Specific Process Knowledge/Thin film deposition/Temescal - Revision history

Reet: /* Equipment performance and process related parameters */

2025-08-31T20:29:03Z

Equipment performance and process related parameters

← Older revision		Revision as of 22:29, 31 August 2025
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	\| style="background:LightGrey; color:black"\|Substrate material allowed		\| style="background:LightGrey; color:black"\|Substrate material allowed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Silicon wafers~~		*Almost any that does not outgas and is approved in the cleanroom.
	*Quartz wafers
	*Pyrex wafers
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Material allowed on the substrate		\| style="background:LightGrey; color:black"\|Material allowed on the substrate
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Silicon oxide~~		*Almost any that does not outgas and is approved in the cleanroom.
	*Silicon (oxy)nitride
	*Photoresist
	*PMMA
	*Mylar
	*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
	\|-		\|-

Reet: /* Equipment performance and process related parameters for the Temescal E-beam evaporator */

2025-08-31T20:27:46Z

Equipment performance and process related parameters for the Temescal E-beam evaporator

← Older revision		Revision as of 22:27, 31 August 2025
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	[[/Ion source in E-beam evaporator (Temescal)\|Information on the ion source]].		[[/Ion source in E-beam evaporator (Temescal)\|Information on the ion source]].

	==Equipment performance and process related parameters ~~for the Temescal E-beam evaporator~~==		==Equipment performance and process related parameters==

	{\| border="2" cellspacing="0" cellpadding="10"		{\| border="2" cellspacing="0" cellpadding="10"

Reet: /* Materials available in the E-beam evaporator (Temescal) */

2025-08-31T20:27:17Z

Materials available in the E-beam evaporator (Temescal)

← Older revision		Revision as of 22:27, 31 August 2025
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	[[/Acceptance Test\|'''Acceptance Test information is found here''']]. Describes '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.		[[/Acceptance Test\|'''Acceptance Test information is found here''']]. Describes '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.

	===Materials ~~available in the E-beam evaporator (Temescal)~~===		===Materials===

	[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium\|Aluminium (Al)]]<br>		[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium\|Aluminium (Al)]]<br>

Reet: /* Ion source */

2025-08-31T20:26:54Z

Ion source

← Older revision		Revision as of 22:26, 31 August 2025
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	Read about optimizing film quality including how to minimize the number of [[/Particulates in Temescal Au films\|particulates in Au films in the Temescal]].		Read about optimizing film quality including how to minimize the number of [[/Particulates in Temescal Au films\|particulates in Au films in the Temescal]].

	==Ion source==		===Ion source===
	[[/Ion source in E-beam evaporator (Temescal)\|Information on the ion source]].		[[/Ion source in E-beam evaporator (Temescal)\|Information on the ion source]].

Reet: /* Thickness measurement, deposition rate and process control */

2025-08-31T20:26:27Z

Thickness measurement, deposition rate and process control

← Older revision		Revision as of 22:26, 31 August 2025
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	===Thickness measurement, deposition rate and process control===		===Thickness measurement, deposition rate and process control===
	~~Read about how~~ the machine measures the thickness of the growing film using a quartz crystal monitor, how accurately ~~you can~~ control the rate/thickness, and other useful information about e-beam deposition here: [[/Good to know about the Temescal#Deposition rate and thickness measurement accuracy\|Thickness, rate, process control]].		How the machine measures the thickness of the growing film using a quartz crystal monitor, how accurately is the control of the rate/thickness, and other useful information about e-beam deposition is found here: [[/Good to know about the Temescal#Deposition rate and thickness measurement accuracy\|Thickness, rate, process control]].

	===Particulates in the films===		===Particulates in the films===

Reet: /* Process information */

2025-08-31T20:25:06Z

Process information

← Older revision		Revision as of 22:25, 31 August 2025
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	== Process information ==		== Process information ==

	[[/Acceptance Test\|'''Acceptance Test information is found here''']]. Describes ~~tests of~~ '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.		[[/Acceptance Test\|'''Acceptance Test information is found here''']]. Describes '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.

	===Materials available in the E-beam evaporator (Temescal)===		===Materials available in the E-beam evaporator (Temescal)===

Reet: /* E-Beam Evaporator (Temescal) */

2025-08-31T20:24:28Z

E-Beam Evaporator (Temescal)

← Older revision		Revision as of 22:24, 31 August 2025
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	[[File:Temescal.JPG\|400px\|right\|thumb\|The Temescal E-beam evaporator in cleanroom A-5]]		[[File:Temescal.JPG\|400px\|right\|thumb\|The Temescal E-beam evaporator in cleanroom A-5]]

