Specific Process Knowledge/Thin film deposition/Deposition of Platinum - Revision history

Reet at 09:50, 23 June 2025

2025-06-23T09:50:07Z

← Older revision		Revision as of 11:50, 23 June 2025
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	!		!
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	~~! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])~~
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! General description		! General description
	~~\|E-beam deposition of Pt~~
	\|E-beam deposition of Pt		\|E-beam deposition of Pt
	\|Sputter deposition of Pt		\|Sputter deposition of Pt
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	\|Ar ion etch (only in E-beam evaporator Temescal)		\|Ar ion etch (only in E-beam evaporator Temescal)
	\|none		\|none
	~~\|RF Ar clean~~
	\|RF Ar clean		\|RF Ar clean

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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Layer thickness		! Layer thickness
	\|10Å - 600nm*
	\|10Å - 600nm*		\|10Å - 600nm*
	\|10Å - 600nm*		\|10Å - 600nm*
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Deposition rate		! Deposition rate
	~~\|0.5Å/s to 10Å/s~~
	\|0.5Å/s to 10Å/s		\|0.5Å/s to 10Å/s
	\|up to 3.74 Å/s		\|up to 3.74 Å/s
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	*Up to 3x8" wafers (ask for holder)		*Up to 3x8" wafers (ask for holder)
	*smaller wafers and pieces		*smaller wafers and pieces
	\|
	*24x2" wafers or
	*6x4" wafers or
	*6x6" wafers

	\|		\|
	*1x4" wafer or		*1x4" wafer or
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	\|		\|
	Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].		Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
	\|
	~~Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].~~
	\|		\|
	*Almost any that does not degas.		*Almost any that does not degas.
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	\| Pt tends to exhibit tensile stress, see section on [[Specific Process Knowledge/Characterization/Stress measurement\|stress in thin films]].		\| Pt tends to exhibit tensile stress, see section on [[Specific Process Knowledge/Characterization/Stress measurement\|stress in thin films]].
	\|		\|
	\|
	\|		\|
	\|}		\|}

	'''*''' ''If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.''		'''*''' ''If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.''

Reet: /* Platinum deposition */

2024-01-22T11:42:15Z

Platinum deposition

← Older revision		Revision as of 13:42, 22 January 2024
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	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
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	! Pre-clean		! Pre-clean

	\|Ar ion ~~source~~
			\|Ar ion etch (only in E-beam evaporator Temescal)
	\|none		\|none
	\|RF Ar clean		\|RF Ar clean
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	\|-		\|-
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	!Allowed materials
			! Allowed materials
			\|
			Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
	\|		\|
	*Silicon oxide		Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
	*Silicon (oxy)nitride
	*Photoresist
	*PMMA
	*Mylar
	*Metals
	*See ~~also~~ the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=~~429~~ cross-contamination sheet]
	\|		\|
	* ~~Silicon~~		*Almost any that does not degas.
	* Silicon oxide
	* Silicon (oxy)nitride
	* Photoresist
	* PMMA
	* Mylar
	* SU-8
	* Metals

	\|		\|
	* ~~Silicon~~		*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
	* Silicon oxide
	* Silicon nitride
	* Silicon (oxy)nitride
	* Photoresist
	* PMMA
	* Mylar
	* SU-8
	* Metals
	* Carbon

	\| Almost any that does not ~~outgas~~

	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|		\| Pt tends to exhibit tensile stress, see section on [[Specific Process Knowledge/Characterization/Stress measurement\|stress in thin films]].
	\|		\|
	\|		\|

Reet at 12:31, 14 September 2023

2023-09-14T12:31:48Z

← Older revision		Revision as of 14:31, 14 September 2023
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	'''Feedback to this page''': '''[mailto:~~pvd~~@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php~~?title=~~Specific_Process_Knowledge/Thin_film_deposition/~~Deposition_of_Platinum~~ click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of__Platinum click here]'''

	<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>		<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
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	\|}		\|}

	'''*''' ''If depositing a total of more than 600 nm, please write to metal@~~danchip~~.dtu.dk well in advance to ensure that enough material is present.''		'''*''' ''If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.''

Reet at 09:22, 9 June 2023

2023-06-09T09:22:09Z

← Older revision		Revision as of 11:22, 9 June 2023
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	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
			! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	\|E-beam deposition of Pt		\|E-beam deposition of Pt
	\|E-beam deposition of Pt		\|E-beam deposition of Pt
			\|Sputter deposition of Pt
	\|Sputter deposition of Pt		\|Sputter deposition of Pt
	\|-		\|-
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	\|Ar ion source		\|Ar ion source
	\|none		\|none
			\|RF Ar clean
	\|RF Ar clean		\|RF Ar clean

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	\|10Å - 600nm*		\|10Å - 600nm*
	\|10Å - 600nm*		\|10Å - 600nm*
			\|10Å - ? ''discuss with staff''
	\|-		\|-
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
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	\|0.5Å/s to 10Å/s		\|0.5Å/s to 10Å/s
	\|up to 3.74 Å/s		\|up to 3.74 Å/s
			\|''not known yet, probably similar to 'old' Lesker system

	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	*1x6" wafer		*1x6" wafer
	*smaller pieces		*smaller pieces
			\|
			*Up to 10x4" or 6" wafers
			*Many smaller pieces
	\|-		\|-

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	* Metals		* Metals
	* Carbon		* Carbon

			\| Almost any that does not outgas

	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|
	\|		\|
	\|		\|
			\|
	\|		\|
	\|}		\|}

	'''*''' ''If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.''		'''*''' ''If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.''

