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<center><span style="background:Yellow">2nd Level - Process Topic</span></center>
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''




=== Choose the process topic you are interested in ===
=== Choose the process topic you are interested in: ===
*[[/Pattern Design|Pattern Design and Mask Fabrication]]


*[[/Back-end processing|Back-end processing]]
*[[/Back-end processing|Back-end processing]]
*[[/Bonding|Bonding]]


*[[/Characterization|Characterization]]
*[[/Characterization|Characterization]]
Line 18: Line 20:


*[[/Lithography|Lithography]]
*[[/Lithography|Lithography]]
<!--
*[[/Photolithography|Photolithography]]
-->


*[[/Thermal Process|Thermal Process]]
*[[/Thermal Process|Thermal Process]]
Line 27: Line 26:


*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Bonding|Wafer Bonding]]


*[[/Wafer cleaning|Wafer Cleaning]]
*[[/Wafer cleaning|Wafer Cleaning]]
Line 34: Line 31:
*[[/Wafer Information|Wafer Information]]
*[[/Wafer Information|Wafer Information]]


*[[/Materials|Materials]]
*[[/Overview of Fume Hoods|Overview of Fume Hoods]]
 
*[[/III-V Process|III-V Process]]
 
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
 
<!--
==Overview of sample processing 3==
 
{| {{Table}}
|- valign="top"
 
 
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Clean your sample.png|x100px|Clean your sample]] <br/> Clean your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
|-
|
|7-up & Piranha
|Removes organics and alkali ions
|-
|
|RCA
|Two step process to remove organics and metals
|-
|
|5% HF
|Removes native oxide
|-
|
|IMEC
|Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|}
|
{| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2"  align="right"
! [[image:Dry your sample.png|x100px|Dry your sample]] <br/> Dry your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|Spin dryers
|Whole wafers
|-
|
|Critial point dryer
|Sensitive wafers
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Create a film on your sample.png|thumb|100px|Create a layer/film on your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|Thermal oxidation
|Thermal SiO2
|-
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
|
|
|-
|
|Sputter deposition
|Si,SiO2,Si3N3,TiO2, metals
|-
|
|Thermal evaporation
|Al, ?
|-
|
|E-beam evaporation
|Metals
|-
|
|LPCVD
|Si3N4, SRN, SiO2, Si (poly and amorph)
|-
|
|PECVD
|Si3N4, SiO2, PBSG
|-
|
|Electroplating
|Ni
|-
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|
|
|-
|
|Spin coating
|resists, polymers
|-
|
|Spray coating
|resists, polymers
|-
|Epitaxial growth
|MOCVD
|?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Dope your sample.png|thumb|100px|Dope your sample]]
|-
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
|PECVD
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
|-
|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
|LPCVD
|Deposition of PolySi doped with B or P
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
|Predeposition and drive-in
|Doping Silicon wafers with boron
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
|Predeposition and drive-in
|Doping Silicon wafers with phosphorus
 
|-
|[[Specific Process Knowledge/Doping|Doping]]
|Ion implant
|?
|-
|}
|-
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Thermal treat your sample.png|thumb|100px|Thermal treatment of your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process|Thermal Process]]
|Annealing
|Si, PECVD layers
|-
|
|Oxidation
|Si wafers
|-
|
|Doping with B/P
|Si wafers
|-
|
|Pyrolysis
|Resists?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Make a mask on your sample.png|thumb|100px|Make a mask on your sample]]
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Lithography| Lithography]]
|
|-
|
|Photolithography
|-
|
|Deep UV lithography
|-
|
|E-beam lithography
|-
|
|Imprinting
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Transfer mask pattern to your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Etch| Etch]]
|
|
|-
|
|Wet etch
|Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
|-
|
|Dry etch
|Any material
|-
|[[Specific Process Knowledge/Lithography/LiftOff| Lift-off]]
|
|?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Define your structure directly.png|thumb|100px|Define your structure directly to your sample]]
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
|-
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Bond your samples together.png|thumb|100px|Bond your samples together]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Characterize your sample.png|thumb|100px|Characterize your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Pack your sample (back-end).png|thumb|100px|Pack your sample (back-end)]]
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}
|
|-
|}
-->
 
