Specific Process Knowledge/Thin film deposition/Electroplating-Ni - Revision history

Mmat: /* Comparison of standard processes */

2025-06-20T14:57:29Z

Comparison of standard processes

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	!~~[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel/Electroplating_of_nickel\|~~DCHimm18.3-04]]		!DCHimm18.3-04
	!~~[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel/Electroplating_of_nickel\|~~DCHimm18.3-06]]		!DCHimm18.3-06
	!~~[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel/Electroplating_of_nickel\|~~DCHimm18.3-12]]		!DCHimm18.3-12
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2025-06-20T14:54:28Z

Process information

← Older revision		Revision as of 16:54, 20 June 2025
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	Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.		Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.


	~~== Process information ==~~

	*[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Electroplating of nickel\|Description of standard processes]]

	==Equipment performance and process related parameters==		==Equipment performance and process related parameters==

2025-06-20T14:54:09Z

Technotrans microform.200

← Older revision		Revision as of 16:54, 20 June 2025
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	Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.		Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.


	~~'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''~~
	~~<!-- remember to remove the type of documents that are not present -->~~



	~~<!-- give the link to the equipment info page in LabManager: -->~~
	~~[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=274 Electroplating-Ni Info on LabManager]~~

	== Process information ==		== Process information ==

2025-06-20T14:52:26Z

← Older revision		Revision as of 16:52, 20 June 2025
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	'''<p style="color:red;">The Electroplater Technotrans microform.200 has been decomissioned ~~and is no longer available~~. For electroplating, please contact DTU Mechanical Engineering.</p>'''		'''<p style="color:red;">The Electroplater Technotrans microform.200 has been decomissioned. For electroplating, please contact DTU Mechanical Engineering.</p>'''

	[[Category: Equipment\|Thin film Electroplating Ni]]		[[Category: Equipment\|Thin film Electroplating Ni]]

2025-06-20T14:52:10Z

@@ Line 1: / Line 1: @@
-'''<p style="color:red;">The Electroplater Technotrans microform.200 has been decomissioned and is no longer available.</p>'''
+'''<p style="color:red;">The Electroplater Technotrans microform.200 has been decomissioned and is no longer available. For electroplating, please contact DTU Mechanical Engineering.</p>'''
 [[Category: Equipment|Thin film Electroplating Ni]]
@@ Line 127: / Line 127: @@
 |-
 |}

2025-06-20T14:49:10Z

Technotrans microform.200

← Older revision		Revision as of 16:49, 20 June 2025
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	[[Category: Thin Film Deposition\|Electroplating Ni]]		[[Category: Thin Film Deposition\|Electroplating Ni]]

	== Technotrans microform.200==		= Technotrans microform.200=

	[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]		[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]

2025-06-20T14:47:40Z

← Older revision		Revision as of 16:47, 20 June 2025
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	'''~~Feedback to this page''': '''[mailto:fabricationSupport@Nanolab.dtu.dk?Subject~~=~~Feed%20back%20from%20page%20http~~:~~//labadviser~~.~~nanolab.dtu.dk/index~~.~~php/Specific_Process_Knowledge/Thin_film_deposition~~/~~Electroplating-Ni click here]'''~~		'''<p style="color:red;">The Electroplater Technotrans microform.200 has been decomissioned and is no longer available.</p>'''

	~~'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''~~

	~~'''THIS MACHINE HAS BEEN DECOMMISSIONED~~'''

	[[Category: Equipment\|Thin film Electroplating Ni]]		[[Category: Equipment\|Thin film Electroplating Ni]]
	[[Category: Thin Film Deposition\|Electroplating Ni]]		[[Category: Thin Film Deposition\|Electroplating Ni]]

	== Technotrans microform.200 ~~- DECOMMISSIONED~~==		== Technotrans microform.200==

	[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]		[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]

2024-01-15T10:29:58Z

Technotrans microform.200 - DECOMISSIONED

← Older revision		Revision as of 12:29, 15 January 2024
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	[[Category: Thin Film Deposition\|Electroplating Ni]]		[[Category: Thin Film Deposition\|Electroplating Ni]]

	== Technotrans microform.200 - ~~DECOMISSIONED~~==		== Technotrans microform.200 - DECOMMISSIONED==

	[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]		[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]

2024-01-15T10:29:38Z

← Older revision		Revision as of 12:29, 15 January 2024
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	'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''		'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

	'''~~All links to Labmanager requires login.~~'''		'''THIS MACHINE HAS BEEN DECOMMISSIONED'''

	[[Category: Equipment\|Thin film Electroplating Ni]]		[[Category: Equipment\|Thin film Electroplating Ni]]
	[[Category: Thin Film Deposition\|Electroplating Ni]]		[[Category: Thin Film Deposition\|Electroplating Ni]]

	== Technotrans microform.200 ==		== Technotrans microform.200 - DECOMISSIONED==

	[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]		[[image:Electroplater-D3.jpg\|200x200px\|right\|thumb\|Electroplating-Ni positioned in cleanroom D-3]]

2023-02-01T06:28:32Z

← Older revision		Revision as of 08:28, 1 February 2023
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	'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''		'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

	'''All links to Labmanager requires login.'''		'''All links to Labmanager requires login.'''