Specific Process Knowledge/Thin film deposition/Deposition of Ruthenium - Revision history

Reet: /* Deposition of Ru */

2025-07-07T21:24:25Z

Deposition of Ru

← Older revision		Revision as of 23:24, 7 July 2025
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	\|'''Please contact the thin film group before depositing Ru, even if Ru is in the machine.'''		\|'''Please contact the thin film group before depositing Ru, even if Ru is in the machine.'''
	The current target material belongs to a specific customer.		The current target material belongs to a specific customer.

	Ru exhibits high stress as-deposited and has poor adhesion to Si with native oxide.		Ru exhibits high stress as-deposited and has poor adhesion to Si with native oxide.
	\|		\|

Reet: /* Deposition of Ru */

2025-07-07T21:24:08Z

Deposition of Ru

← Older revision		Revision as of 23:24, 7 July 2025
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|'''Please contact the thin film group before depositing Ru, even if Ru is in the machine.		\|'''Please contact the thin film group before depositing Ru, even if Ru is in the machine.'''
	The current target material belongs to a specific customer.~~'''~~		The current target material belongs to a specific customer.
			Ru exhibits high stress as-deposited and has poor adhesion to Si with native oxide.
	\|		\|
	\|}		\|}

Reet: /* Deposition of Ru */

2025-07-07T21:23:08Z

Deposition of Ru

← Older revision		Revision as of 23:23, 7 July 2025
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|Please contact the thin film group before depositing Ru, even if Ru is in the machine.		\|'''Please contact the thin film group before depositing Ru, even if Ru is in the machine.
	The current target material belongs to a specific customer.		The current target material belongs to a specific customer.'''
	\|		\|
	\|}		\|}

Eves at 16:06, 1 February 2023

2023-02-01T16:06:51Z

← Older revision		Revision as of 18:06, 1 February 2023
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			'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Ruthenium click here]'''

			<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


	== Deposition of Ru ==		== Deposition of Ru ==
	Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment:		Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment:

Paphol at 12:43, 14 September 2022

2022-09-14T12:43:25Z

← Older revision		Revision as of 14:43, 14 September 2022
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	\|}		\|}

	'''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@~~danchip~~.dtu.dk)''		'''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)''

	'''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@~~danchip~~.dtu.dk)''		'''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)''

Eves: /* Deposition of Ru */

2021-10-03T12:27:15Z

Deposition of Ru

← Older revision		Revision as of 14:27, 3 October 2021
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	== Deposition of Ru ==		== Deposition of Ru ==
	Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition ~~equipments~~:		Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment:

Reet: /* Deposition of Ru */

2018-08-29T11:49:20Z

Deposition of Ru

← Older revision		Revision as of 13:49, 29 August 2018
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|Please contact the thin film group before ~~you deposit~~ Ru, even if Ru is ~~present~~ in the machine.		\|Please contact the thin film group before depositing Ru, even if Ru is in the machine.
	The current target material belongs to a specific customer.		The current target material belongs to a specific customer.
	\|		\|

Reet: New page comparing Temescal and Lesker for Ruthenium dep. Before it was only Lesker

2018-08-29T11:48:14Z

New page comparing Temescal and Lesker for Ruthenium dep. Before it was only Lesker

New page

== Deposition of Ru ==
Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipments:

{| border="1" cellspacing="0" cellpadding="3"
|-style="background:silver; color:black"
!

! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
|-
|-style="background:WhiteSmoke; color:black"
! General description
|E-beam deposition of Ru
(line-of-sight deposition)
|Sputter deposition of Ru
(not line-of-sight deposition)

|-

|-style="background:LightGrey; color:black"

!Pre-clean
|Ar ion bombardment
|RF Ar clean

|-
|-style="background:WhiteSmoke; color:black"

!Layer thickness
|10Å to 1µm*
|10Å to 1µm**

|-
|-style="background:LightGrey; color:black"

! Deposition rate
|0.5Å/s to 10Å/s
| ~1Å/s
|-

|-style="background:WhiteSmoke; color:black"
! Batch size
|
*Up to 4x6" wafers
*Up to 3x8" wafers (ask for holder)
*smaller pieces
|
*smaller pieces
*Up to 1x6" wafers
|-

|-style="background:LightGrey; color:black"
!Allowed materials

|
*Silicon
*Silicon oxide
*Silicon (oxy)nitride
*Photoresist
*PMMA
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]

|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals

|-style="background:WhiteSmoke; color:black"
! Comment
|Please contact the thin film group before you deposit Ru, even if Ru is present in the machine.
The current target material belongs to a specific customer.
|
|}

'''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)''

'''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)''