== Overview of sample processing ==
{| style="color: black;vertical-align:top" width="100%" border=0 cellpadding="4" cellspacing="0"
| colspan="2" |
|-
| style="width: 50%; vertical-align:top"|
{| id="linkTable" border="1" cellpadding="0" cellspacing="0" style="text-align:center;"
|-
! class="hideImage" width="150" height="180px"| Clean your sample[[file:jehanClean.png|130px|frameless ]]  
! class="hideImage" width="150" | Dry your sample [[file:jehanDry.png|130px|frameless  ]]
! class="hideImage" width="150" | Create a thin film on your sample [[file:jehanfilm.png|130px|frameless  ]]
! class="hideImage" width="150" | Dope your sample [[file:jehanDope.png|130px|frameless ]]
|-
! class="hideImage" width="150" height="180px"| Thermal treatment of your sample [[file:jehanThermal.png|130px|frameless ]]
! class="hideImage" width="150" | Make a mask on your sample[[file:jehanmask.png|130px|frameless ]]
! class="hideImage" width="150" | Transfer pattern to your sample [[file:jehanTransfer.png|130px|frameless ]]
! class="hideImage" width="150" | Define your structure directly [[file:jehandefine.jpg|130px|frameless ]]
|-
! class="hideImage" width="150" height="180px"|  Bond your samples together [[file:jehanBond.png|130px|frameless ]]
! class="hideImage" width="150" | Characterize your sample  [[file:jehanCharacterize.png|130px|frameless ]]
! class="hideImage" width="150" | Pack your sample  [[file:jehanPack.png|130px|frameless ]]
! | &nbsp;
|-
|}
 
 
| style="color:black; width: 50%; vertical-align: top"|
{| class="wikitable hideable hidden" border="1" cellspacing="0" cellpadding="0"  align="left" width="430px"
! colspan="3" style="text-align:left;" | [[image:Clean your sample.png|x100px|Clean your sample]] Clean your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top" |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
|-
|7-up & Piranha
|Removes traces of organics and alkali ions
|-
|RCA
|Two step process to remove traces of organics and metals
|-
|5% HF
|Removes native oxide
|-
|IMEC
|Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dry your sample.png|x100px|Dry your sample]] Dry your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="4" valign="top" |[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|Spin dryers
|Whole wafers
|-
|Critial point dryer
|Sensitive wafers
|-
|Ethanol fume drying
|Sensitive wafers
|-
|N2 blow drying
|N2 pistols
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="600px"
!colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|Thermal oxidation
|Thermal SiO2
|-
|rowspan="7" valign="top"|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
|Sputter deposition
|Metals: Ti, Cu, Al, Cr, Ag, Au, Pd, Ta, Cu, Ta, W, Mo, Co, Fe, Pt, Mg, Nb, Ni, Ru <br>
Semiconductors: Si, Ge <br>
Oxides: SiO2, ITO, ZnO, Al2O3, Cr2O3, MgO, Ta2O3 <br>
Alloys: NiV, MnIr, NiFe, AlCu, CoFe, CuTi, FeMn, NiCo, TiW <br>
|-
|Thermal evaporation
|Al, Ge, Ag
|-
|E-beam evaporation
|Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Pd, Ag, Cu, W, Ta <br>
Semiconductors: Si, Ge <br>
Oxides: SiO2, TiOs <br>
Alloys: NiCr, TiAl
|-
|LPCVD
|Si3N4, SRN, SiO2, Si (poly and amorph)
|-
|PECVD
|Si3N4, SiO2, PBSG
|-
|Electroplating
|Ni
|-
|Epitaxial growth /MOCVD
|?
|-
|rowspan="2" valign="top"| [[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|Spin coating
|resists, polymers
|-
|Spray coating
|resists, polymers
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dope your sample.png|x100px|Dope your sample]] Dope your sample
|-
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"| [[Specific Process Knowledge/Doping|Doping]]
|Ion implant
|?
|-
|[[Specific Process Knowledge/Thin film deposition/PECVD| PECVD]]
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
|-
|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|LPCVD ]]
|Deposition of PolySi doped with B or P
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Predeposition and drive-in]]
|Doping Silicon wafers with boron
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Predeposition and drive-in]]
|Doping Silicon wafers with phosphorus
 