Eves at 16:05, 1 February 2023

2023-02-01T16:05:01Z

← Older revision		Revision as of 18:05, 1 February 2023
Line 1:		Line 1:
	'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Platinum click here]'''		'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Platinum click here]'''

			<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

Eves: /* Platinum deposition */

2022-01-11T21:42:31Z

Platinum deposition

← Older revision		Revision as of 23:42, 11 January 2022
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	Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.		Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

	* [[Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)\|Deposition of Pt in Sputter System (Lesker)]]		* [[Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)\|Deposition of Platinum in Sputter System (Lesker)]]


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	\|0.5Å/s to 10Å/s		\|0.5Å/s to 10Å/s
	\|0.5Å/s to 10Å/s		\|0.5Å/s to 10Å/s
	\|~~? Å/s~~ to ? Å/s		\|up to 3.74 Å/s
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"

Eves: /* Platinum deposition */

2022-01-11T21:41:06Z

Platinum deposition

← Older revision		Revision as of 23:41, 11 January 2022
Line 4:		Line 4:
	==Platinum deposition ==		==Platinum deposition ==

	Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.		Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

			* [[Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)\|Deposition of Pt in Sputter System (Lesker)]]

Eves: /* Platinum deposition */

2021-10-03T12:26:08Z

Platinum deposition

← Older revision		Revision as of 14:26, 3 October 2021
Line 24:		Line 24:

	\|Ar ion source		\|Ar ion source
	\|~~RF Ar clean~~		\|none
	\|RF Ar clean		\|RF Ar clean

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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Layer thickness		! Layer thickness
	\|10Å - ~~1µm~~*		\|10Å - 600nm*
	\|10Å ~~to 5000Å~~*		\|10Å - 600nm*
	\|10Å ~~to 5000Å~~		\|10Å - 600nm*
	\|-		\|-
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Deposition rate		! Deposition rate
	\|0.5Å/s to 10Å/s		\|0.5Å/s to 10Å/s
	\|~~10Å~~/s to ~~15Å~~/s		\|0.5Å/s to 10Å/s
	\|? Å/s to ? Å/s		\|? Å/s to ? Å/s
	\|-		\|-

Eves: /* Platinum deposition */

2021-10-03T12:25:05Z

Platinum deposition

← Older revision		Revision as of 14:25, 3 October 2021
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\| ~~As of August 2018, Pt has not yet been deposited in the Temescal.~~		\|
	~~Please contact the Thin Film group to develop a process.~~
	\|		\|
	\|		\|

Eves: /* Platinum deposition */

2021-10-03T12:23:40Z

Platinum deposition

← Older revision		Revision as of 14:23, 3 October 2021
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	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])
	~~! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca\|Physimeca]])~~
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! General description		! General description
	~~\|E-beam deposition of Pt~~
	\|E-beam deposition of Pt		\|E-beam deposition of Pt
	\|E-beam deposition of Pt		\|E-beam deposition of Pt
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	\|Ar ion source		\|Ar ion source
	\|RF Ar clean		\|RF Ar clean
	\|
	\|RF Ar clean		\|RF Ar clean

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	\|10Å - 1µm*		\|10Å - 1µm*
	\|10Å to 5000Å*		\|10Å to 5000Å*
	~~\|10Å to 2000Å~~
	\|10Å to 5000Å		\|10Å to 5000Å
	\|-		\|-
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	\|0.5Å/s to 10Å/s		\|0.5Å/s to 10Å/s
	\|10Å/s to 15Å/s		\|10Å/s to 15Å/s
	~~\|10Å/s~~
	\|? Å/s to ? Å/s		\|? Å/s to ? Å/s
	\|-		\|-
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	*6x4" wafers or		*6x4" wafers or
	*6x6" wafers		*6x6" wafers
	\|
	*1x 2" wafer or
	*1x 4" wafers or
	*Several smaller pieces
	\|		\|
	*1x4" wafer or		*1x4" wafer or
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	* SU-8		* SU-8
	* Metals		* Metals
	\|
	* III-V materials
	* Silicon wafers
	* Quartz wafers
	* Pyrex wafers
	\|		\|
	* Silicon		* Silicon