Specific Process Knowledge/Wafer cleaning/7-up & Piranha - Revision history

Nisoer: /* Comparing Wafer/Mask Cleaning baths and Piranha clean */

2025-10-14T05:50:40Z

Comparing Wafer/Mask Cleaning baths and Piranha clean

← Older revision		Revision as of 07:50, 14 October 2025
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	Cleaning of masks using the dedicated bath in Wet bench 03.		Cleaning of masks using the dedicated bath in Wet bench 03.
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	Cleaning of wafers using a beaker in a fumehood in cleanroom ~~B1 or~~ D3. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the Wafer or Mask Cleaning bath.		Cleaning of wafers using a beaker in a fumehood in cleanroom D3. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the Wafer or Mask Cleaning bath.
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"

Kabi: /* Cleaning of wafers or masks */

2024-04-03T10:02:14Z

Cleaning of wafers or masks

← Older revision		Revision as of 12:02, 3 April 2024
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	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=368 Fume hood 01 Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=368 Fume hood 01 Info page in LabManager]
	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=369 Fume hood 02 Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=369 Fume hood 02 Info page in LabManager]
	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=~~169~~ Fume Hood 12 (Standard clean) Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=508 Fume Hood 12 (Standard clean) Info page in LabManager]

Kabi: /* Cleaning of wafers or masks */

2024-04-03T10:01:38Z

Cleaning of wafers or masks

← Older revision		Revision as of 12:01, 3 April 2024
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	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=368 Fume hood 01 Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=368 Fume hood 01 Info page in LabManager]
	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=369 Fume hood 02 Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=369 Fume hood 02 Info page in LabManager]
	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=~~146~~ Fume ~~hood~~(~~RCA~~) Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=169 Fume Hood 12 (Standard clean) Info page in LabManager]


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	MaskClean.jpg\|Mask clean' bath in cleanroom D3		MaskClean.jpg\|Mask clean' bath in cleanroom D3
	FH01-02.jpg\|Fume hood 01 and 02 in cleanroom D3		FH01-02.jpg\|Fume hood 01 and 02 in cleanroom D3
	~~Stinkskab_RR2~~.~~jpg~~\|Fume ~~hood~~(~~RCA~~) in cleanroom B1		FH12.JPG\|Fume Hood 12 (Standard clean) in cleanroom B1
	</gallery>		</gallery>

Mbec at 11:55, 13 February 2023

2023-02-13T11:55:51Z

← Older revision		Revision as of 13:55, 13 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/7-up click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/7-up click here]'''

	'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''		'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

Mbec at 12:46, 1 February 2023

2023-02-01T12:46:49Z

← Older revision		Revision as of 14:46, 1 February 2023
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	<gallery>		<gallery widths=200px heights=200px>
	WaferClean.jpg\|~~300x300px\|'~~Wafer clean' bath in cleanroom D3		WaferClean.jpg\|Wafer clean' bath in cleanroom D3
	MaskClean.jpg\|~~300x300px\|'~~Mask clean' bath in cleanroom D3		MaskClean.jpg\|Mask clean' bath in cleanroom D3
	FH01-02.jpg~~\|300x300px~~\|Fume hood 01 and 02 in cleanroom D3		FH01-02.jpg\|Fume hood 01 and 02 in cleanroom D3
	Stinkskab_RR2.jpg~~\|300x300px~~\|Fume hood(RCA) in cleanroom B1		Stinkskab_RR2.jpg\|Fume hood(RCA) in cleanroom B1
	</gallery>		</gallery>

Mbec at 11:44, 1 February 2023

2023-02-01T11:44:32Z

← Older revision		Revision as of 13:44, 1 February 2023
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	*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=146 Fume hood(RCA) Info page in LabManager]		*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=146 Fume hood(RCA) Info page in LabManager]

	~~[[Image:~~WaferClean.jpg\|300x300px~~\|right\|thumb~~\|'Wafer clean' bath in cleanroom D3]]
	~~[[Image:~~MaskClean.jpg\|300x300px~~\|right\|thumb~~\|'Mask clean' bath in cleanroom D3]]		<gallery>
	~~[[Image:~~FH01-02.jpg\|300x300px~~\|right\|thumb~~\|Fume hood 01 and 02 in cleanroom D3]]		WaferClean.jpg\|300x300px\|'Wafer clean' bath in cleanroom D3
	~~[[Image:~~Stinkskab_RR2.jpg\|300x300px~~\|right\|thumb~~\|Fume hood(RCA) in cleanroom B1]]		MaskClean.jpg\|300x300px\|'Mask clean' bath in cleanroom D3
			FH01-02.jpg\|300x300px\|Fume hood 01 and 02 in cleanroom D3
			Stinkskab_RR2.jpg\|300x300px\|Fume hood(RCA) in cleanroom B1
			</gallery>