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Thermal treat your sample.png|x100px|Thermal treatment of your sample]] Thermal treatment of your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"|[[Specific Process Knowledge/Thermal Process|Thermal Process]]
|Annealing (>350C)
|Si, PECVD layers, Al, BCB curing, Polymer
|-
|Oxidation
|Si wafers
|-
|Doping with B/P
|Si wafers
|-
|Pyrolysis
|Resists: AZ, SU8, PDMS
|-
|Rapid Thermal Anneal (RTP)
|SiO2, Si3N4, Ti, III-V
|-
|
[[Specific Process Knowledge/Lithography/Baking| Lithography/Baking]] <br>
[[Specific Process Knowledge/Lithography/Pretreatment#Oven_250C|Lithography/Pretreatment#Oven_250C]]
|Baking (<300dg)
|baking resist and polymers
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Make a mask on your sample.png|x100px|Make a mask on your sample]] Make a mask on your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="4" valign="top"|[[Specific Process Knowledge/Lithography| Lithography]]
|Photolithography
|UV resists
|-
|Deep UV lithography
|DUV resists
|-
|E-beam lithography
|E-beam resists
|-
|Imprinting
|Polymers
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Transfer mask pattrn to your sample.png|x100px|Transfer mask pattern to your sample]] Transfer mask pattern to your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Etch| Etch]]
|
|
|-
|
|Wet etch
|Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
|-
|
|Dry etch
|Any material
|-
|[[Specific Process Knowledge/Lithography/LiftOff| Lithography/Lift-off]]
|Lift-off
|Most materials
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Define your structure directly.png|x100px|Define the structure directly on your sample]] Define your structure directly
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
|
|
|-
|
|Polymer Injection molding
|
TOPAS
|-
|
|
LASER micro machining
|
Silicon, Metal, Graphene (on silicon), Glass (Pyrex, fused silica), TOPAS, PMMA
|-
|
|
Dicing saw
|
Silicon, Glass (Pyrex, fused silica)
|-
|[[Specific Process Knowledge/Imprinting|Imprinting]]
|Imprinting
|
TOPAS, PMMA
|-
|[[Specific Process Knowledge/Lithography|Lithography]]
|Lithographic definition
|   
SU8, AZ resists
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Bond your samples together.png|x100px|Bond your samples together]] Bond your samples together
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Bonding|Bonding]]
|Eutectic bonding
|-
|
|Fusion bonding
|-
|
|Anodic bonding
|-
|[[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding |Etch/DryEtchProcessing/Bonding]]
|Temporary bonding of wafers or chips for dry etching
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Characterize your sample.png|x100px|Characterize your sample]] Characterize your sample
|-
!Entry page in LabAdviser
!What do you need to measure?
!Technique/Method
|-
|[[Specific Process Knowledge/Characterization|Characterization]]
|Sample Imaging, XY dimensions
|Microscopy: optical, SEM, AFM
|-
|
|Sample Topography
|AFM, Profiling with stylus or optical
|-
|
|Film thickness and optical constants
|Ellipsometry, Reflectometry, Prism Coupling
|-
|
|Film Stress
|Profiling with stylus or optical
|-
|
|Wafer thickness
|Micrometer gauge
|-
|
|Element analysis
|XPS, EDX, SIMS
|-
|
|Contact Angle
|
|-
|
|Resistivity
|Four point probe, Probe station
|-
|
|Doping level/Carrier density
|ECV (Electrochemical Capacitance-Voltage) -profiler
|-
|
|Direct Bandgap
|Photoluminescence
|-
|
|Lattice mismatch
|X-ray diffractometer
|-
|
|Defects/contamination
|Particle/defect counter
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Pack your sample (back-end).png|x100px|Pack your sample (back-end)]] Pack your sample (back-end)
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Back-end processing|Back-end processing]]
|Chip/die mounting
|-
|
|Wire bonding
|-
|
|Dicing
|-
|}
|
|-
|}
 
<!--
==Overview of sample processing 5==
 
{| {{Table}}
|- valign="top"
 
