="top" style="background:#DCDCDC"|''' Alloys''' | ||
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides''' | | align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides''' | ||
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers''' | | align="left" valign="top" style="background:#DCDCDC"|''' Polymers''' | ||
| align="left" valign="top" style="background:LightGray"|''' Multilayers''' | |||
|-valign="top" | |-valign="top" | ||
|style="background: LightGray"| | |||
[[/Deposition of Silicon|Silicon]] <br/> | |||
[[/Deposition of Germanium|Germanium]] <br/> | |||
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[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/> | |||
[[/Sputter deposition of oxides and other compounds|Barium titanate (BaTiO<sub>3</sub>)]]<br/> | |||
[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/> | |||
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/> | |||
[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/> | |||
[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/> | |||
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/> | |||
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/> | |||
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/> | |||
[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/> | |||
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/> | |||
|style="background: LightGray"| | |style="background: LightGray"| | ||
[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/> | [[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/> | ||
[[/Deposition of | [[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/> | ||
[[/Deposition of Titanium | [[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/> | ||
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
[[/ | [[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
[[/Deposition of | [[/Deposition of Carbon|Carbon]] <br/> | ||
[[/Deposition of | <!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> --> | ||
[[/Deposition of | [[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/> | ||
[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/> | |||
|style="background: LightGray"| | |style="background: LightGray"| | ||
[[/Deposition of Aluminium|Aluminium]] <br/> | [[/Deposition of Aluminium|Aluminium]] <br/> | ||
[[/Deposition of Chromium|Chromium]]<br/> | [[/Deposition of Chromium|Chromium]]<br/> | ||
[[/Deposition of Copper|Copper]]<br/> | [[/Deposition of Copper|Copper]]<br/> | ||
[[/Deposition of Gold|Gold]]<br/> | [[/Deposition of Gold|Gold]]<br/> | ||
[[/ | [[/Sputter deposition of metals and alloys|Iron]]<br/> | ||
[[/ | [[/Deposition of Magnesium|Magnesium]]<br/> | ||
[[/Deposition of Molybdenum|Molybdenum]]<br/> | [[/Deposition of Molybdenum|Molybdenum]]<br/> | ||
[[/Deposition of Nickel|Nickel]]<br/> | [[/Deposition of Nickel|Nickel]]<br/> | ||
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[[/Deposition of Tungsten|Tungsten]]<br/> | [[/Deposition of Tungsten|Tungsten]]<br/> | ||
[[/Deposition of Zinc|Zinc]]<br/> | [[/Deposition of Zinc|Zinc]]<br/> | ||
[[/Deposition of Scandium|Scandium]]<br/> | |||
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[[/Sputter deposition of metals and alloys|AlCu]]<br/> | |||
[[/Sputter deposition of metals and alloys|CuTi]]<br/> | |||
[[/Sputter deposition of metals and alloys|FeMn]]<br/> | |||
[[/Sputter deposition of metals and alloys|MnIr]]<br/> | |||
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/> | |||
[[/Deposition of NiFe|NiFe]]<br/> | |||
[[/Deposition of NiV|NiV]] alloy <br/> | |||
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | ||
[[/ | |||
[[/ | And an electroceramic: | ||
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/> | |||
[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]] | |||
|style="background: LightGray"| | |style="background: LightGray"| | ||
[[/ | [[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/> | ||
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/> | [[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/> | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/> | [[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/> | ||
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Topas <br/> | Topas <br/> | ||
PMMA | PMMA | ||
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[[/Deposition of CrSi|CrSi bilayer]] <br/> | |||
|- | |- | ||
|} | |} | ||
Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here. | |||
== Choose deposition equipment == | == Choose deposition equipment == | ||
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{| {{table}} | {| {{table}} | ||
| align="left" valign="top" style="background:LightGray"|''' PVD''' | | align="left" valign="top" style="background:LightGray"|''' PVD - Physical vapor deposition''' | ||
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD''' | | align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition''' | ||
| align="left" valign="top" style="background:LightGray"|''' PECVD''' | | align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition''' | ||
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD''' | | align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition''' | ||
| align="left" valign="top" style="background:LightGray"|''' Coaters''' | | align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers''' | ||
| align="left" valign="top" style="background:#DCDCDC;"|''' Others''' | | align="left" valign="top" style="background:#DCDCDC;"|''' Others''' | ||
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|-valign="top" | |-valign="top" | ||
|style="background: LightGray"| | |style="background: LightGray"| | ||
[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter- | *[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system'' | ||
*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[/thermalevaporator|Thermal evaporator]] | *[[/thermalevaporator|Thermal evaporator]] | ||
*[[/Temescal|E Beam Evaporator (Temescal)]] | *[[/Temescal|E-Beam Evaporator (Temescal)]] | ||
*[[/ | *[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]] | ||
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system'' | *[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system'' | ||
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system'' | *[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system'' | ||
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*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool'' | *[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool'' | ||
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool'' | *[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool'' | ||
*[[/Physimeca|Physimeca]] - ''E-beam evaporator'' | |||
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' --> | *[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' --> | ||
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|style="background: LightGray"| | |style="background: LightGray"| | ||
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||
<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''--> | |||
*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth'' | |||
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*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal) | *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal) | ||
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*[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | *[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | ||
* | *Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering'' | ||
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]'' | |||
*MOCVD - Epitaxial growth - ''Ask | |||
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|} | |} |
Latest revision as of 09:43, 29 August 2024
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Choose material to deposit
Semiconductors | Oxides | Nitrides | Carbon and Carbides | Metals | Alloys | Transparent conductive oxides | Polymers | Multilayers |
Aluminium Oxide (Al2O3)
|
Silicon Nitride - and oxynitride
|
Carbon
|
Aluminium
|
AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.
Choose deposition equipment
PVD - Physical vapor deposition | LPCVD - low pressure chemical vapor deposition | PECVD - plasma enhanced chemical vapor deposition | ALD - atomic layer deposition | Coaters - for polymers | Others
|
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|
|
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See the Lithography/Coaters page for coating polymers |
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