	~~The E~~-beam ~~evaporator~~ (~~Temescal~~) ~~is a system for depositing~~ metals ~~by electron-beam evaporation~~. In e-beam evaporation, the deposition is line-of-sight ~~directed~~ from the source, which means it will coat only the surface of the sample facing ~~directly towards~~ the source. This makes it ~~very~~ useful for example for [[Specific Process Knowledge/Lithography/LiftOff\|lift-off]]. Nanolab's e-beam evaporators ~~are~~ made by Temescal, a division of FerroTec, and this particular machine was purchased by Nanolab in 2018. It is very similar to the newer e-beam evaporator ~~we have from the same manufacturer~~, bought in 2023, ~~which we call~~ [[Specific Process Knowledge/Thin film deposition/10-pocket_e-beam_evaporator\|E-beam Evaporator (10-pockets)]] in the LabManager system.		This system allows electron-beam evaporation of thin films (<1 μm) of metals and one semiconductor, Ge. In e-beam evaporation, the deposition is line-of-sight from the source, which means it will coat only the surface of the sample facing the source directly. This makes it useful for example for [[Specific Process Knowledge/Lithography/LiftOff\|lift-off]]. Nanolab's current e-beam evaporators were made by Temescal, a division of FerroTec, and this particular machine was purchased by Nanolab in 2018. It is very similar to the newer e-beam evaporator, bought in 2023, called the [[Specific Process Knowledge/Thin film deposition/10-pocket_e-beam_evaporator\|E-beam Evaporator (10-pockets)]] in the LabManager system.

	A special feature of the 2018 E-beam evaporator (Temescal) is that it has an ion source for ~~Argon~~ sputtering. This can be used either for ''in situ'' sample cleaning prior to deposition or to modify the film during deposition (ion beam assisted deposition or IBAD).		A special feature of the 2018 E-beam evaporator (Temescal) is that it has an ion source for argon sputtering. This can be used either for ''in situ'' sample cleaning prior to deposition or to modify the film during deposition (ion beam assisted deposition or IBAD).

	In both Temescal e-beam evaporators, wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples ~~that are loaded together~~. ~~You can load up~~ to four 6" wafers or three 8" wafers for deposition ~~on surfaces facing the evaporation source~~, or on up to one 6" wafer for tilted deposition~~. By using sample holder inserts, you can deposit metals on samples of different sizes and shapes~~. Only one ~~metal~~ can be deposited at a time, but ~~you can deposit many~~ layers of different metals one after the other. The system contains 6 ~~metals~~ at a time ~~and the metals~~ are exchanged based on user requests~~, so please~~ request ~~the metals you wish~~ well in advance.		In both Temescal e-beam evaporators, wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all loaded samples. Up to four 6" wafers /three 8" wafers may be loaded for line-of-sight deposition, or up to one 6" wafer for tilted deposition. Only one material can be deposited at a time, but layers of different metals may be deposited one after the other. The system contains 6 materials at a time which are exchanged weekly based on user requests. Please request materials well in advance.

	'''The user manual, user APV, and contact information can be found in LabManager:'''		'''The user manual, user APV, and contact information can be found in LabManager:'''

Reet: /* Process information */

2025-08-28T07:18:01Z

Process information

← Older revision		Revision as of 09:18, 28 August 2025
Line 27:		Line 27:
	== Process information ==		== Process information ==

	[[/Acceptance Test\|Acceptance Test information is found here]]. Describes tests of '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.		[[/Acceptance Test\|'''Acceptance Test information is found here''']]. Describes tests of '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.

	===Materials available in the E-beam evaporator (Temescal)===		===Materials available in the E-beam evaporator (Temescal)===
Line 54:		Line 54:
	===Particulates in the films===		===Particulates in the films===
	Read about optimizing film quality including how to minimize the number of [[/Particulates in Temescal Au films\|particulates in Au films in the Temescal]].		Read about optimizing film quality including how to minimize the number of [[/Particulates in Temescal Au films\|particulates in Au films in the Temescal]].

			==Ion source==
			[[/Ion source in E-beam evaporator (Temescal)\|Information on the ion source]].

	==Equipment performance and process related parameters for the Temescal E-beam evaporator==		==Equipment performance and process related parameters for the Temescal E-beam evaporator==

Reet: /* Process information */

2025-08-28T07:16:22Z

Process information

← Older revision		Revision as of 09:16, 28 August 2025
Line 27:		Line 27:
	== Process information ==		== Process information ==

	[[/Acceptance Test\|Acceptance Test information is found here]]. Describes '''thickness uniformity''' ~~tests~~, '''side wall deposition''' ~~tests~~, '''sheet resistance''' ~~tests~~ and ~~tests of the~~ '''ion source''' ~~for substrate cleaning~~.		[[/Acceptance Test\|Acceptance Test information is found here]]. Describes tests of '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.

	===Materials available in the E-beam evaporator (Temescal)===		===Materials available in the E-beam evaporator (Temescal)===

Reet: /* Materials for e-beam evaporation in the E-beam evaporator (Temescal) */

2025-08-28T07:15:19Z

Materials for e-beam evaporation in the E-beam evaporator (Temescal)

← Older revision		Revision as of 09:15, 28 August 2025
Line 29:		Line 29:
	[[/Acceptance Test\|Acceptance Test information is found here]]. Describes '''thickness uniformity''' tests, '''side wall deposition''' tests, '''sheet resistance''' tests and tests of the '''ion source''' for substrate cleaning.		[[/Acceptance Test\|Acceptance Test information is found here]]. Describes '''thickness uniformity''' tests, '''side wall deposition''' tests, '''sheet resistance''' tests and tests of the '''ion source''' for substrate cleaning.

	===Materials ~~for e-beam evaporation~~ in the E-beam evaporator (Temescal)===		===Materials available in the E-beam evaporator (Temescal)===

	[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium\|Aluminium (Al)]]<br>		[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium\|Aluminium (Al)]]<br>