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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Physimeca click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Physimeca click here]'''  
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


[[Category: Equipment|Thin film Physimeca]]
[[Category: Equipment|Thin film Physimeca]]
[[Category: Thin Film Deposition|Physimeca]]
[[Category: Thin Film Deposition|Physimeca]]


== Physimeca ==
== Physimeca - <span style="color:Red"> This tool has been decommissioned</span>==
[[image:Physimeca.jpg|430x430px|right|thumb|The Physicmeca, placed in the III-V laboratory, cleanroom A-5.]]
[[image:Physimeca.jpg|430x430px|right|thumb|The Physicmeca, Located in cleanroom B-1.]]


Physimeca is a system for deposition of metals through electron-beam evaporation, intended for III-V processing.  
Physimeca is a system for deposition of metals through electron-beam evaporation.






Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples of different sizes and shapes. It will also take samples of almost any shape as long as they can fit on the sample holders; there are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.
Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples up to 4 inch wafer. There are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.


Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (thinfilm@danchip.dtu.dk) if you have wishes for other metals.
Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (Metal@nanolab.dtu.dk) if you have wishes for other metals.
   
   


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<br clear="all" />
<br clear="all" />


==Equipment performance and process related parameters Physimeca==
==Equipment performance and process related parameters Physimeca==
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|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
*10 Å - 5000 Å*
*10 Å - 5000 Å*
|-
|-
|style="background:LightGrey; color:black"|Available metals and deposition rates (Å/s)
|style="background:LightGrey; color:black"|Available metals and deposition rates (Å/s)
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*Silver (Ag)
*Silver (Ag)
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|  
|style="background:WhiteSmoke; color:black"|  
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|style="background:WhiteSmoke; color:black"|  
|style="background:WhiteSmoke; color:black"|  
* 2x10<sup>-6</sup> mbar
* 2x10<sup>-6</sup> mbar
|-
|style="background:LightGrey; color:black"|Distance between e-beam and substrate
|style="background:WhiteSmoke; color:black"|
* 46 cm
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Sample size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*2 or 4" wafers
*one 2" or 4" wafers
*Or several smaller pieces
*Or several smaller pieces


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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*III-V materials
*III-V materials
*Si
|-  
|-  
| style="background:LightGrey; color:black"|Materials allowed on the substrate
| style="background:LightGrey; color:black"|Materials allowed on the substrate
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|}
|}


'''*''' ''For thicknesses above 2000 Å special permission is required (contact thinfilm@danchip.dtu.dk).''
'''*''' ''For thicknesses above 2000 Å special permission is required (contact thinfilm@nanolab.dtu.dk).''


== [[/Physimeca_calibration|Calibration of Physimeca]] '' - for experienced users only'' ==
== [[/Physimeca_calibration|Calibration of Physimeca]] '' - for experienced users only'' ==

Latest revision as of 09:45, 6 June 2023

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

Physimeca - This tool has been decommissioned

The Physicmeca, Located in cleanroom B-1.

Physimeca is a system for deposition of metals through electron-beam evaporation.


Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples up to 4 inch wafer. There are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.

Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (Metal@nanolab.dtu.dk) if you have wishes for other metals.


The user manual and contact information can be found in LabManager:

Physimeca in LabManager



Equipment performance and process related parameters Physimeca

Purpose Deposition of metals
  • E-beam evaporation of metals
Performance Film thickness
  • 10 Å - 5000 Å*
Available metals and deposition rates (Å/s)
  • Gold (Au) 10
  • Chromium (Cr) 5
  • Platinum (Pt) 5
  • Titanium (Ti) 5
  • Nickel (Ni) 5
  • Germanium (Ge) 5
  • Palladium (Pd) 5
  • Silver (Ag)
Process parameter range Process Temperature
  • Less then 80 oC
Process pressure
  • 2x10-6 mbar
Distance between e-beam and substrate
  • 46 cm
Substrates Sample size
  • one 2" or 4" wafers
  • Or several smaller pieces
Substrate material allowed
  • III-V materials
  • Si
Materials allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar

* For thicknesses above 2000 Å special permission is required (contact thinfilm@nanolab.dtu.dk).

Calibration of Physimeca - for experienced users only

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