Specific Process Knowledge/Thin film deposition/Wordentec - Revision history

Mmat at 15:29, 16 June 2025

2025-06-16T15:29:41Z

← Older revision		Revision as of 17:29, 16 June 2025
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	\|}		\|}

	[http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold#Studies_of_Au_deposition_processes_in_the_Wordentec\| Temperature and roughness studies of Au deposition processes in the Wordentec]		[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold#Studies_of_Au_deposition_processes_in_the_Wordentec\| Temperature and roughness studies of Au deposition processes in the Wordentec]

Mmat: /* Wordentec QCL 800 */

2025-06-16T15:28:57Z

Wordentec QCL 800

← Older revision		Revision as of 17:28, 16 June 2025
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	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager~~.nanolab~~.dtu.dk/function.php?module=Machine&view=view&mach=167 Wordentec in LabManager]		[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=167 Wordentec in LabManager]

	==Process information==		==Process information==

Mmat at 15:28, 16 June 2025

2025-06-16T15:28:34Z

← Older revision		Revision as of 17:28, 16 June 2025
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	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager.~~danchip~~.dtu.dk/function.php?module=Machine&view=view&mach=167 Wordentec in LabManager]		[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=167 Wordentec in LabManager]

	==Process information==		==Process information==

Mmat: /* The metals available for E-beam evaporation and their standard deposition rates are: */

2025-05-28T09:54:20Z

The metals available for E-beam evaporation and their standard deposition rates are:

← Older revision		Revision as of 11:54, 28 May 2025
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	E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion.		E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion.

	[[~~index.php?title=~~Media:WaferAfterWordentec.JPG\|Delaminating Au film on thin E-beam resist]]		[[Media:WaferAfterWordentec.JPG\|Delaminating Au film on thin E-beam resist]]

	===Thermal evaporation materials===		===Thermal evaporation materials===

Mmat at 09:54, 28 May 2025

2025-05-28T09:54:07Z

← Older revision		Revision as of 11:54, 28 May 2025
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			{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Wordentec click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Wordentec click here]'''
			<br>
	<~~i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b~~></i>		<br>
			[[Category:Equipment\|Thin film Wordentec]]
	[[~~index.php?title=~~Category:Equipment\|Thin film Wordentec]]		[[Category:Thin Film Deposition\|Wordentec]]
	[[~~index.php?title=~~Category:Thin Film Deposition\|Wordentec]]		'''<p style="color:red;">The Wordentec QCL 800 has been decomissioned in 2025.</p>'''
			==Wordentec QCL 800==

	==Wordentec QCL 800 ~~['''THIS TOOL HAS BEEN DECOMMISSIONED]~~'''==
	[[Image:Wordentec.jpg\|300x300px\|thumb\|Wordentec: positioned in cleanroom D-2 in the Wordentec room]]		[[Image:Wordentec.jpg\|300x300px\|thumb\|Wordentec: positioned in cleanroom D-2 in the Wordentec room]]

Reet: /* Wordentec QCL 800 */

2025-04-11T11:40:48Z

Wordentec QCL 800

← Older revision		Revision as of 13:40, 11 April 2025
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	<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>		<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

	[[Category: Equipment\|Thin film Wordentec]]		[[index.php?title=Category:Equipment\|Thin film Wordentec]]
	[[Category: Thin Film Deposition\|Wordentec]]		[[index.php?title=Category:Thin Film Deposition\|Wordentec]]


	==Wordentec QCL 800==		==Wordentec QCL 800 ['''THIS TOOL HAS BEEN DECOMMISSIONED]'''==
	[[Image:Wordentec.jpg\|300x300px\|thumb\|Wordentec: positioned in cleanroom D-2 in the Wordentec room]]		[[Image:Wordentec.jpg\|300x300px\|thumb\|Wordentec: positioned in cleanroom D-2 in the Wordentec room]]

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	E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion.		E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion.

	[[Media:WaferAfterWordentec.JPG\|Delaminating Au film on thin E-beam resist]]		[[index.php?title=Media:WaferAfterWordentec.JPG\|Delaminating Au film on thin E-beam resist]]

	===Thermal evaporation materials===		===Thermal evaporation materials===

Paphol at 09:35, 11 May 2023

2023-05-11T09:35:33Z

← Older revision		Revision as of 11:35, 11 May 2023
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Wordentec click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Wordentec click here]'''

			<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

	[[Category: Equipment\|Thin film Wordentec]]		[[Category: Equipment\|Thin film Wordentec]]

Paphol at 12:16, 5 September 2022

2022-09-05T12:16:37Z

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	'''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@~~danchip~~.dtu.dk or thinfilm@~~danchip~~.dtu.dk''		'''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@nanolab.dtu.dk or thinfilm@nanolab.dtu.dk''

	'''**''' ''Percent variation calculated as (Max-Min)/Average. For thermally evaporated Al, the max was on one side of the wafer rather than in the middle. Measured by Rebecca Ettlinger, Nov. 2018.''		'''**''' ''Percent variation calculated as (Max-Min)/Average. For thermally evaporated Al, the max was on one side of the wafer rather than in the middle. Measured by Rebecca Ettlinger, Nov. 2018.''

Reet: /* Particulates in the films */

2022-05-31T14:47:07Z

Particulates in the films

← Older revision		Revision as of 16:47, 31 May 2022
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	===Particulates in the films===		===Particulates in the films===
	Read about some tests that we made of particulates in e-beam evaporated Al, Ni, and TiAu films made in the Wordentec and the Temescal		Read about some tests that we made of particulates in e-beam evaporated Al, Ni, and TiAu films made in the Wordentec and the Temescal
	[[Specific_Process_Knowledge/Thin_film_deposition/Temescal~~#Particulates_on_the_films~~\|'''here''']].		[[Specific_Process_Knowledge/Thin_film_deposition/Temescal/Particulates in Temescal Au films\|'''here''']].

	==Equipment performance and process related parameters Wordentec==		==Equipment performance and process related parameters Wordentec==

Reet: /* Thickness measurement */

2022-05-31T14:46:01Z

Thickness measurement

← Older revision		Revision as of 16:46, 31 May 2022
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	===Thickness measurement===		===Thickness measurement===
	Read about how the machine measures the thickness of the growing film using a quartz crystal monitor [[Specific_Process_Knowledge/Thin_film_deposition/Temescal#~~Deposition_rate_and_thickness_measurement_accuracy~~\|'''here''']].		Read about how the machine measures the thickness of the growing film using a quartz crystal monitor [[Specific_Process_Knowledge/Thin_film_deposition/Temescal/Good to know about the Temescal#Deposition rate and thickness measurement accuracy\|'''here''']].

	===Particulates in the films===		===Particulates in the films===