Specific Process Knowledge/Thin film deposition/Deposition of Silver - Revision history

Reet: /* Comparison of Deposition Equipment for Silver */

2025-07-07T21:57:14Z

Comparison of Deposition Equipment for Silver

← Older revision		Revision as of 23:57, 7 July 2025
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	\|		\|
	*Up to 4x6" wafers or		*Up to 4x6" wafers or
	Up to 3x8" wafers ~~**~~ or		*Up to 3x8" wafers
			or
	*smaller pieces		*smaller pieces
	\|		\|
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	'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk''		'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk''

	~~'''***''' ''Please ask responsible staff for 8" wafer holder''~~

Reet: /* Comparison of Deposition Equipment for Silver */

2025-07-07T21:56:47Z

Comparison of Deposition Equipment for Silver

← Older revision		Revision as of 23:56, 7 July 2025
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	*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.		*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.
	\|		\|
	*Almost any as long as it does not outgas. See cross-contamination ~~sheets~~ in Labmanager.		*Almost any as long as it does not outgas. See cross-contamination sheet in Labmanager.
	\|		\|
	*Almost any ~~as long as it does~~ not ~~outgas~~. See cross-contamination ~~sheets in Labmanager.~~		* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
	\|		\|
	*Almost any ~~as long as it~~ does not ~~outgas if you plan to use~~ substrate ~~heating~~. See cross-contamination sheets ~~in Labmanager~~.		*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
	\|-style="background:whitesmoke; color:black"		\|-style="background:whitesmoke; color:black"
	! Comment		! Comment

Reet: /* Thermal deposition of Silver */

2025-06-18T09:56:07Z

Thermal deposition of Silver

← Older revision		Revision as of 11:56, 18 June 2025
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	* [[Specific Process Knowledge/Thin film deposition/Lesker \|Sputter deposition of Silver in Lesker]].		* [[Specific Process Knowledge/Thin film deposition/Lesker \|Sputter deposition of Silver in Lesker]].

	== Thermal deposition of ~~Silver~~ ==		== Thermal deposition of silver ==
	* [[/Deposition of Silver in Thermal Evaporator\|Thermal deposition of Silver in the Thermal Evaporator]]		* [[/Deposition of Silver in Thermal Evaporator\|Thermal deposition of Silver in the Thermal Evaporator]]
	<br>		<br>

Reet: /* Sputter deposition of Silver */

2025-06-18T09:56:02Z

Sputter deposition of Silver

← Older revision		Revision as of 11:56, 18 June 2025
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	Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.		Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.

	== Sputter deposition of ~~Silver~~ ==		== Sputter deposition of silver ==

	* [[Specific Process Knowledge/Thin film deposition/Lesker \|Sputter deposition of Silver in Lesker]].		* [[Specific Process Knowledge/Thin film deposition/Lesker \|Sputter deposition of Silver in Lesker]].


	== Thermal deposition of Silver ==		== Thermal deposition of Silver ==

Reet: /* Deposition of Silver */

2025-06-18T09:55:56Z

Deposition of Silver

← Older revision		Revision as of 11:55, 18 June 2025
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	<br clear="all" />		<br clear="all" />

	== Deposition of ~~Silver~~ ==		== Deposition of silver ==
	Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.		Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.



	== Sputter deposition of Silver ==		== Sputter deposition of Silver ==

Mmat: /* Thermal deposition of Silver */

2025-06-10T14:54:49Z

Thermal deposition of Silver

← Older revision		Revision as of 16:54, 10 June 2025
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	== Thermal deposition of Silver ==		== Thermal deposition of Silver ==

	* [[/Deposition of Silver\|Thermal deposition of Silver in Wordentec]]

	* [[/Deposition of Silver in Thermal Evaporator\|Thermal deposition of Silver in the Thermal Evaporator]]		* [[/Deposition of Silver in Thermal Evaporator\|Thermal deposition of Silver in the Thermal Evaporator]]
	<br>		<br>
	<br>		<br>

	==Comparison of Deposition Equipment for Silver==		==Comparison of Deposition Equipment for Silver==
	{\| border="1" cellspacing="0" cellpadding="4"		{\| border="1" cellspacing="0" cellpadding="4"

Mmat at 14:54, 10 June 2025

2025-06-10T14:54:16Z

← Older revision		Revision as of 16:54, 10 June 2025
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	* [[/Deposition of Silver in Thermal Evaporator\|Thermal deposition of Silver in the Thermal Evaporator]]		* [[/Deposition of Silver in Thermal Evaporator\|Thermal deposition of Silver in the Thermal Evaporator]]
			<br>
	==Comparison of ~~deposition equipment~~ for ~~silver~~==		<br>
			==Comparison of Deposition Equipment for Silver==
	{\| border="1" cellspacing="0" cellpadding="4"		{\| border="1" cellspacing="0" cellpadding="4"
	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"

Mmat at 14:53, 10 June 2025

2025-06-10T14:53:50Z

← Older revision		Revision as of 16:53, 10 June 2025
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	== Sputter deposition of Silver ==		== Sputter deposition of Silver ==

	* [[/~~Sputter Ag in Wordentec~~\|Sputter deposition of Silver in ~~Wordentec~~]].		* [[Specific Process Knowledge/Thin film deposition/Lesker \|Sputter deposition of Silver in Lesker]].


