Specific Process Knowledge/Thin film deposition/thermalevaporator - Revision history

Reet at 10:01, 18 June 2025

2025-06-18T10:01:21Z

← Older revision		Revision as of 12:01, 18 June 2025
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/thermalevaporator click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/thermalevaporator click here]'''

	<i> This page is written by <b>DTU Nanolab staff</b></i>		<i> This page is written by <b>DTU Nanolab staff</b></i>
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	*10Å - 0.5µm (Ag)		*10Å - 0.5µm (Ag)
	*up to 100 nm (Cr)		*up to 100 nm (Cr)
	*ask the Thin Film group if in doubt or if you wish to exceed the limits		*ask the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if in doubt or if you wish to exceed the limits
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Deposition rate		\|style="background:LightGrey; color:black"\|Deposition rate

Reet: /* Equipment performance and process related parameters */

2025-06-18T09:59:25Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:59, 18 June 2025
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	*10Å - 0.5µm (Ag)		*10Å - 0.5µm (Ag)
	*up to 100 nm (Cr)		*up to 100 nm (Cr)
	*ask if in doubt or if you wish to exceed the limits		*ask the Thin Film group if in doubt or if you wish to exceed the limits
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Deposition rate		\|style="background:LightGrey; color:black"\|Deposition rate

Reet: /* Equipment performance and process related parameters */

2025-06-18T09:58:41Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:58, 18 June 2025
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	*10Å - 1µm (Al)		*10Å - 1µm (Al)
	*10Å - 0.5µm (Ag)		*10Å - 0.5µm (Ag)
	*up to 100 nm (Cr~~) (ask if you wish to deposit more~~)		*up to 100 nm (Cr)
	*ask if in doubt or if you wish to exceed the limits		*ask if in doubt or if you wish to exceed the limits
	\|-		\|-

Reet: /* Equipment performance and process related parameters */

2025-06-18T09:58:26Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:58, 18 June 2025
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	!style="background:silver; color:black" align="left" valign="top" rowspan="5"\|Performance		!style="background:silver; color:black" align="left" valign="top" rowspan="5"\|Performance
	\|style="background:LightGrey; color:black"\|Film thickness\|\|style="background:WhiteSmoke; color:black"\|		\|style="background:LightGrey; color:black"\|Film thickness\|\|style="background:WhiteSmoke; color:black"\|
	*10Å - 1µm (Al ~~and~~ Ag)		*10Å - 1µm (Al)
			*10Å - 0.5µm (Ag)
	*up to 100 nm (Cr) (ask if you wish to deposit more)		*up to 100 nm (Cr) (ask if you wish to deposit more)
	*~~for other metals~~ ask if in doubt		*ask if in doubt or if you wish to exceed the limits
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Deposition rate		\|style="background:LightGrey; color:black"\|Deposition rate

Reet: /* Materials evaporated in the Lesker Thermal Evaporator */

2025-06-18T09:55:40Z

Materials evaporated in the Lesker Thermal Evaporator

← Older revision		Revision as of 11:55, 18 June 2025
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	*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al\|Aluminium]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al\|Aluminium]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver\|Silver]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver/Deposition of Silver in Thermal Evaporator\|Silver]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator\|Chromium]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator\|Chromium]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium/Thermal Ge evaporation Thermal Evaporator\|Germanium]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium/Thermal Ge evaporation Thermal Evaporator\|Germanium]]

Reet: /* Equipment performance and process related parameters */

2025-06-18T09:38:46Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:38, 18 June 2025
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	\|style="background:LightGrey; color:black"\|Batch size		\|style="background:LightGrey; color:black"\|Batch size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Up to 8" wafer		*Up to 1 x 6 " or 8" wafer
	*~~Or several~~ smaller pieces		*Up to 3 x 4" wafers
			*Many smaller pieces
	*Deposition on one side of the substrate		*Deposition on one side of the substrate
	\|-		\|-

Reet: /* Thermal evaporator for metal deposition */

2025-06-18T09:37:08Z

Thermal evaporator for metal deposition

← Older revision		Revision as of 11:37, 18 June 2025
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	This instrument is NANO 36 Thermal evaporator from Kurt J. Lesker. Instrument specifications below. It takes around 1 hour for a round of deposition (depending on thickness and rate of course). The small chamber means that the deposited thickness may vary quite a bit across large samples, as further described in the specifications table.		This instrument is NANO 36 Thermal evaporator from Kurt J. Lesker. Instrument specifications below. It takes around 1 hour for a round of deposition (depending on thickness and rate of course). The small chamber means that the deposited thickness may vary quite a bit across large samples, as further described in the specifications table.

