Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner - Revision history

Mmat at 15:06, 10 June 2025

2025-06-10T15:06:56Z

← Older revision		Revision as of 17:06, 10 June 2025
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			{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''

	~~'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''~~

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Mbec at 11:57, 13 February 2023

2023-02-13T11:57:44Z

← Older revision		Revision as of 13:57, 13 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''

	'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''		'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

Mbec at 13:08, 1 February 2023

2023-02-01T13:08:09Z

← Older revision		Revision as of 15:08, 1 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''

			'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

			'''All links to Labmanager requires login.'''


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	[[image:post cmp cleaner.jpg\|400px\|right\|thumb\|The Post CMP CLeaner in cleanroom A-5]]		[[image:post cmp cleaner.jpg\|400px\|right\|thumb\|The Post CMP CLeaner in cleanroom A-5]]

	The post CMP Cleaner is designed for removing slurry residues from polishing wafers. ~~After the~~ Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.		The post CMP Cleaner is designed for removing slurry residues from polishing wafers. The Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.

Rkch: /* Post CMP Cleaner) */

2020-04-21T07:41:26Z

Post CMP Cleaner)

← Older revision		Revision as of 09:41, 21 April 2020
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	== Post CMP Cleaner) ==		== Post CMP Cleaner) ==

	[[image:~~Cmp_picture~~.jpg\|400px\|right\|thumb\|The Post CMP CLeaner in cleanroom A-5]]		[[image:post cmp cleaner.jpg\|400px\|right\|thumb\|The Post CMP CLeaner in cleanroom A-5]]

	The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.		The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.

Rkch: /* Equipment performance and process related parameters */

2020-04-21T07:35:48Z

Equipment performance and process related parameters

@@ Line 35: / Line 35: @@
 *Purpose 3 -->
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range

Rkch: /* Equipment performance and process related parameters */

2020-04-21T07:34:32Z

Equipment performance and process related parameters

← Older revision		Revision as of 09:34, 21 April 2020
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	<!-- \|style="background:WhiteSmoke; color:black"\|		<!-- \|style="background:WhiteSmoke; color:black"\|
	*Performance range -->		*Performance range -->
			\|-
			!style="background:silver; color:black" align="center" valign="center" rowspan="4"\|Process parameter range
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Mechanical Cleaning		\|style="background:LightGrey; color:black"\|Mechanical Cleaning

Rkch: /* Equipment performance and process related parameters */

2020-04-21T07:33:00Z

Equipment performance and process related parameters

← Older revision		Revision as of 09:33, 21 April 2020
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	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>~~Polisher/Lapper~~</b>		\|style="background:WhiteSmoke; color:black"\|<b>Post CMP Cleaner</b>
	<!-- \|style="background:WhiteSmoke; color:black"\|<b>Equipment 2</b> -->		<!-- \|style="background:WhiteSmoke; color:black"\|<b>Equipment 2</b> -->
	\|-		\|-
	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	~~Polishing~~ of		Cleaning of
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Silicon~~		*Samples from the CMP
	*SiO2
	<!-- \|style="background:WhiteSmoke; color:black"\|		<!-- \|style="background:WhiteSmoke; color:black"\|
	*Purpose 1		*Purpose 1
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	*Performance range -->		*Performance range -->
	\|-		\|-
	~~!style="background:silver; color:black" align="center" valign="center" rowspan="4"\|Process parameter range~~		\|style="background:LightGrey; color:black"\|Mechanical Cleaning
	~~\|style="background:LightGrey; color:black"\|Polishing liquid~~
	~~\|style="background:WhiteSmoke; color:black"\|~~
	*SF1 Polishing Fluid
	\|-
	\|style="background:LightGrey; color:black"\|~~Polishing cloths~~
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Chemcloth Polishing Cloths~~		*Brush Cleaning
	\|-		\|-
	\|style="background:LightGrey; color:black"\|~~Rotation~~		\|style="background:LightGrey; color:black"\|Power
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Plate~~		*Megasonic Power from 0-40 W (in water)
	*Head/Puck
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Arm sweep		\|style="background:LightGrey; color:black"\|Arm sweep
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Polishing: 20%~~ (~~inner) - 100% (outer~~)		*4" and 6" (20x20mm and 2" run with a 4" sweep)
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Silicon		*Silicon
			*Polysilicon
			*Silicon Oxide
	*Glass/Quartz		*Glass/Quartz
	<!-- \|style="background:WhiteSmoke; color:black"\|		<!-- \|style="background:WhiteSmoke; color:black"\|

