Specific Process Knowledge/Thin film deposition/Deposition of Tin - Revision history

Reet: /* Comparison of deposition methods */

2025-07-07T22:00:06Z

Comparison of deposition methods

← Older revision		Revision as of 00:00, 8 July 2025
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	* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404]		* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet]

	\|		\|

Reet: /* Comparison of deposition methods */

2025-07-07T21:59:35Z

Comparison of deposition methods

← Older revision		Revision as of 23:59, 7 July 2025
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	\|		\|
	*Up to 4x6" wafers or		*Up to 4x6" wafers or
	Up to 3x8" wafers ~~**~~ or		*Up to 3x8" wafers or
	*smaller pieces		*smaller pieces
	\|		\|

Reet: /* Thermal evaporation */

2025-07-07T21:59:15Z

Thermal evaporation

← Older revision		Revision as of 23:59, 7 July 2025
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	Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025).		Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025).

	==Thermal evaporation==		==Thermal evaporation of tin ==
	Sn evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough.		Sn thermal evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough.

	==Comparison of deposition methods==		==Comparison of deposition methods==

Reet: /* Tin Deposition */

2025-07-07T21:58:51Z

Tin Deposition

← Older revision		Revision as of 23:58, 7 July 2025
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	= Tin Deposition =		= Tin Deposition =

	Tin can be deposited by e-beam evaporation~~. It was evaporated~~ in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.		Tin can be deposited by sputtering, thermal evaporation or e-beam evaporation in DTU Nanolab's cleanroom.

			==Sputtering of tin==
			We have sputtered tin in both the [[Specific Process Knowledge/Thin film deposition/Lesker\|Sputter system (Lesker)]] and the [[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1)]]. In the former we have also tested co-sputtering with Cu. In the latter we have more recent results (2025). The initial films were quite rough. Please contact staff for more information.

			==E-beam evaporation of tin==
			Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025).

			==Thermal evaporation==
			Sn evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough.

			==Comparison of deposition methods==
	{\| border="1" cellspacing="0" cellpadding="3"		{\| border="1" cellspacing="0" cellpadding="3"
	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])
			! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal Evaporator]])
			! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
			! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! General description		! General description
	\| E-beam deposition of Sn		\| E-beam deposition of Sn (line-of-sight)
	(line-of-sight deposition)		\| Thermal deposition of Sn (line-of-sight)
			\| Sputter deposition of Sn (some step coverage)
			\| Sputter deposition of Sn (pulsed DC, HiPIMS and substrate heating available)

	\|-		\|-
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	!Pre-clean		!Pre-clean
	\|Ar ion clean		\|Ar ion clean
			\|none
			\|none
			\|RF sputter cleaning
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Layer thickness		!Layer thickness
	\|~~10Å~~ to 1µm*		\| discuss with staff
			1 nm to at least 100 nm
			\| discuss with staff
			1 nm to at least 50 nm
			\| discuss with staff
			\| discuss with staff
			1 nm to at least 50 nm
	\|-		\|-
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Deposition rate		! Deposition rate
	\|1Å/s ~~to 10Å~~/s		\| discuss with staff (on the order of 1-5 Å/s)
			\| discuss with staff (on the order of 1-5 Å/s)
			\| discuss with staff
			\| discuss with staff (on the order of 1-2 Å/s)
	\|-		\|-


	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Pre-clean		!Pre-clean
	\|Ar ion bombardment		\|Ar ion bombardment
			\|none
			\|none
			\|RF sputter cleaning
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Batch size		! Batch size
	\|		\|
	*Up to 4x6" wafers		*Up to 4x6" wafers or
	*Up to 3x8" wafers ~~(ask for holder)~~		Up to 3x8" wafers ** or
	*~~small~~ pieces		*smaller pieces
			\|
			*Up to 1x8" wafer or 1x6" wafer
			*Up to 3x4" wafers
			*smaller pieces
			\|
			*1x6" wafers or
			*1x4" wafers or
			*smaller pieces
			\|
			*up to 10x6" wafers or
			*up to 10x4" wafers or
			*many smaller pieces
	\|-		\|-