	===Comparing Wafer/Mask Cleaning baths and Piranha clean===		===Comparing Wafer/Mask Cleaning baths and Piranha clean===
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	<br clear="all"/>		<br clear="all"/>
	{{fnb\|1}} In preparing a solution involving an acid, always add the acid last. The exception to this rule is Piranha, in which case you add H<sub>2</sub>O<sub>2</sub>, which is a very strong oxidant, to H<sub>2</sub>SO<sub>4</sub>, which is a very strong acid. This is done because it is potentially explosive and at the very least will cause the solution to become very warm.		{{fnb\|1}} '''In preparing a solution involving an acid, always add the acid last. The exception to this rule is Piranha, in which case you add H<sub>2</sub>O<sub>2</sub>, which is a very strong oxidant, to H<sub>2</sub>SO<sub>4</sub>, which is a very strong acid. This is done because it is potentially explosive and at the very least will cause the solution to become very warm.'''

Bghe at 11:18, 1 February 2023

2023-02-01T11:18:22Z

@@ Line 15: / Line 15: @@
 Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing . 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!'''
 [[Image:WaferClean.jpg|300x300px|right|thumb|'Wafer clean' bath in cleanroom D3]]
@@ Line 20: / Line 27: @@
 [[Image:FH01-02.jpg|300x300px|right|thumb|Fume hood 01 and 02 in cleanroom D3]]
 [[Image:Stinkskab_RR2.jpg|300x300px|right|thumb|Fume hood(RCA) in cleanroom B1]]
 ===Comparing Wafer/Mask Cleaning baths and Piranha clean===

Bghe: /* Comparing Wafer/Mask Cleaning baths and Piranha clean */

2023-02-01T11:13:32Z

Comparing Wafer/Mask Cleaning baths and Piranha clean

← Older revision		Revision as of 13:13, 1 February 2023
Line 106:		Line 106:
	\|}		\|}

			<br clear="all"/>
	{{fnb\|1}} In preparing a solution involving an acid, always add the acid last. The exception to this rule is Piranha, in which case you add H<sub>2</sub>O<sub>2</sub>, which is a very strong oxidant, to H<sub>2</sub>SO<sub>4</sub>, which is a very strong acid. This is done because it is potentially explosive and at the very least will cause the solution to become very warm.		{{fnb\|1}} In preparing a solution involving an acid, always add the acid last. The exception to this rule is Piranha, in which case you add H<sub>2</sub>O<sub>2</sub>, which is a very strong oxidant, to H<sub>2</sub>SO<sub>4</sub>, which is a very strong acid. This is done because it is potentially explosive and at the very least will cause the solution to become very warm.

Mbec: /* Cleaning of wafers or masks */

2023-02-01T09:55:27Z

Cleaning of wafers or masks

← Older revision		Revision as of 11:55, 1 February 2023
Line 14:		Line 14:
	Samples not allowed or not compatible with these baths can be cleaned manually in a beaker filled with the so called "Piranha" mixture using one of the acids/bases fume hoods. This mixture consists of concentrated sulfuric acid and hydrogen peroxide forming very aggressive and reactive peroxide species (as in 7-Up) which is very effective at removing organic contaminants and to a certain extent some metal ions.		Samples not allowed or not compatible with these baths can be cleaned manually in a beaker filled with the so called "Piranha" mixture using one of the acids/bases fume hoods. This mixture consists of concentrated sulfuric acid and hydrogen peroxide forming very aggressive and reactive peroxide species (as in 7-Up) which is very effective at removing organic contaminants and to a certain extent some metal ions.

	Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing . 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!'''		Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing . 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!'''

	[[Image:WaferClean.jpg\|300x300px\|right\|thumb\|'Wafer clean' bath in cleanroom D3]]		[[Image:WaferClean.jpg\|300x300px\|right\|thumb\|'Wafer clean' bath in cleanroom D3]]

Mbec: /* Cleaning of wafers or masks */

2023-02-01T09:54:30Z

Cleaning of wafers or masks

← Older revision		Revision as of 11:54, 1 February 2023
Line 14:		Line 14:
	Samples not allowed or not compatible with these baths can be cleaned manually in a beaker filled with the so called "Piranha" mixture using one of the acids/bases fume hoods. This mixture consists of concentrated sulfuric acid and hydrogen peroxide forming very aggressive and reactive peroxide species (as in 7-Up) which is very effective at removing organic contaminants and to a certain extent some metal ions.		Samples not allowed or not compatible with these baths can be cleaned manually in a beaker filled with the so called "Piranha" mixture using one of the acids/bases fume hoods. This mixture consists of concentrated sulfuric acid and hydrogen peroxide forming very aggressive and reactive peroxide species (as in 7-Up) which is very effective at removing organic contaminants and to a certain extent some metal ions.

	Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing . 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser~~.danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!'''		Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing . 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!'''

	[[Image:WaferClean.jpg\|300x300px\|right\|thumb\|'Wafer clean' bath in cleanroom D3]]		[[Image:WaferClean.jpg\|300x300px\|right\|thumb\|'Wafer clean' bath in cleanroom D3]]