Rkch: /* Post CMP Cleaner) */

2020-04-21T07:24:20Z

Post CMP Cleaner)

← Older revision		Revision as of 09:24, 21 April 2020
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	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager]		[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager]

			==Equipment performance and process related parameters==

			{\| border="2" cellspacing="0" cellpadding="2"

			!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
			\|style="background:WhiteSmoke; color:black"\|<b>Polisher/Lapper</b>
			<!-- \|style="background:WhiteSmoke; color:black"\|<b>Equipment 2</b> -->
			\|-
			!style="background:silver; color:black;" align="center" width="60"\|Purpose
			\|style="background:LightGrey; color:black"\|
			Polishing of
			\|style="background:WhiteSmoke; color:black"\|
			*Silicon
			*SiO2
			<!-- \|style="background:WhiteSmoke; color:black"\|
			*Purpose 1
			*Purpose 2
			*Purpose 3 -->
			\|-
			!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance
			\|style="background:LightGrey; color:black"\| 20x20mm substrate
			\|style="background:WhiteSmoke; color:black"\|
			*Removal rate: 400nm/min
			*Thickness accuracy: +/- ? µm
			*Thickness homogeneity: +/- ? µm
			*Roughness: +/- ? µm
			<!-- \|style="background:WhiteSmoke; color:black"\|
			*Performance range 1
			*Performance range 2
			*Performance range 3 -->
			\|-
			\|style="background:LightGrey; color:black"\|100mm substrate
			\|style="background:WhiteSmoke; color:black"\|
			*Removal rate: ~ 60 nm/min
			*Thickness accuracy: ? µm
			*Thickness homogeneity: ? µm
			*Roughness: +/- ? µm
			<!-- \|style="background:WhiteSmoke; color:black"\|
			*Performance range -->
			\|-
			!style="background:silver; color:black" align="center" valign="center" rowspan="4"\|Process parameter range
			\|style="background:LightGrey; color:black"\|Polishing liquid
			\|style="background:WhiteSmoke; color:black"\|
			*SF1 Polishing Fluid
			\|-
			\|style="background:LightGrey; color:black"\|Polishing cloths
			\|style="background:WhiteSmoke; color:black"\|
			*Chemcloth Polishing Cloths
			\|-
			\|style="background:LightGrey; color:black"\|Rotation
			\|style="background:WhiteSmoke; color:black"\|
			*Plate
			*Head/Puck
			\|-
			\|style="background:LightGrey; color:black"\|Arm sweep
			\|style="background:WhiteSmoke; color:black"\|
			*Polishing: 20% (inner) - 100% (outer)
			\|-
			!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
			\|style="background:LightGrey; color:black"\|Sample size
			\|style="background:WhiteSmoke; color:black"\|
			*<nowiki></nowiki> one 20x20mm piece
			*one 50 mm wafer
			*one 2" wafer
			*one 100 mm wafer
			*one 150 mm wafer
			<!-- \|style="background:WhiteSmoke; color:black"\|
			*<nowiki>#</nowiki> small samples
			*<nowiki>#</nowiki> 50 mm wafers
			*<nowiki>#</nowiki> 100 mm wafers
			*<nowiki>#</nowiki> 150 mm wafers -->
			\|-
			\| style="background:LightGrey; color:black"\|Allowed materials
			\|style="background:WhiteSmoke; color:black"\|
			*Silicon
			*Glass/Quartz
			<!-- \|style="background:WhiteSmoke; color:black"\|
			*Allowed material 1
			*Allowed material 2
			*Allowed material 3 -->
			\|-
			\|}

			<br clear="all" />

Rkch: /* THIS PAGE IS UNDER CONSTRUCTION200px */

2020-04-21T07:23:20Z

THIS PAGE IS UNDER CONSTRUCTION200px

← Older revision		Revision as of 09:23, 21 April 2020
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	=~~<span style~~=~~"background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>~~[[image:~~Under_construction~~.~~png~~\|~~200px~~]]=		== Post CMP Cleaner) ==

			[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Post CMP CLeaner in cleanroom A-5]]

			The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.


			'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
			<!-- remember to remove the type of documents that are not present -->

			<!-- give the link to the equipment info page in LabManager: -->
			[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager]

Rkch: Created page with "'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Waf..."

2018-11-13T09:21:09Z

Created page with "'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Waf..."

New page

'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''

=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=