	The main purpose of this evaporator is to deposit Al for ~~removing charging~~ of ~~the resist~~ when doing electron beam lithography on insulating substrates. It can also be used for Cr evaporation for the same purpose. The advantage of Al is that it can be removed simultaneously with the e-beam resist. However Cr may allow even better resolution of the lithography.		The main purpose of this evaporator is to deposit Al for dissipation of charge when doing electron beam lithography on insulating substrates. It can also be used for Cr evaporation for the same purpose. The advantage of Al is that it can be removed simultaneously with the e-beam resist. However Cr may allow even better resolution of the lithography.

	Additionally we have processes for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber. You are always welcome to ask for other metals in the machine.		Additionally we have processes for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber. You are always welcome to ask for other metals in the machine.

Reet: /* Thermal evaporator- A system for deposition of metals */

2025-06-18T09:36:36Z

Thermal evaporator- A system for deposition of metals

← Older revision		Revision as of 11:36, 18 June 2025
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	==Thermal evaporator~~- A system~~ for deposition ~~of metals~~==		==Thermal evaporator for metal deposition==
	[[Image:IMG_2592_edit.jpg\|300x300px\|thumb\| Positioned in cleanroom A-1.]]		[[Image:IMG_2592_edit.jpg\|300x300px\|thumb\| Positioned in cleanroom A-1.]]

	This evaporator ~~is intuitive to operate and does not have~~ a ~~lot~~ of ~~bells~~ and ~~whistles~~. ~~You can see~~ the ~~instrument~~ specifications ~~below~~.		This instrument is NANO 36 Thermal evaporator from Kurt J. Lesker. Instrument specifications below. It takes around 1 hour for a round of deposition (depending on thickness and rate of course). The small chamber means that the deposited thickness may vary quite a bit across large samples, as further described in the specifications table.

	The main purpose of ~~the thermal~~ evaporator is to deposit Al for removing charging of the resist when doing ~~EBL~~ on ~~isolating substrate~~. It can also be used for Cr evaporation for the same purpose~~, and~~ evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber ~~that required a lot of effort~~ to ~~clean and~~ the ~~process was not stable~~.		The main purpose of this evaporator is to deposit Al for removing charging of the resist when doing electron beam lithography on insulating substrates. It can also be used for Cr evaporation for the same purpose. The advantage of Al is that it can be removed simultaneously with the e-beam resist. However Cr may allow even better resolution of the lithography.

			Additionally we have processes for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber. You are always welcome to ask for other metals in the machine.

	Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.		Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.

Reet: /* Thermal evaporator- A system for deposition of metals */

2025-06-18T09:20:37Z

Thermal evaporator- A system for deposition of metals

← Older revision		Revision as of 11:20, 18 June 2025
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	Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.		Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.

	'''The user manual, APV, technical information and contact information can be found in LabManager:'''		'''The user manual, APV, technical information, cross-contamination sheet and contact information can be found in LabManager:'''
	<!-- remember to remove the type of documents that are not present -->		<!-- remember to remove the type of documents that are not present -->

Reet at 09:19, 18 June 2025

2025-06-18T09:19:45Z

← Older revision		Revision as of 11:19, 18 June 2025
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/thermalevaporator click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/thermalevaporator click here]'''

	<i> ~~Unless otherwise stated, this~~ page is written by <b>DTU Nanolab ~~internal~~</b></i>		<i> This page is written by <b>DTU Nanolab staff</b></i>

	[[Category: Equipment\|Thin film]]		[[Category: Equipment\|Thin film]]

← Older revision		Revision as of 11:55, 18 June 2025
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	*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al\|Aluminium]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al\|Aluminium]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver\|Silver]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver/Deposition of Silver in Thermal Evaporator\|Silver]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator\|Chromium]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator\|Chromium]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium/Thermal Ge evaporation Thermal Evaporator\|Germanium]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium/Thermal Ge evaporation Thermal Evaporator\|Germanium]]