Specific Process Knowledge/Thin film deposition/Deposition of TiW - Revision history

Reet: /* Sputtering of TiW */

2025-07-07T22:34:52Z

Sputtering of TiW

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 ==Sputtering of TiW==
-Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
+Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
 *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
 *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]

Paphol at 13:04, 6 June 2023

2023-06-06T13:04:33Z

← Older revision		Revision as of 15:04, 6 June 2023
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''

			<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

	==Sputtering of TiW==		==Sputtering of TiW==

Eves: /* Sputtering of TiW */

2022-09-11T16:17:43Z

Sputtering of TiW

← Older revision		Revision as of 18:17, 11 September 2022
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Pre-clean		! Pre-clean
	\|RF Ar clean		\|RF Ar clean (not working at the moment (sept 2022))
	\|-		\|-

Reet: /* Sputtering of TiW */

2020-03-27T14:43:00Z

Sputtering of TiW

← Older revision		Revision as of 16:43, 27 March 2020
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	*[[/Sputtering of TiW in Wordentec\|Sputtering of TiW in Wordentec]]		*[[/Sputtering of TiW in Wordentec\|Sputtering of TiW in Wordentec]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers\|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers\|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]


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Reet: /* Sputtering of TiW */ added link to grain size study

2020-03-27T14:42:46Z

Sputtering of TiW: added link to grain size study

← Older revision		Revision as of 16:42, 27 March 2020
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	Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).		Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).

	* [[/Sputtering of TiW in Wordentec\|Sputtering of TiW in Wordentec]]		*[[/Sputtering of TiW in Wordentec\|Sputtering of TiW in Wordentec]]
			*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers\|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]

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Reet at 12:43, 19 March 2020

2020-03-19T12:43:36Z

← Older revision		Revision as of 14:43, 19 March 2020
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''

			==Sputtering of TiW==

	Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).		Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).



	~~==Sputtering of TiW==~~

	* [[/Sputtering of TiW in Wordentec\|Sputtering of TiW in Wordentec]]		* [[/Sputtering of TiW in Wordentec\|Sputtering of TiW in Wordentec]]

Reet: /* Deposited film characteristics */

2020-03-19T10:37:02Z

Deposited film characteristics

← Older revision		Revision as of 12:37, 19 March 2020
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	\| TiW alloy: 10%/90% by weight		\| TiW alloy: 10%/90% by weight
	\|}		\|}


	~~==Deposited film characteristics==~~

	~~AFM pictures show how the surface roughness is dependent on the process parameters.~~

	For the sputter process, the effect and argon pressure can be set to different values. Depending on the process parameters, the deposited layers will have different characteristics: the roughness, grain size and uniformity may be differnt.


	~~'''Effect 150 W, pressure 1*10<sup>-3</sup> mbar'''~~

	~~With use of the settings 150W and 1*10<sup>-3</sup> mbar, a surface with low roughness is deposited.~~

	~~[[Image:Tiw 150W 0 001 nr2.jpg\|480x480px\|center\|thumb\|AFM picture of sputter deposited TiW. Used settings: 150W and 1*10<sup>-3</sup> mbar.]]~~


	~~''Measurement done September 2008, KNIL.''~~

Reet: /* Deposited rates */

2020-03-19T10:33:04Z

Deposited rates

← Older revision		Revision as of 12:33, 19 March 2020
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	\| TiW alloy: 10%/90% by weight		\| TiW alloy: 10%/90% by weight
	\|}		\|}


	~~==Deposited rates==~~

	Depening on the settings (pressure and effect) during the sputtering process, the roughness and grain size of the deposited layer can be different. The deposition rate will also change with different settings, as seen below.


	~~'''Pressure <math>1*10^{-3}</math> mbar, Effect 150 W'''~~

	~~The rate is established to be '''0.9 '''Å/s (in the center of the 4" wafer, 0.7 Å/s at the edge).~~

	~~This corresponds to a deposition time of '''1 minute 55 seconds''' for deposition of '''10 nm'''.~~


	~~'''Pressure <math>1*10^{-2}</math> mbar, Effect 150 W'''~~

	~~The rate is established to be '''1.3 '''Å/s (in the center of the 4" wafer, 1.0 Å/s at the edge).~~

	~~This corresponds to a deposition time of '''1 min 16 seconds''' for deposition of '''10 nm'''.~~


	~~'''Pressure <math>1*10^{-2}</math> mbar, Effect 300 W'''~~

	~~The rate is established to be '''2.2 '''Å/s (in the center of the 4" wafer, 1.8 Å/s at the edge).~~

	~~This corresponds to a deposition time of '''45 seconds''' for deposition of '''10 nm'''.~~


	~~'''Pressure <math>5*10^{-2}</math> mbar, Effect 150 W'''~~

	~~The rate is established to be '''1.3''' Å/s (in the center of the 4" wafer, 1.0 Å/s at the edge).~~

	~~This corresponds to a deposition time of '''1 minute 15 seconds''' for deposition of '''10 nm'''.~~


	~~'''Pressure <math>5*10^{-2}</math> mbar, Effect 250 W'''~~

	~~The rate is established to be '''2.4''' Å/s (in the center of the 4" wafer, 1.6 Å/s at the edge).~~

	~~This corresponds to a deposition time of '''42 seconds''' for deposition of '''10 nm'''.~~


	~~''Deposition rates measured August-September 2008, KNIL.''~~

Reet at 10:32, 19 March 2020

2020-03-19T10:32:16Z

← Older revision		Revision as of 12:32, 19 March 2020
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php~~?title=~~Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW~~&action=edit~~ click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''


	Deposition of TiW alloy can be done in the Wordentec.		Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).

Reet at 10:22, 19 March 2020

2020-03-19T10:22:23Z

← Older revision		Revision as of 12:22, 19 March 2020
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	'''Feedback to this page''': '''[mailto:~~pvd~~@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&action=edit click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&action=edit click here]'''