	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Allowed materials		!Allowed materials
			\|
			* Almost any that does not outgas
			*See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]


	\|		\|
	* ~~Silicon~~		* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404]
	*Silicon oxide
	*Silicon (oxy)nitride		\|
	*Photoresist		* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
	*PMMA		\|
	*Mylar		*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
	*Metals
	*See also the [~~http~~://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=~~429~~ cross-contamination sheet]
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Comment		! Comment
	\| ~~Tin has not yet been deposited in the Temescal to date (May 2022).~~		\| Resulting films are rough
	~~Please contact the Thin Film group if you would like us to develop the process.~~		\| Resulting films are very rough
			\| Resulting films are rough
			\| Resulting films are rough
	\|}		\|}

	~~'''*''' ''For thicknesses above 600 nm permission is required.''~~

Mmat at 14:19, 20 June 2025

2025-06-20T14:19:38Z

← Older revision		Revision as of 16:19, 20 June 2025
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tin click here]'''		= Tin Deposition =

	~~<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>~~

	== Tin ~~deposition =~~=

	Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.		Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.

Reet at 11:14, 13 June 2023

2023-06-13T11:14:07Z

← Older revision		Revision as of 13:14, 13 June 2023
Line 5:		Line 5:
	== Tin deposition ==		== Tin deposition ==

	Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (~~September 2021~~). Please contact the Thin Film group if you would like to deposit tin.		Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.

	{\| border="1" cellspacing="0" cellpadding="3"		{\| border="1" cellspacing="0" cellpadding="3"

Eves at 16:10, 1 February 2023

2023-02-01T16:10:29Z

← Older revision		Revision as of 18:10, 1 February 2023
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	'''Feedback to this page''': '''[mailto:~~pvd~~@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php~~?title=~~Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tin~~&action=edit~~ click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tin click here]'''

			<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

	== Tin deposition ==		== Tin deposition ==

Reet: /* Tin deposition */

2022-09-21T09:06:50Z

Tin deposition

← Older revision		Revision as of 11:06, 21 September 2022
Line 3:		Line 3:
	== Tin deposition ==		== Tin deposition ==

	Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is ~~being~~ decommissioned, but has not yet been evaporated in the Temescal, which we have now (September 2021). Please contact the Thin Film group if you would like to deposit tin.		Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (September 2021). Please contact the Thin Film group if you would like to deposit tin.

	{\| border="1" cellspacing="0" cellpadding="3"		{\| border="1" cellspacing="0" cellpadding="3"

Reet: /* Tin deposition */

2022-06-01T11:19:40Z

Tin deposition

← Older revision		Revision as of 13:19, 1 June 2022
Line 55:		Line 55:
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Comment		! Comment
	\| Tin has not yet been deposited in the Temescal to date (~~August 2018~~).		\| Tin has not yet been deposited in the Temescal to date (May 2022).
	Please contact the Thin Film group if you would like us to develop the process.		Please contact the Thin Film group if you would like us to develop the process.
	\|}		\|}

	'''*''' ''For thicknesses above 600 nm permission is required.''		'''*''' ''For thicknesses above 600 nm permission is required.''

Eves: /* Tin deposition */

2021-10-03T12:29:16Z

Tin deposition

← Older revision		Revision as of 14:29, 3 October 2021
Line 3:		Line 3:
	== Tin deposition ==		== Tin deposition ==

	Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in ~~the Physimeca or~~ the Temescal, which we have now (~~August 2018~~). Please contact the Thin Film group if you would like to deposit tin.		Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in the Temescal, which we have now (September 2021). Please contact the Thin Film group if you would like to deposit tin.

	{\| border="1" cellspacing="0" cellpadding="3"		{\| border="1" cellspacing="0" cellpadding="3"