 
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" width="430px"
! colspan="3" style="text-align:left;" | [[image:Clean your sample.png|x100px|Clean your sample]] Clean your sample
|-
!Techniques
!Materials
!Entry page in LabAdviser
|-
|Soap Sonic
|Removes dust and particles
|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|-
|7-up & Piranha
|Removes organics and alkali ions
|
|-
|RCA
|Two step process to remove organics and metals
|
|-
|5% HF
|Removes native oxide
|
|-
|IMEC
|Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|
|-
|}
|
{| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dry your sample.png|x100px|Dry your sample]] Dry your sample
|-
!Techniques
!Materials
!Entry page in LabAdviser
|-
|Spin dryers
|Whole wafers
|[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|-
|Critial point dryer
|Sensitive wafers
|
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample
|-
!Techniques
!Materials
!Entry page in LabAdviser
|-
|Thermal oxidation
|Thermal SiO2
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|-
|Sputter deposition
|Si,SiO2,Si3N3,TiO2, metals
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
|-
|Thermal evaporation
|Al, ?
|
|-
|E-beam evaporation
|Metals
|
|-
|LPCVD
|Si3N4, SRN, SiO2, Si (poly and amorph)
|
|-
|PECVD
|Si3N4, SiO2, PBSG
|
|-
|Electroplating
|Ni
|
|-
|Epitaxial growth /MOCVD
|?
|
|-
|Spin coating
|resists, polymers
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|-
|Spray coating
|resists, polymers
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|-
|}
|- valign="top"
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dope your sample.png|x100px|Dope your sample]] Dope your sample
|-
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
|PECVD
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
|-
|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
|LPCVD
|Deposition of PolySi doped with B or P
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
|Predeposition and drive-in
|Doping Silicon wafers with boron
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
|Predeposition and drive-in
|Doping Silicon wafers with phosphorus
 
|-
|[[Specific Process Knowledge/Doping|Doping]]
|Ion implant
|?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Thermal treat your sample.png|x100px|Thermal treatment of your sample]] Thermal treatment of your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process|Thermal Process]]
|Annealing
|Si, PECVD layers
|-
|
|Oxidation
|Si wafers
|-
|
|Doping with B/P
|Si wafers
|-
|
|Pyrolysis
|Resists?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Make a mask on your sample.png|x100px|Make a mask on your sample]] Make a mask on your sample
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Lithography| Lithography]]
|
|-
|
|Photolithography
|-
|
|Deep UV lithography
|-
|
|E-beam lithography
|-
|
|Imprinting
|-
|}
|- valign="top"
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Transfer mask pattrn to your sample.png|x100px|Transfer mask pattern to your sample]] Transfer mask pattern to your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Etch| Etch]]
|
|
|-
|
|Wet etch
|Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
|-
|
|Dry etch
|Any material
|-
|[[Specific Process Knowledge/Lithography/LiftOff| Lithography/Lift-off]]
|
|?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Define your structure directly.png|x100px|Define the structure directly on your sample]] Define your structure directly
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Imprinting|Imprinting]]
|Imprinting
|Polymers
|-
|[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
|LASER machining
|
|-
|[[Specific Process Knowledge/Lithography|Lithography]]
|Lithographic definition
|Resists
|-
|[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
|Polymer Injection molding
|Polymers
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Bond your samples together.png|x100px|Bond your samples together]] Bond your samples together
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Bonding|Bonding]]
|Eutectic bonding
|
|-
|
|Fusion bonding
|
|-
|
|Anodic bonding
|
|-
|}
|- valign="top"
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Characterize your sample.png|x100px|Characterize your sample]] Characterize your sample
|-
!Entry page in LabAdviser
!What do you need to measure?
!Technique/Method
|-
|[[Specific Process Knowledge/Characterization|Characterization]]
|Sample Imaging, XY dimensions
|Microscopy: optical,SEM,AFM
|-
|
|Sample Topography
|AFM,Profiling with stylus or optical
|-
|
|Film thickness and optical constants
|Ellipsometry,Reflectometry,Prism Coupling
|-
|
|Film Stress
|Profiling with stylus or optical
|-
|
|Wafer thickness
|
|-
|
|Element analysis
|XPS,EDX,SIMS
|-
|
|Contact Angle
|
|-
|
|Resistivity
|Four point probe
|-
|
|Doping level/Carrier density
|
|-
|
|Photoluminescence
|
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Pack your sample (back-end).png|x100px|Pack your sample (back-end)]] Pack your sample (back-end)
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Back-end processing|Back-end processing]]
|Chip/die mounting
|-
|
|Wire bonding
|-
|
|Dicing
|-
|}
|
|-
|}


*[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]]


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