	== Thermal deposition of Silver ==		== Thermal deposition of Silver ==

Mmat: /* Comparison of deposition equipment for silver */

2025-06-10T14:46:07Z

Comparison of deposition equipment for silver

← Older revision		Revision as of 16:46, 10 June 2025
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	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal Evaporator]])		! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal Evaporator]])
	~~! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])~~
	~~! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])~~
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
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	\| E-beam deposition of Ag (line-of-sight, very good thickness uniformity)		\| E-beam deposition of Ag (line-of-sight, very good thickness uniformity)
	\| Thermal deposition of Ag (line-of-sight)		\| Thermal deposition of Ag (line-of-sight)
	~~\| Thermal deposition of Ag (line-of-sight, good thickness uniformity)~~
	~~\| Sputter deposition of Ag (some step coverage, should have good uniformity)~~
	\| Sputter deposition of Ag (some step coverage)		\| Sputter deposition of Ag (some step coverage)
	\| Sputter deposition of Ag including pulsed DC and HiPIMS		\| Sputter deposition of Ag including pulsed DC and HiPIMS
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	! Pre-clean		! Pre-clean
	\| Ar ion etch (only in E-beam evaporator Temescal)		\| Ar ion etch (only in E-beam evaporator Temescal)
	~~\| none~~
	~~\| none~~
	\| none		\| none
	\| RF Ar clean		\| RF Ar clean
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	\|10Å to 1µm*		\|10Å to 1µm*
	\|10Å to 0.5µm **		\|10Å to 0.5µm **
	~~\|10Å to 0.5µm **(0.5µm not on all wafers)~~
	~~\|10Å to about 3000Å~~
	\|10Å to about 2000Å		\|10Å to about 2000Å
	\|10Å to ?		\|10Å to ?
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	\|1 to 10Å/s		\|1 to 10Å/s
	\|5Å/s		\|5Å/s
	~~\|1 to 10Å/s~~
	~~\|Depending on [[/Sputter Ag in Wordentec\|process parameters]] (also written in the logbook).~~
	\|Dependent on process parameters.		\|Dependent on process parameters.
	\|Dependent on process parameters.		\|Dependent on process parameters.
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	*Up to 3x4" wafers		*Up to 3x4" wafers
	*smaller pieces		*smaller pieces
	\|
	*6x6" wafers or
	*6x4" wafers or
	*24x2" wafers
	\|
	*6x6" wafers or
	*6x4" wafers or
	*24x2" wafers

	\|		\|
	*1x6" wafers or		*1x6" wafers or
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	\|		\|
	*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.		*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.
	\|
	*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
	\|
	*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
	\|		\|
	*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.		*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
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	\| Pumpdown approx 20 min. Possible to tilt the wafer to achieve tunable step coverage.		\| Pumpdown approx 20 min. Possible to tilt the wafer to achieve tunable step coverage.
	\| Pumpdown approx 15 min.		\| Pumpdown approx 15 min.
	~~\| Only very thin layers. Pumpdown approx 1.5 hours.~~
	~~\| Pumpdown approx. 1.5 hours~~
	\|Load and transfer < 10 minutes		\|Load and transfer < 10 minutes
	\|Load and transfer approx. 12 minutes		\|Load and transfer approx. 12 minutes

Reet: /* Comparison of deposition equipment for silver */

2024-01-22T13:58:32Z

Comparison of deposition equipment for silver

← Older revision		Revision as of 15:58, 22 January 2024
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	\| Thermal deposition of Ag (line-of-sight)		\| Thermal deposition of Ag (line-of-sight)
	\| Thermal deposition of Ag (line-of-sight, good thickness uniformity)		\| Thermal deposition of Ag (line-of-sight, good thickness uniformity)
	\| Sputter deposition of Ag (some step coverage)		\| Sputter deposition of Ag (some step coverage, should have good uniformity)
	\| Sputter deposition of Ag (some step coverage)		\| Sputter deposition of Ag (some step coverage)
	\| Sputter deposition of Ag including pulsed DC and HiPIMS		\| Sputter deposition of Ag including pulsed DC and HiPIMS